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| Number | Title | Issue Date |
| 7791180 | Physical quantity sensor and lead frame used for same A lead frame made from a metallic thin plate, comprising: at least two stage portions on which a physical quantity sensor chip is mounted, and which have an area smaller than a mounting surface of the physical quantity sensor chip; a rectangular frame portion which ... | 09/07/2010 |
| 7745913 | Power semiconductor component with a power semiconductor chip and method for producing the same A power semiconductor component includes at least one power semiconductor chip and surface-mountable external contacts. The power semiconductor chip includes large-area contact areas on its top side and its rear side, which cover essentially the entire top side and ... | 06/29/2010 |
| 7439611 | Circuit board with auxiliary wiring configuration to suppress breakage during bonding process A circuit board including a flexible insulating substrate, a plurality of conductive wirings placed in line on the flexible insulating substrate, and bumps provided at end portions of the respective conductive wirings positioned in a region for mounting a semiconduc... | 10/21/2008 |
| 7425759 | Semiconductor chip assembly with bumped terminal and filler A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a filler, a connection joint that electrically connects the routing line and the pad, and an encapsulan... | 09/16/2008 |
| 7425756 | Semiconductor device and electronic device This invention provides a high frequency power module which is incorporated into a mobile phone and which incorporates high frequency portion analogue signal processing ICs including low noise amplifiers which amplify an extremely weak signal therein. A semiconducto... | 09/16/2008 |
| 7425470 | Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, at lea... | 09/16/2008 |
| 7420265 | Integrated circuit package system with integrated circuit support An integrated circuit package system including an integrated circuit die, a leadframe and an integrated circuit support. The integrated circuit support between the integrated circuit die and the leadframe with the electrical interconnects connected to the leadframe.... | 09/02/2008 |
| 7408242 | Carrier with reinforced leads that are to be connected to a chip This invention is directed to preventing deformation, breakage, and the like of leads in a semiconductor device, reducing the fraction of defects, and making the semiconductor device smaller and thinner. In order to accomplish these objects, in a carrier including a... | 08/05/2008 |
| 7361977 | Semiconductor assembly and packaging for high current and low inductance A device comprising a semiconductor chip (110) having a side edge (111) and a plurality of metal bond pads (120, 121) near the edge; the pads are aligned to form rows (130, 131) parallel to the edge. The device further includes a leadfram... | 04/22/2008 |
| 7352061 | Flexible core for enhancement of package interconnect reliability An IC package is disclosed that comprises a core region disposed between upper and lower build-up layer regions. In one embodiment, the core region comprises a low modulus material. In an alternative embodiment the core region comprises a medium modulus material. In... | 04/01/2008 |
| 7345356 | Optical package with double formed leadframe Packages for an optical integrated circuit die and a method for making such packages are disclosed. The package includes a die, a die pad, a plurality of lead fingers, and an encapsulating dielectric material. The downward second pad surface of the die pad bearing a... | 03/18/2008 |
| 7342299 | Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications Apparatus and methods are provided for integrally packaging antennas with semiconductor IC (integrated circuit) chips to provide highly-integrated and high-performance radio/wireless communications systems for millimeter wave applications including, e.g., voice comm... | 03/11/2008 |
| 7325303 | Three-dimensional flexible interposer A generally planar interposer having a plurality of interposer contact pads to contact a plurality of first contacts of a first electronic device on one side of the interposer, and a plurality of electrical connections between the interposer contact pads and a plura... | 02/05/2008 |
| 7319265 | Semiconductor chip assembly with precision-formed metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The metal ... | 01/15/2008 |
| 7307339 | Semiconductor device having curved leads offset from the center of bonding pads A semiconductor device including: a substrate on which a plurality of leads are formed; and a semiconductor chip mounted on the substrate in such a manner that a surface of the semiconductor chip having a plurality of electrodes faces the substrate. Each of the lead... | 12/11/2007 |
| 7304371 | Lead frame having a lead with a non-uniform width A lead frame may include a plurality of leads, each having a bonding portion electrically connected to a semiconductor chip and an attaching portion. A tape may be provided on the attaching portions of the leads. The attaching portion of each lead may have a width t... | 12/04/2007 |
| 7288833 | Stress-free lead frame The present invention relates to a stress-free lead frame (1) for a semiconductor. The stress-free lead frame (1) is provided with a stress-relief means (15) and an interlocking means (16) at the outer periphery. The stress-relief means (... | 10/30/2007 |
| 7274089 | Integrated circuit package system with adhesive restraint An integrated circuit package system including an integrated circuit die and a lead frame with a trenched die pad. The integrated circuit die is mounted to the trenched die pad. ... | 09/25/2007 |
| 7274092 | Semiconductor component and method of assembling the same A semiconductor component includes at least one semiconductor power switch, wherein a gate electrode and at least two source regions are disposed on the upper side of the semiconductor power switch. The component further includes a leadframe including a die pad and ... | 09/25/2007 |
| RE39854 | Lead frame chip scale package A method for producing chip scale IC packages includes the step of mounting a lead frame panel on a temporary support fixture in order to provide support and protection during the manufacturing process. An embodiment of the temporary support fixture includes a sheet... | 09/25/2007 |
| 7271036 | Leadframe alteration to direct compound flow into package A leadframe comprising a downset formed adjacent to an edge of the leadframe so as to direct the molding compound to flow evenly inside the mold cavity. The downset has an upward slope extending from the edge of the frame and levels off with the rest of the frame at... | 09/18/2007 |
