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| Number | Title | Issue Date |
| 8030741 | Electronic device One embodiment provides a semiconductor assembly including a printed circuit board and a semiconductor package. The semiconductor package includes a lead frame having a die pad and a plurality of leads spaced from the die pad, a chip attached to the die pad on a fro... | 10/04/2011 |
| 7989931 | Integrated circuit package system with under paddle leadfingers An integrated circuit package system is provided including: forming a die paddle; forming an under paddle leadframe including lower leadfingers thereon; attaching the under paddle leadframe to the die paddle with the lower leadfingers extending under the die paddle;... | 08/02/2011 |
| 7948068 | Semiconductor device having a chip mounting portion and a plurality of suspending leads supporting the chip mounting portion and each suspension lead having a bent portion According to the method of manufacturing a semiconductor device, a lead frame is provided wherein the thickness of a tab-side end portion of a silver plating for wire connection formed on each suspending lead 1e is smaller than that of a silver plating... | 05/24/2011 |
| 7944031 | Leadframe-based chip scale semiconductor packages Chip scale semiconductor packages and methods for making and using the same are described. The chip scale semiconductor packages comprise a leadframe supporting a die that contains a discrete device. The chip scale semiconductor device also contains and an interconn... | 05/17/2011 |
| 7944032 | Integrated circuit package with molded insulation A variety of improved arrangements and processes for packaging integrated circuits are described. More particularly, methods of encapsulating dice in lead frame based IC packages are described that facilitate covering some portions of the bottom surface of the lead ... | 05/17/2011 |
| 7936053 | Integrated circuit package system with lead structures including a dummy tie bar An integrated circuit package system includes forming lead structures including a dummy tie bar having an intersection with an outer edge of the integrated circuit package system, and connecting an integrated circuit die to the lead structures. ... | 05/03/2011 |
| 7923824 | Microelectronic component assemblies and microelectronic component lead frame structures The present invention provides microelectronic component assemblies and lead frame structures that may be useful in such assemblies. For example, one such lead frame structure may include a set of leads extending in a first direction and a dam bar. Each of the leads... | 04/12/2011 |
| 7915719 | Semiconductor device A semiconductor device comprises: a first and second die pads arranged side by side; a plurality of inner leads arranged around the first and second die pads; first and second chips mounted on the first and second die pads; a bar provided between the first and secon... | 03/29/2011 |
| 7911040 | Integrated circuit package with improved connections An integrated circuit package system comprising: providing an integrated circuit die; forming a top paddle over the integrated circuit die wherein the top paddle has planar dimensions smaller than planar dimensions of the integrated circuit die; forming leads adjace... | 03/22/2011 |
| 7898067 | Pre-molded, clip-bonded multi-die semiconductor package Semiconductor packages that contain multiple dies and methods for making such packages are described. The semiconductor packages contain a leadframe with multiple dies and also contain a single premolded clip that connects the dies. The premolded clip connects the s... | 03/01/2011 |
| 7875963 | Semiconductor device including leadframe having power bars and increased I/O In accordance with the present invention, there is provided a semiconductor package (e.g., a QFP package) including a uniquely configured leadframe sized and configured to maximize the available number of exposed leads in the semiconductor package. More particularly... | 01/25/2011 |
| 7875962 | Package for a power semiconductor device A package for a semiconductor die includes a die attach pad that provides an attachment surface area for the semiconductor die, and tie bars connected to the die attach pad. The die attach pad is disposed in a first general plane and the tie bars are disposed in a s... | 01/25/2011 |
| 7847376 | Semiconductor device and manufacturing method of the same A semiconductor device of a multi-pin structure using a lead frame is provided. The semiconductor device comprises a tab having a chip supporting surface, the chip supporting surface whose dimension is smaller than a back surface of a semiconductor chip, a plurality... | 12/07/2010 |
| 7812430 | Leadframe and semiconductor package having downset baffle paddles A lead frame with downset baffle paddles and a semiconductor package utilizing the same are revealed. The lead frame primarily comprises a plurality of leads formed on a first plane, a baffle paddle formed on a second plane in parallel, and an internal tie bar forme... | 10/12/2010 |
| 7808087 | Leadframe IC packages having top and bottom integrated heat spreaders Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages is described. A die-up or die-down package includes first and second caps defining a cavity, an IC die, and a leadframe. The l... | 10/05/2010 |
| 7750444 | Lead-on-chip semiconductor package and leadframe for the package A LOC semiconductor package with the leadframe for the package is revealed. The LOC semiconductor package primarily comprises a plurality of leadframe's leads, at least a tie bar, a chip, and an encapsulant encapsulating the components mentioned above. Each lead has... | 07/06/2010 |
| 7737537 | Electronic device Embodiments provide an electronic device. The electronic device includes a leadframe having a first face that defines an island and multiple leads configured to communicate with a chip attached to the island, a first structure element separate from and coupled to a ... | 06/15/2010 |
| 7737538 | Semiconductor package A semiconductor package. The semiconductor package of the invention comprises: a substrate comprising at least one exposed area with photosensitive devices; a cover for isolating the exposed area from the external atmosphere, wherein one of either the substrate or t... | 06/15/2010 |
| 7723828 | Semiconductor package with leads on a chip having multi-row of bonding pads A LOC leadframe-based semiconductor package includes a chip with multiple rows of bonding pads. At least a bus bar is attached to the chip and is disposed between a first row of bonding pads and the fingers of the leads. A plurality of bonding wires electrically con... | 05/25/2010 |
| 7714419 | Integrated circuit package system with shielding An integrated circuit package system comprising: providing an elevated tiebar; forming a die paddle connected to the elevated tiebar; attaching an integrated circuit die over the die paddle adjacent the elevated tiebar; attaching a shield over the elevated tiebar an... | 05/11/2010 |
