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A method of swing on a swing is disclosed, in which a user positioned on a standard swing suspended by two chains from a substantially horizontal tree branch induces side to side motion by pulling alternately on one chain and then the other.
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| Number | Title | Issue Date |
| 8102036 | Semiconductor device in which a semiconductor chip is sealed A semiconductor device having a GaAsFET and input and output matching circuits connected to the FET is provided. In the semiconductor device, a line, including a wire connection portion connected to the input or output matching circuit and a lead connection portion ... | 01/24/2012 |
| 8013427 | Wiring board and electrical signal transmission system A wiring board equipped with differential lines which compensate for differences in via lengths to minimize signal deterioration is disclosed. Two conductors are couple to different substrate levels through vias of different lengths. Compensation means are provided ... | 09/06/2011 |
| 7989929 | Direct-connect signaling system A direct-connect signaling system including a printed circuit board and first and second integrated circuit packages disposed on the printed circuit board. A plurality of electric signal conductors extend between the first and second integrated circuit packages susp... | 08/02/2011 |
| 7944026 | Semiconductor device A semiconductor device is mounted on a package substrate which has a power supply line and a signal line formed of a normal or predetermined resistance material layer on a dielectric layer. A resistance material layer has a high resistance as compared with the norma... | 05/17/2011 |
| 7928539 | Semiconductor device A semiconductor device (1) includes a wiring (10) and dummy conductor patterns (20). The wiring (10) is a wiring through which a current with a frequency of 5 GHz or higher flows. Near the wiring (10), the dummy conductor patterns ... | 04/19/2011 |
| 7851895 | Semiconductor structure and semiconductor manufacturing method A semiconductor structure comprising a first signal layer, a second signal layer, a wiring layer and at least one via is provided. The wiring layer is formed between the first signal layer and the second signal layer. A conducting wire is disposed between a first te... | 12/14/2010 |
| 7777307 | High-frequency signal transmission circuit device A method for manufacturing a high-frequency signal transmission circuit includes the steps of forming a groove to surround a first region on a semiconductor substrate, filling the groove with a stopper material, forming a high-frequency transmission line on the semi... | 08/17/2010 |
| 7755174 | Integrated electronic components and methods of formation thereof Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated electronic components. The microstructures have particular applicability to d... | 07/13/2010 |
| 7671450 | Integrated circuit package for high-speed signals An integrated circuit package having a multi-segment transmission line transformer for impedance matching a packaged integrated circuit, such as a driver or receiver, to a printed circuit board (PCB) transmission line to which the packaged chip is attached by, for e... | 03/02/2010 |
| 7671449 | Structures and methods for an application of a flexible bridge One embodiment of the present invention provides a system that facilitates high-bandwidth communication using a flexible bridge. This system includes a chip with an active face upon which active circuitry and signal pads reside, and a second component with a surface... | 03/02/2010 |
| 7649245 | Structures and methods for a flexible bridge that enables high-bandwidth communication One embodiment of the present invention provides a system that facilitates high-bandwidth communication using a flexible bridge. This system includes a chip with an active face upon which active circuitry and signal pads reside, and a second component with a surface... | 01/19/2010 |
| 7646082 | Multi-layer circuit substrate and method having improved transmission line integrity and increased routing density A multi-layer circuit substrate and method having improved transmission line integrity and increased routing density uses a selectively applied transmission line reference plane metal layer to achieve signal path shielding and isolation, while avoiding drops in impe... | 01/12/2010 |
| 7605450 | High frequency arrangement A high frequency arrangement is provided that includes an integrated high frequency circuit, a first bond pad, which is electrically connected by a first electrical supply line, in particular a bond wire and/or a solder bump, to a housing terminal and/or another cir... | 10/20/2009 |
| 7595546 | Printed circuit board Impedance mismatching points such as a VIA and a connector on a differential line between a differential driver element and a differential receiver element are arranged in predetermined positions. That is, the impedance mismatching points are arranged in such positi... | 09/29/2009 |
| 7569916 | Separable network interconnect systems and assemblies Microelectronic assemblies interconnected using a separable network interface and electronic systems using the microelectronic assemblies to physically separate high performance signals and lower performance signals to enhance system performance are disclosed. ... | 08/04/2009 |
| 7504711 | Semiconductor substrate with strip conductors formed of carbon nanotubes and production thereof A substrate including strip conductors with a wiring pattern that connects contact areas to one another. The strip conductors have a small strip conductor width. The contact areas and/or the strip conductors form a narrow connection pitch and include electrically co... | 03/17/2009 |
| 7495318 | Apparatus and method for improving AC coupling on circuit boards The invention relates to an apparatus and method for improving AC coupling between adjacent signal traces and between plane splits and signals spanning plane splits on circuit boards. A circuit board includes adjacent conductive means and an oxide means interposed t... | 02/24/2009 |
| 7414299 | Semiconductor package assembly and method for electrically isolating modules A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394. ... | 08/19/2008 |
| 7411279 | Component interconnect with substrate shielding An example of a circuit structure may include a first dielectric layer having first and second surfaces, and a channel extending at least partially between the first and second surfaces and along a length of the first dielectric layer. First and second conductive la... | 08/12/2008 |
| 7391099 | Optical modulator module A high frequency substrate, on which a high frequency substrate transmission line for connecting a chip carrier transmission line and a package substrate transmission line is formed, is mounted while being inclined with respect to a package, so that each distance be... | 06/24/2008 |
