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| Number | Title | Issue Date |
| 8178955 | Semiconductor device A semiconductor device includes: a semiconductor element; a die pad with the semiconductor element mounted thereon; a plurality of electrode terminals each having a connecting portion electrically connected with the semiconductor element; and a sealing resin for sea... | 05/15/2012 |
| 8097934 | Delamination resistant device package having low moisture sensitivity A lead frame and package construction configured to attain a thin profile and low moisture sensitivity. Lead frames of this invention may include a die attach pad having a die attachment site and an elongate ground lead that extends from the die attach pad. The lead... | 01/17/2012 |
| 8035205 | Molding compound flow controller A semiconductor package can comprise a die stack attached to a substrate, with bond wires electrically connecting the two. Often multiple die stacks are adhered to a single substrate so that several semiconductor packages can be manufactured at once. A molding compo... | 10/11/2011 |
| 8008756 | Heat dissipating wiring board and method for manufacturing same A heat dissipating wiring board includes a metal wiring plate with a circuit pattern formed therein, a filler containing resin layer embedded with the metal wiring plate such that a top surface of the metal wiring plate is exposed, and a heat dissipating plate arran... | 08/30/2011 |
| 7915717 | Plastic image sensor packaging for image sensors A package for an image sensor includes a lead frame having a first surface and a second surface opposite the first surface; an image sensor mounted on the first surface of the lead frame; an optical cover spanning the first surface; and a plastic, optically transpar... | 03/29/2011 |
| 7884453 | Semiconductor device and manufacturing method thereof The present invention relates to a semiconductor device including a semiconductor chip encapsulated by an encapsulation resin and a manufacturing method thereof, and an object of the invention is to provide the semiconductor chip and its manufacturing method in whic... | 02/08/2011 |
| 7880276 | Wiring board and semiconductor device A wiring board where an electronic component is mounted on a main surface via a bump and at least a part of the periphery of the electronic component is covered with resin, the wiring board includes a dam provided at least at a part of the periphery of an area where... | 02/01/2011 |
| 7843043 | Structure of a lead-frame matrix of photoelectron devices A structure of a lead-frame matrix of photoelectron devices is provided. The lead-frame matrix is used to fabricate a first lead-frame array and a second lead-frame array. In the structure of the lead-frame matrix of the photoelectron devices, pins of the first lead... | 11/30/2010 |
| 7834432 | Chip package having asymmetric molding A chip package having asymmetric molding includes a lead frame, a chip, an adhesive layer, bonding wires and a molding compound. The lead frame includes a turbulent plate and a frame body having inner lead portions and outer lead portions. The turbulent plate is ben... | 11/16/2010 |
| 7834431 | Leadframe for packaged electronic device with enhanced mold locking capability A packaged electronic device (20) includes a die pad (30), leads (32) arranged around the die pad (30), and a die (24) attached to an upper surface (34) of the die pad (30) and electrically connected to the leads (... | 11/16/2010 |
| 7825498 | Semiconductor device A semiconductor device according to the present invention includes an island provided on one surface of a resin substrate, an external terminal provided on the other surface of the substrate, a thermal pad provided on the other surface of the substrate in opposed re... | 11/02/2010 |
| 7825499 | Semiconductor package and trenched semiconductor power device using the same A semiconductor package 60 in which a region where a land pad 18 is formed is provided on an outer side of a region in which a flip-chip connecting pad 16 is formed, wherein a protecting member 39 is formed to expose the land pad 18 | 11/02/2010 |
| 7808085 | Semiconductor device and mold for resin-molding semiconductor device A semiconductor device includes a pair of power chips, an IC chip, a plurality of leads one of which having a die pad on which the power chips are mounted and another one having a die attach portion on which the IC chip is mounted, a resin sheet firmly adhered to on... | 10/05/2010 |
| 7804161 | Semiconductor device and dam for resin The invention provides a semiconductor device including a rectangular chip provided on a mounting region of a substrate, a liquid resin layer provided under the rectangular chip and on a side surface of the chip, and a plurality of dams formed on the substrate so as... | 09/28/2010 |
| 7741704 | Leadframe and mold compound interlock in packaged semiconductor device An interference interlock between leadframe features and a mold compound is provided in a packaged semiconductor device by exposing at least one predetermined surface area to an etching process prior to a molding step. This produces an etched recess with a recessed ... | 06/22/2010 |
| 7566953 | Leadframe designs for plastic overmold packages The specification describes a plastic overmolded package for high power devices that has a very low lead count, typically fewer than eight, and in a preferred embodiment, only two. The leads occupy essentially the same linear space as the multiple leads in a convent... | 07/28/2009 |
| 7547960 | Structure of a lead-frame matrix of photoelectron devices A structure of a lead-frame matrix of photoelectron devices is provided. The lead-frame matrix is used to fabricate a first lead-frame array and a second lead-frame array. In the structure of the lead-frame matrix of the photoelectron devices, pins of the first lead... | 06/16/2009 |
| 7525180 | Semiconductor mount substrate, semiconductor device and method of manufacturing semiconductor package Segments formed on a wiring substrate are arranged in a staggered array, and tie bars are provided between the segments. ... | 04/28/2009 |
| 7508054 | Semiconductor device and a method of manufacturing the same Means for forming a package is disclosed on which is mounted a semiconductor chip with a high-speed LSI formed thereon, using a wire bonding method. The package comprises a semiconductor chip, a die pad smaller than a main surface of the semiconductor chip, a sealin... | 03/24/2009 |
| 7504714 | Chip package with asymmetric molding A chip package with asymmetric molding including a lead frame, a chip, an adhesive layer, bonding wires and an encapsulant, is provided. The lead frame includes a frame body and at least a turbulent plate. The frame body has inner lead portions and outer lead portio... | 03/17/2009 |