| 7714418 | Leadframe panel An improved leadframe panel suitable for use in packaging IC dice is described. The described leadframe panel is configured such that the amount of leadframe material that is removed during singulation of the leadframe panel is reduced. ... | 05/11/2010 |
| 7646083 | I/O connection scheme for QFN leadframe and package structures Methods, systems, and apparatuses for integrated circuit packages and lead frames are provided. A quad flat no-lead (QFN) package includes a plurality of peripherally positioned pins, a die-attach paddle, an integrated circuit die, and an encapsulating material. The... | 01/12/2010 |
| 7576418 | Lead frame structure and applications thereof A lead frame structure comprises a side rail, a first paddle, a second paddle, a plurality of leads, and an downset anchor bar. The first paddle is connected to the side rail via at least one first tie bar, and the second paddle is connected to the side rail via at ... | 08/18/2009 |
| 7550827 | Conductor frame for an electronic component and method for the production thereof Disclosed is a leadframe lot at least one electronic component, composing at least two electrical lead elements, each of which comprises at least one electrical lead tab and at least one retention tab. Provided between the at least one retention tab and the lead ele... | 06/23/2009 |
| 7498665 | Integrated circuit leadless package system An integrated circuit leadless package system is presented comprising forming a QFN leadframe comprises providing a die pad, forming a fishtail tie-bar on the die pad, forming a row of an outer contact pad around the die pad, forming an additional outer contact pad ... | 03/03/2009 |
| 7429500 | Method of manufacturing a semiconductor device According to the method of manufacturing a semiconductor device, a lead frame is provided wherein the thickness of a tab-side end portion of a silver plating for wire connection formed on each suspending lead 1e is smaller than that of a silver plating... | 09/30/2008 |
| 7420265 | Integrated circuit package system with integrated circuit support An integrated circuit package system including an integrated circuit die, a leadframe and an integrated circuit support. The integrated circuit support between the integrated circuit die and the leadframe with the electrical interconnects connected to the leadframe.... | 09/02/2008 |
| 7414302 | Flashless lead frame with horizontal singulation A lead frame is configured for use with a singulation apparatus that eliminates flash. A die pad is attached to sides of the frame by tie bars and peripheral portions. The peripheral portions have cutout sections defining openings that are bridged by lead frame segm... | 08/19/2008 |
| 7408242 | Carrier with reinforced leads that are to be connected to a chip This invention is directed to preventing deformation, breakage, and the like of leads in a semiconductor device, reducing the fraction of defects, and making the semiconductor device smaller and thinner. In order to accomplish these objects, in a carrier including a... | 08/05/2008 |
| 7397113 | Semiconductor device A semiconductor device includes: a semiconductor element; a die pad with the semiconductor element mounted thereon; a plurality of electrode terminals each having a connecting portion electrically connected with the semiconductor element; and a sealing resin for sea... | 07/08/2008 |
| 7388280 | Package stacking lead frame system The present invention provides a package stacking lead frame system comprising forming a lead frame interposer including a dual row of terminal leads positioned around a die attach pad, mounting a first die on the die attach pad, wherein the first die is connected t... | 06/17/2008 |
| 7388283 | Method and device for integrating an illumination source and detector into the same IC package that allows angular illumination with a common planar leadframe An optical navigation device includes an integrated package. The integrated package includes a planar leadframe, a light source die mounted on the leadframe, and a sensor die mounted on the leadframe to be coplanar with the light source die. The integrated package m... | 06/17/2008 |
| 7378721 | Chip on lead frame for small package speed sensor A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical compone... | 05/27/2008 |
| 7368807 | Low cost method to produce high volume lead frames A method (300) for fabricating a lead frame (100), comprising forming a plurality of external leads (122) in a lead frame material (108), plating a metal (222) on all surfaces of the lead frame material (108), and subsequent... | 05/06/2008 |
| 7361533 | Stacked embedded leadframe A method of forming a stackable embedded leadframe package includes coupling an electronic component having bond pads to a substrate; coupling on the substrate a leadframe having a plurality of leads, each lead having a lower mounting portion; encapsulating the elec... | 04/22/2008 |
| 7361983 | Semiconductor device and semiconductor assembly module with a gap-controlling lead structure In a semiconductor device (1), semiconductor elements (2) and (3) are mounted on a lead frame (5) having leads (4). The semiconductor elements (2) and (3) are connected with the leads (4) by metallic wires (... | 04/22/2008 |
| 7354804 | Method for fabricating lead frame and method of fabricating semiconductor device using the same A method of fabricating a lead frame for a semiconductor device. The lead frame has a lead electrically connected to a semiconductor chip within sealing resin and sealed into the sealing resin such that at least a part of its lower surface is exposed from a lower su... | 04/08/2008 |
| 7351612 | Method for fabricating quad flat non-leaded package The present invention discloses a method for fabricating a quad flat non-leaded package. A lead frame is disposed on a lower mold equipped with a resilient film. The lead frame includes at least a package unit comprising a chip pedestal and a plurality of pins spati... | 04/01/2008 |
| 7345357 | High density chip scale leadframe package and method of manufacturing the package An integrated circuit package having a die pad with a first face and a second face, a plurality of inner leads, and a plurality of sides between the first face and the second face. The plurality of inner leads is disposed substantially co-planer with and substantial... | 03/18/2008 |
| 7342297 | Sawn power package In one embodiment of the invention, a lead-frame is designed for use in IC packages such as those conforming to the TO 220 standard or other standards for power packages. The device areas of the lead-frame are arranged in columns, and each column is molded so as to ... | 03/11/2008 |