| 7391637 | Semiconductor memory device with high permeability composite films to reduce noise in high speed interconnects A memory device is provided with a structure for improved transmission line operation on integrated circuits. The structure for transmission line operation includes a first layer of electrically conductive material on a substrate. A first layer of insulating materia... | 06/24/2008 |
| 7375414 | High permeability layered films to reduce noise in high speed interconnects This invention provides a structure and method for improved transmission line operation on integrated circuits. One method of the invention includes forming transmission lines in an integrated circuit. The method includes forming a first layer of electrically conduc... | 05/20/2008 |
| 7372160 | Barrier film deposition over metal for reduction in metal dishing after CMP A protective barrier layer, formed of a material such as titanium or titanium nitride for which removal by chemical mechanical polishing (CMP) is primarily mechanical rather than primarily chemical, formed on a conformal tungsten layer. During subsequent CMP to patt... | 05/13/2008 |
| 7372144 | High speed electronics interconnect and method of manufacture Fundamental interconnect systems for connecting high-speed electronics elements are provided. Interconnect system has the means, which could reduce the microwave loss by reducing the effective dielectric loss and dielectric constant of the interconnect system, and i... | 05/13/2008 |
| 7365415 | High frequency semiconductor device A semiconductor device has a mounting substrate and a semiconductor package mounted on the mounting substrate. The mounting substrate has a substrate body, input/output line conductors on the upper surface of the substrate body, a front-face grounding conductor on t... | 04/29/2008 |
| 7361975 | Semiconductor integrated circuit having reduced cross-talk noise A semiconductor integrated circuit, includes a shielded wire line and a shielding wire line provided for the shielded wire line and divided into a plurality of segments in a longitudinal direction of the shielded wire line. ... | 04/22/2008 |
| 7355282 | Post passivation interconnection process and structures A system and method for forming post passivation metal structures is described. Metal interconnections and high quality electrical components, such as inductors, transformers, capacitors, or resistors are formed on a layer of passivation, or on a thick layer of poly... | 04/08/2008 |
| 7352045 | Adhesion and/or encapsulation of silicon carbide-based semiconductor devices on ceramic substrates A SiC die with Os and/or W/WC/TiC contacts and metal conductors is encapsulated either alone or on a ceramic substrate using a borosilicate (BSG) glass that is formed at a temperature well below upper device operating temperature limits but serves as a stable protec... | 04/01/2008 |
| 7352059 | Low loss interconnect structure for use in microelectronic circuits A low loss on-die interconnect structure includes first and second differential signal lines on one of the metal layers of a microelectronic die. One or more traces may also be provided on another metal layer of the die that are non-parallel (e.g., orthogonal) to th... | 04/01/2008 |
| 7349196 | Composite distributed dielectric structure A composite distributed dielectric structure includes one or more conductor layers, one or more dielectric layers distributed on the conductor layers, and one or more conductor traces distributed on the dielectric layers. One or more dielectric plates can be further... | 03/25/2008 |
| 7339250 | Semiconductor integrated circuit having reduced cross-talk noise A semiconductor integrated circuit includes a shielded wire line and a shielding wire line provided for the shielded wire line and divided into a plurality of segments in a longitudinal direction of the shielded wire line. ... | 03/04/2008 |
| 7336221 | High frequency package, transmitting and receiving module and wireless equipment A multilayer dielectric substrate includes a first signal via, a second signal via, an internal-layer signal line, an internal-layer ground conductor, and ground vias. The first signal via is connected to a bias-and-control-signal terminal of a high-frequency semico... | 02/26/2008 |
| 7335968 | High permeability composite films to reduce noise in high speed interconnects A transmission line circuit provides a structure for improved transmission line operation on integrated circuits. The transmission line circuit includes a first layer of electrically conductive material on a substrate. A first layer of insulating material is formed ... | 02/26/2008 |
| 7329150 | Electrical connector An electrical connector, includes an insulating housing having a plurality of terminal receiving holes, and a plurality of conductive terminals received in the receiving holes respectively. The insulating housing has a metal layer for shielding the conductive termin... | 02/12/2008 |
| 7327016 | High permeability composite films to reduce noise in high speed interconnects An electronic system is provided with a structure for improved transmission line operation on integrated circuits. The structure for transmission line operation includes a first layer of electrically conductive material on a substrate. A first layer of insulating ma... | 02/05/2008 |
| 7327015 | Semiconductor device package A semiconductor device package includes a semiconductor device mounted to a substrate, a wall erected around the semiconductor device with a height taller than the height of the semiconductor device, at least one metal member provided in the wall or against the wall... | 02/05/2008 |
| 7321167 | Flex tape architecture for integrated circuit signal ingress/egress In an integrated circuit design, flex tape is used to provide signal ingress/egress to/from the integrated circuit design. Various architectures for the signal ingress/egress via flex tape is provided. In one embodiment, coaxial design is provided. In another embodi... | 01/22/2008 |
| 7312401 | Flexible printed wiring board A flexible printed wiring board includes a first conductor layer in the element mounting part adjacent to the top surface of the wiring board; a second conductor layer in the element mounting part adjacent to the bottom surface of the wiring board; and a third condu... | 12/25/2007 |
| 7312528 | Semiconductor device having antenna connection electrodes A semiconductor device includes first and second antenna connection electrodes placed on the periphery of a semiconductor chip, an on-chip antenna connection electrode placed in the inner area of the semiconductor chip compared to the first and second antenna connec... | 12/25/2007 |
| 7298046 | Semiconductor package having non-ceramic based window frame A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a plurality of leads mounted on the window frame and electrically coupled ... | 11/20/2007 |