| 7449770 | Substrate with slot The invention relates to a substrate with slot. The substrate of the invention comprises an active surface and a plurality of metal plates. The metal plates are formed on the active surface. Each metal plate has a first surface and a second surface. The first surfac... | 11/11/2008 |
| 7446397 | Leadless semiconductor package A leadless semiconductor package includes a lead frame, an adhesive, a chip, a plurality of first electrically conductive wires and a plurality of second electrically conductive wires. In this case, the lead frame has a chip paddle, a plurality of leads surrounding ... | 11/04/2008 |
| 7443012 | Semiconductor device A method of manufacturing a semiconductor device includes the steps of, (1) preparing a conductive substrate having a main surface and a back surface opposite to the main surface, (2) forming at the main surface of the conductive substrate a plurality of first groov... | 10/28/2008 |
| 7436049 | Lead frame, semiconductor chip package using the lead frame, and method of manufacturing the semiconductor chip package A semiconductor chip package with a lead frame having a plurality of leads formed along four sides of the lead frame and tie bars extending from an edge of each of the four sides, wherein bottom surfaces of the tie bars are recessed, a semiconductor chip which is ad... | 10/14/2008 |
| 7423331 | Molded stiffener for thin substrates A stiffener molded to a semiconductor substrate, such as a lead frame, and methods of molding the stiffener to the substrate are provided. The stiffener is molded to the substrate to provide rigidity and support to the substrate. The stiffener material can comprise ... | 09/09/2008 |
| 7414301 | Printed circuit board with soldering lands The present invention provides a printed circuit board having an area of non-resist portion, where each non-resist portion expands gradually toward the back end of a land array in the dipping direction A. Thus the area of solder deposition also expands in the region... | 08/19/2008 |
| 7413933 | Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor A semiconductor including a leadframe having a die attach paddle and a number of leads is provided. The die attach paddle has a recess to provide a number of mold dams around the periphery of the die attach paddle. An integrated circuit is positioned in the recess. ... | 08/19/2008 |
| 7408242 | Carrier with reinforced leads that are to be connected to a chip This invention is directed to preventing deformation, breakage, and the like of leads in a semiconductor device, reducing the fraction of defects, and making the semiconductor device smaller and thinner. In order to accomplish these objects, in a carrier including a... | 08/05/2008 |
| 7394153 | Encapsulation of electronic devices An encapsulation for a device is disclosed. Spacer particles are randomly located in the device region to prevent a cap mounted on the substrate from contacting the active components, thereby protecting them from damage. The spacer particles are fixed to one side of... | 07/01/2008 |
| 7378300 | Integrated circuit package system An integrated circuit package system is provided including forming a leadframe structure having a encapsulant space provided predominantly inside the leadframe structure and attaching a die to the leadframe structure in the encapsulant space inside the leadframe str... | 05/27/2008 |
| 7378301 | Method for molding a small form factor digital memory card A method for molding digital storage memory cards such as, for example, multimedia cards (MMC), secure digital cards (SD), and similar small form factor digital memory cards. A PCA subassembly including, for example, a leadframe (TSOP) package for enclosing a flash ... | 05/27/2008 |
| 7371606 | Manufacturing method of a semiconductor device The yield of a sealing process for a semiconductor device which adopts a flip-chip mounting method is to be improved. In a molding process wherein plural semiconductor chip ICs mounted on a parts mounting surface of a substrate matrix through bump electrodes are to ... | 05/13/2008 |
| 7371971 | Wired circuit board and producing method thereof A wired circuit board that can provide improved reliability on connection between the terminal portions and the external terminals while ensuring high productivity and cost reduction, and a production method thereof. After a conductive pattern 3 including ter... | 05/13/2008 |
| 7372134 | Integrated circuit edge protection method and apparatus An apparatus, method, and system for providing a mechanical divider adapted to shield at least a portion of an active surface of an integrated circuit from out-gassing from underfill material. The mechanical divider is attached to a mounting substrate. The underfill... | 05/13/2008 |
| 7368323 | Semiconductor device and manufacturing method thereof A semiconductor device is provided which includes a first semiconductor chip, a substrate onto which the first semiconductor chip is flip-chip bonded and on which a concave is formed along one side of the first semiconductor chip which is flip-chip bonded, a second ... | 05/06/2008 |
| 7361533 | Stacked embedded leadframe A method of forming a stackable embedded leadframe package includes coupling an electronic component having bond pads to a substrate; coupling on the substrate a leadframe having a plurality of leads, each lead having a lower mounting portion; encapsulating the elec... | 04/22/2008 |
| 7358617 | Bond pad for ball grid array package A device (100) and a method (200) for controlling resin bleed, the device comprising a substrate (105) having a surface (107), an integrated circuit (115) having a plurality of leads (120) extending therefrom, and an adhesiv... | 04/15/2008 |
| 7351612 | Method for fabricating quad flat non-leaded package The present invention discloses a method for fabricating a quad flat non-leaded package. A lead frame is disposed on a lower mold equipped with a resilient film. The lead frame includes at least a package unit comprising a chip pedestal and a plurality of pins spati... | 04/01/2008 |
| 7348659 | Semiconductor device and method of manufacturing thereof A semiconductor chip is mounted on a tab, leads alternately arranged around the tab are electrically connected to electrodes of the semiconductor chip via bonding wires, and encapsulating resin encapsulates the semiconductor chip and bonding wires. The lower surface... | 03/25/2008 |
| 7348681 | Electronic component and manufacturing method of the electronic component In an electronic component in which a semiconductor device such as a light emitting diode is encapsulated by an encapsulation resin and a manufacturing method of the same, formation of flash on occasion of filling a resin is prevented. The semiconductor device (SIC)... | 03/25/2008 |
