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| Number | Title | Issue Date |
| 8106491 | Methods of forming stacked semiconductor devices with a leadframe and associated assemblies A device is disclosed which includes a first packaged integrated circuit device, a second packaged integrated circuit device positioned above the first packaged integrated circuit device and a plurality of planar conductive members conductively coupling the first an... | 01/31/2012 |
| 8097935 | Quad flat package A semiconductor package includes a leadframe having first and second level downset lead extensions, a quad flat nonleaded package (QFN) attached to the first level downset lead extension, and a flip chip die attached to the second level downset lead extension. Anoth... | 01/17/2012 |
| 8093693 | Integrated circuit package system with encapsulation lock An integrated circuit package system is provided including forming an external interconnect having a lead tip and a lead body, forming a recess in the lead body from a lead body top surface, connecting an integrated circuit die and the external interconnect, and mol... | 01/10/2012 |
| 8044495 | Metallic leadframes having laser-treated surfaces for improved adhesion to polymeric compounds A leadframe for the assembly of a semiconductor chip has regions (112) with an original smooth surface of glossy appearance and regions (113, 114, 210) of a frosty appearance with rough surface contours. The regions of rough surface contours include tw... | 10/25/2011 |
| 7960816 | Semiconductor package with passive device integration A system is provided for an integrated circuit package including a leadframe with a lead finger. A groove is in a lead finger for a conductive bonding agent and a passive device is in the groove to be held by the conductive bonding agent. ... | 06/14/2011 |
| 7923825 | Integrated circuit package An integrated circuit package is described that includes an integrated circuit die, a plurality of lower contact leads, and an insulating substrate positioned over the die and lower contact leads. The insulating substrate includes a plurality of electrically conduct... | 04/12/2011 |
| 7777309 | Amplifier chip mounted on a lead frame This invention provides a high frequency power module which is incorporated into a mobile phone and which incorporates high frequency portion analogue signal processing ICs including low noise amplifiers which amplify an extremely weak signal therein. A semiconducto... | 08/17/2010 |
| 7768103 | Tape distribution substrate having pattern for reducing EMI A tape distribution substrate comprises a plurality of distribution lines formed on a base film. In one embodiment, the distribution lines comprise data lines arranged in data line pairs, wherein each data line pair carries a data signal with two different polaritie... | 08/03/2010 |
| 7755175 | Multi-stack chip package with wired bonded chips A stack-type semiconductor device according to the present invention includes a circuit board with bonding pads; a first semiconductor chip which includes first electrode pads and is mounted on the circuit board; a second semiconductor chip which includes second ele... | 07/13/2010 |
| 7709937 | Method of manufacturing semiconductor device A semiconductor device which includes: a semiconductor chip with plural pads; a tab connected with the semiconductor chip; bus bars which are located outside of the semiconductor chip and connected with the tab; a sealing body which resin-seals the semiconductor chi... | 05/04/2010 |
| 7687892 | Quad flat package A semiconductor package includes a leadframe having first and second level downset lead extensions, a quad flat nonleaded package (QFN) attached to the first level downset lead extension, and a flip chip die attached to the second level downset lead extension. Anoth... | 03/30/2010 |
| 7667307 | Semiconductor device To actualize a reduction in the on-resistance of a small surface mounted package having a power MOSFET sealed therein. A silicon chip is mounted on a die pad portion integrated with leads configuring a drain lead. The silicon chip has, on the main surface thereof, a... | 02/23/2010 |
| 7612435 | Method of packaging integrated circuits A method of packaging an integrated circuit die having a plurality of I/O pads is described. The method includes positioning the die within a die attach area of a first leadframe that includes a plurality of first leads. The method also includes positioning a second... | 11/03/2009 |
| 7612436 | Packaged microelectronic devices with a lead frame Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged microelectronic device can include a support member and at least one die in a stacked configuration attached to the su... | 11/03/2009 |
| 7602052 | Semiconductor device To prevent a semiconductor device which can be made to be small even though a big-sized chip is used and in which a MOSFET having a low on-resistance can be formed, a semiconductor device according to the invention includes a resin package; at least two main leads t... | 10/13/2009 |
| 7443013 | Flexible substrate for package of die The present invention provides a flexible substrate for a package of a die which has an active surface and a plurality of first bond pads arranged in a form of a row and formed on the active surface. The flexible substrate includes a flexible insulating film and a p... | 10/28/2008 |
| 7425756 | Semiconductor device and electronic device This invention provides a high frequency power module which is incorporated into a mobile phone and which incorporates high frequency portion analogue signal processing ICs including low noise amplifiers which amplify an extremely weak signal therein. A semiconducto... | 09/16/2008 |
| 7408242 | Carrier with reinforced leads that are to be connected to a chip This invention is directed to preventing deformation, breakage, and the like of leads in a semiconductor device, reducing the fraction of defects, and making the semiconductor device smaller and thinner. In order to accomplish these objects, in a carrier including a... | 08/05/2008 |
| 7408204 | Flip-chip packaging structure for light emitting diode and method thereof A packaging structure and method for a light emitting diode is provided. The present invention uses flip-chip and eutectic bonding technology to attach a LED to a thermal and electrical conducting substrate. The flip-chip packaging structure comprises a thermal and ... | 08/05/2008 |
| 7405467 | Power module package structure A power module package structure is disclosed. The control circuits are fabricated on a circuit plate, instead of fabricating them directly on a main substrate. The fabrication cost is reduced because the size of the substrate is shrunk. Furthermore, the power chips... | 07/29/2008 |