| 7268304 | Microelectronic connection components having bondable wires A connection component for a semiconductor chip includes a substrate having a gap over which extends a plurality of parallel spaced apart leads. The ends of the leads are adhered to the substrate either by being bonded to contacts or being embedded in the substrate.... | 09/11/2007 |
| 7253508 | Semiconductor package with a flip chip on a solder-resist leadframe A semiconductor package includes a flip chip mounted on a plurality of leads and encapsulated by a molding compound. The upper surfaces of the leads includes a plurality of bump-bonding regions at the fan-in ends of the leads, and the lower surfaces of the leads inc... | 08/07/2007 |
| 7247931 | Semiconductor package and leadframe therefor having angled corners A leadframe for a semiconductor package is formed with an indentation on a bottom surface. A side of the indentation is used to form a mold-lock that assists in securing the leadframe to the encapsulation material of the semiconductor package. ... | 07/24/2007 |
| 7247520 | Microelectronic component assemblies and microelectronic component lead frame structures The present invention provides microelectronic component assemblies and lead frame structures that may be useful in such assemblies. For example, one such lead frame structure may include a set of leads extending in a first direction and a dam bar. Each of the leads... | 07/24/2007 |
| 7241680 | Electronic packaging using conductive interposer connector Formation of a plurality of conductive connectors of an integrated circuit package is described. The conductive connectors made with a conductive elastomer material and formed using an interposer that includes a plurality of the conductive connectors linked together... | 07/10/2007 |
| 7242077 | Leadframe with die pad A leadframe includes a die pad, a plurality of tie bars, a plurality of metal extrusions and a plurality of leads. The leads are arranged around the die pad. The tie bars are connected to the corners of the die pad, and the metal extrusions are connected to the side... | 07/10/2007 |
| 7239008 | Semiconductor apparatus and method for fabricating the same A semiconductor apparatus includes a semiconductor pellet having electrodes thereon; a plurality of lead terminals, which electrically connect the electrodes of the semiconductor pellet to terminals formed on a substrate; and a molding member, which is filled around... | 07/03/2007 |
| 7227198 | Half-bridge package A semiconductor package that includes two power semiconductor dies, such as power MOSFET dies, including vertical conduction MOSFETs, arranged in a half-bridge configuration is disclosed. The package may be mounted on a split conductive pad including two isolated di... | 06/05/2007 |
| 7208840 | Semiconductor module, electronic device and electronic equipment, and method for manufacturing semiconductor module First alignment marks are provided on a film substrate in a manner that they are located at positions offset from the disposed positions of second alignment marks provided on a semiconductor chip. The amount of expansion or contraction of the film substrate is obtai... | 04/24/2007 |
| 7196402 | Interconnections The present invention relates generally to permanent interconnections between electronic devices, such as integrated circuit packages, chips, wafers and printed circuit boards or substrates, or similar electronic devices. More particularly it relates to high-density... | 03/27/2007 |
| 7193299 | Conductor frame and housing for a radiation-emitting component, radiation-emitting component and display and/or illumination system using radiation-emitting components A leadframe for a surface-mountable radiation-emitting component, preferably a light-emitting diode component, having at least one chip connection region and at least one external connection strip. The leadframe is formed in planar fashion and a deformation element,... | 03/20/2007 |
| 7160121 | Stressed metal contact with enhanced lateral compliance An electrical interconnect structure that includes a spring portion that extends out of a plane. The electrical interconnect including curved regions to improve the lateral compliance of the interconnect. The curved region may be incorporated into a release region o... | 01/09/2007 |
| 7135760 | Moisture resistant integrated circuit leadframe package A leadframe for a semiconductor die includes signal leads, ground leads, and a die support holder for supporting the semiconductor die. The die support holder has opposite surfaces and side edges therebetween. The opposite die support holder surfaces are smaller in ... | 11/14/2006 |
| 7132741 | Semiconductor chip assembly with carved bumped terminal A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a metal filler, a connection joint that electrically connects the routing line and the pad, and an enca... | 11/07/2006 |
| 7132315 | Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the same An inventive leadframe includes an outer frame, a die pad, and a plurality of leads each having land portions and connections. The land portions each have an upper surface serving as a bonding pad to be connected with a metal wiring, and a lowermost part serving as ... | 11/07/2006 |
| 7129575 | Semiconductor chip assembly with bumped metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an enca... | 10/31/2006 |
| 7122401 | Area array type semiconductor package fabrication method An area array type semiconductor package includes a plurality of conductive media such as solder bumps or solder balls, attached to respective bond pads of a chip. The conductive media act as external output terminals. The chip is attached to a lead frame by a therm... | 10/17/2006 |
| 7119424 | Semiconductor device and method for manufacturing the same A semiconductor device (21) can include, e.g., a recessed portion (25) on the reverse surface (224) of an insulating resin (22) which is the mounting surface of the semiconductor device (21). Additionally, on the outer peripheral s... | 10/10/2006 |
| 7119423 | Semiconductor device and method of manufacturing the same, electronic module, and electronic instrument A semiconductor chip is mounted on the substrate so that the first group of electrodes faces the first group of leads and the second group of electrodes faces the second group of leads. The first group of leads extends in a direction away from the second group of el... | 10/10/2006 |