| 7400002 | MOSFET package A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body con... | 07/15/2008 |
| 7394146 | MOSFET package A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body con... | 07/01/2008 |
| 7391101 | Semiconductor pressure sensor A semiconductor pressure sensor can reduce the damage of bonding wires to increase their life time even under an environment in which the temperature and pressure change rapidly and radically. The semiconductor pressure sensor includes a package (1) made of a... | 06/24/2008 |
| 7372142 | Vertical conduction power electronic device package and corresponding assembling method A vertical conduction power electronic device package and corresponding assembly method comprising at least a metal frame suitable to house at least a plate or first semiconductor die having at least a first and a second conduction terminal on respective opposed sid... | 05/13/2008 |
| 7364947 | Method for cutting lead terminal of package type electronic component In an electronic component comprising a semiconductor chip packaged in a molded part from which the lead terminals of the semiconductor chip project, a main cutting notch is formed on the obverse surface of each lead terminal before molding the molded part while lea... | 04/29/2008 |
| 7358617 | Bond pad for ball grid array package A device (100) and a method (200) for controlling resin bleed, the device comprising a substrate (105) having a surface (107), an integrated circuit (115) having a plurality of leads (120) extending therefrom, and an adhesiv... | 04/15/2008 |
| 7345357 | High density chip scale leadframe package and method of manufacturing the package An integrated circuit package having a die pad with a first face and a second face, a plurality of inner leads, and a plurality of sides between the first face and the second face. The plurality of inner leads is disposed substantially co-planer with and substantial... | 03/18/2008 |
| 7339257 | Semiconductor device in which semiconductor chip is mounted on lead frame A lead frame has a plurality of first inner leads having distal end portions and parallel to each other, and a plurality of second inner leads having distal end portions opposing the distal end portions of the first inner leads, longer than the first inner leads, an... | 03/04/2008 |
| 7339196 | Packaging of SMD light emitting diodes An SMD LED package with superior thermal dissipation capability is provided. The SMD LED package comprises a supporting block with circuit patterns and at least one LED attached to the supporting block. Wherein, circuit patterns of holes/vias, insulating layers, and... | 03/04/2008 |
| 7326594 | Connecting a plurality of bond pads and/or inner leads with a single bond wire An integrated circuit device comprising an integrated circuit die having a plurality of bond pads that are selectively connected to a plurality of inner leads of a leadframe. At least two bond pads are connected to at least one of the inner leads, and/or at least tw... | 02/05/2008 |
| 7323765 | Die attach paddle for mounting integrated circuit die An electrical package for an integrated circuit die which comprises a die-attach paddle for mounting the integrated circuit die. The die-attach paddle has at least one down-set area located on a periphery of the die-attach paddle. The down-set area has an upper surf... | 01/29/2008 |
| 7323366 | Manufacturing method of a semiconductor device A method of making a semiconductor device including a semiconductor chip having a plurality of pads, and a lead frame having a plurality of leads. Each of the plurality of leads has a mounting surface for mounting the semiconductor device, a wire connection surface ... | 01/29/2008 |
| 7309910 | Micro lead frame packages and methods of manufacturing the same A microelectronic package includes a microelectronic element having contacts, a dielectric element, at least a portion of the dielectric element extending beneath the microelectronic element, and a structure including portions of a lead frame. The structure includes... | 12/18/2007 |
| 7304371 | Lead frame having a lead with a non-uniform width A lead frame may include a plurality of leads, each having a bonding portion electrically connected to a semiconductor chip and an attaching portion. A tape may be provided on the attaching portions of the leads. The attaching portion of each lead may have a width t... | 12/04/2007 |
| 7291900 | Lead frame-based semiconductor device packages incorporating at least one land grid array package A lead frame-based semiconductor device package including at least one land grid array package. At least one semiconductor die is mounted to an interposer substrate, with bond pads of the semiconductor die connected to terminal pads on the same side of the interpose... | 11/06/2007 |
| 7286764 | Reconfigurable modulator-based optical add-and-drop multiplexer An optical add and drop multiplexer system comprising a first module for providing a first signal; a second module for providing a second signal; and a modulator for receiving a channel of the first signal at a first location, the first location configured to actuat... | 10/23/2007 |
| 7282785 | Surface mount type semiconductor device and lead frame structure thereof A surface mount type semiconductor device can be configured to include a pair of lead frames that are butted to each other with a spacing such that ends of the lead frames are opposite to each other. A bare chip can be mounted on a chip mount portion on one end side... | 10/16/2007 |
| 7280573 | Semiconductor laser unit and optical pickup device The semiconductor laser unit includes: a metal plate having a center portion wider than the remaining portions; a flexible substrate having a first opening; a substrate mounted on the center portion; a semiconductor laser placed on the substrate; a frame having a se... | 10/09/2007 |
| 7279780 | Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same A quad flat no-lead (QFN) grid array semiconductor package and method for making the same are provided. The package includes a semiconductor die and a lead frame having a plurality of conductive elements patterned in a grid-type array. A plurality of bond pads on th... | 10/09/2007 |
| 7274092 | Semiconductor component and method of assembling the same A semiconductor component includes at least one semiconductor power switch, wherein a gate electrode and at least two source regions are disposed on the upper side of the semiconductor power switch. The component further includes a leadframe including a die pad and ... | 09/25/2007 |
