Celebrity Inventors
Glam girl Heddy Lamar may have used her good looks to good effect on the silver screen, but she put her smarts to better use as an inventor. During World War II, she co-patented a frequency-switching system for torpedo guidance that was considered years ahead of its time.
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| Number | Title | Issue Date |
| 8125059 | Semiconductor device A highly flexible semiconductor device of a stacked-type semiconductor device which transfers information by inductive coupling between inductors, in which LSI chips can be stacked even when a transmitter circuit and a receiver circuit are arranged at different posi... | 02/28/2012 |
| 8115283 | Reversible top/bottom MEMS package A semiconductor device has a base substrate having a plurality of metal traces and a plurality of base vias. An opening is formed through the base substrate. At least one die is attached to the first surface of the substrate and positioned over the opening. A cover ... | 02/14/2012 |
| 8102035 | Method of manufacturing a semiconductor device According to the method of manufacturing a semiconductor device, a lead frame is provided wherein the thickness of a tab-side end portion of a silver plating for wire connection formed on each suspending lead 1e is smaller than that of a silver plating... | 01/24/2012 |
| 8093690 | Chip package and manufacturing method thereof A chip package including a shielding layer having a plurality of conductive connectors for better electromagnetic interferences shielding is provided. The conductive connectors can be flexibly arranged within the molding compound for better shielding performance. Th... | 01/10/2012 |
| 8093691 | System and method for RF shielding of a semiconductor package A semiconductor device has a substrate having a plurality of metal traces. At least one electronic component is electrically coupled to a first surface of the substrate. A mold compound is used for encapsulating portions of the electronic component and the first sur... | 01/10/2012 |
| 8018034 | Semiconductor device and method of forming shielding layer after encapsulation and grounded through interconnect structure A semiconductor device has a substrate containing a conductive layer. An interconnect structure is formed over the substrate and electrically connected to the conductive layer. A semiconductor component is mounted to the substrate. An encapsulant is deposited over t... | 09/13/2011 |
| 7999362 | Method and apparatus for making semiconductor devices including a foil A method for manufacturing a semiconductor device including covering a portion of at least one semiconductor device with a foil, including covering at least one target region of the semiconductor device, and illuminating the foil with a laser to singulate from the f... | 08/16/2011 |
| 7968979 | Integrated circuit package system with conformal shielding and method of manufacture thereof An integrated circuit package system includes: providing a substrate with an integrated circuit mounted thereover; mounting a structure, having ground pads, over the integrated circuit; encapsulating the integrated circuit with an encapsulation while leaving the str... | 06/28/2011 |
| 7964938 | Semiconductor packages having electromagnetic interference-shielding function, manufacturing method thereof and jig The present invention relates to relates to a semiconductor package having a function of shielding electromagnetic interference (EMI), a manufacturing method thereof and a jig, and more particularly, to such a semiconductor package having an electromagnetic interfer... | 06/21/2011 |
| 7948065 | Integrated circuit having increased radiation hardness and reliability A system and method is disclosed for providing an integrated circuit that has increased radiation hardness and reliability. A device active area of an integrated circuit is provided and a layer of radiation resistant material is applied to the device active area of ... | 05/24/2011 |
| 7915715 | System and method to provide RF shielding for a MEMS microphone package A semiconductor package has a substrate. An opening is formed through the substrate. A first RF shield is formed around a perimeter of the opening. A first die is attached to the first surface of the substrate and positioned over the opening. ... | 03/29/2011 |
| 7902644 | Integrated circuit package system for electromagnetic isolation An integrated circuit package system comprising: providing a lead frame; forming an integrated circuit package including the lead frame; providing a selectively exposed area on the lead frame; and coating a conductive shielding layer on the integrated circuit packag... | 03/08/2011 |
| 7863714 | Monolithic MEMS and integrated circuit device having a barrier and method of fabricating the same An integrated circuit device includes a semiconductor die, the semiconductor die including a semiconductor substrate, driving/control circuitry disposed along a peripheral region of the semiconductor die, a MEMS device disposed within a central region of the semicon... | 01/04/2011 |
| 7843042 | Wafer level integration package A semiconductor package has a first conductive layer formed on a top surface of a substrate. A conductive via is formed between the first conductive layer and a bottom surface of the substrate. A semiconductor component is mounted to the substrate and electrically c... | 11/30/2010 |
| 7829981 | Semiconductor device packages with electromagnetic interference shielding Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit defining a cut-out portion disposed adjacent to a periphery of the substrate unit; (2) a groun... | 11/09/2010 |
| RE41668 | Seal ring structure for radio frequency integrated circuits Described is a method wherein a seal ring is formed by patterning multiple layers each comprised of a dielectric layer with conductive vias covered by a conductive layer. Discontinuities are made in the seal ring encapsulating an integrated circuit. There are no ove... | 09/14/2010 |
| 7781871 | Structure for reduction of soft error rates in integrated circuits A structure for reduction of soft error rates in integrated circuits. The structure including: a semiconductor substrate; and a stack of one or more wiring levels stacked from a lowermost wiring level to an uppermost wiring level, the lowermost wiring level nearer t... | 08/24/2010 |
| 7745911 | Semiconductor chip package A semiconductor chip package includes a main board; a ceramic substrate having a cavity within which at least one chip is electrically mounted, the cavity being placed at a lower portion of the ceramic substrate facing the main board; and a conductive shielding laye... | 06/29/2010 |
| 7626247 | Electronic package with integral electromagnetic radiation shield and methods related thereto A method and system for fabricating an electromagnetic radiation shield for an electronics package is disclosed. The electronics package includes a substrate, at least one ground contact feature, and a protective layer. The electronics package is physically coupled ... | 12/01/2009 |
| 7615850 | Method and device including reworkable alpha particle barrier and corrosion barrier A method and device comprising an easily reworkable alpha particle barrier is provided. The easily reworkable alpha particle barrier is applied in the space between the surface of the chip and the surface of the substrate, and reduces soft error rate (SER). Further,... | 11/10/2009 |
| 7582951 | Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages is described. A die-up or die-down package includes a heat spreader cap defining a cavity, an IC die, and a leadframe. The lea... | 09/01/2009 |
| 7470977 | Modular board device, high frequency module, and method of manufacturing same The present invention is directed to a high frequency module used for wireless communication module, and comprises a first organic substrate (11) in which conductive pattern or patterns are formed on the principal surface thereof and one element body (7 | 12/30/2008 |
| 7439621 | Radio frequency signal processing device The RF device of the present invention includes: a semiconductor substrate; and first and second semiconductor components provided on the substrate. Each of the components includes source electrodes, a gate electrode and a drain electrode. And multiple through holes... | 10/21/2008 |
| 7436055 | Packaging method of a plurality of chips stacked on each other and package structure thereof A package structure with a plurality of chips stacked on each other includes a substrate, a first chip and second chip. The substrate has a dielectric layer, a metal layer having a conducting trace area and a shielding area formed on the dielectric layer, and a sold... | 10/14/2008 |
| 7432593 | Semiconductor package assembly and method for electrically isolating modules A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394. ... | 10/07/2008 |
| 7427803 | Electromagnetic shielding using through-silicon vias An isolation structure for electromagnetic interference includes a semiconductor substrate, a first integrated circuit in the semiconductor substrate, a second integrated circuit in the semiconductor substrate, and an isolation structure in a direct path between the... | 09/23/2008 |
| 7405477 | Ball grid array package-to-board interconnect co-design apparatus A package-board co-design methodology preserves the signal integrity of high-speed signals passing from semiconductor packages to application PCBs. An optimal architecture of interconnects between package and PCB enhances the signal propagation, minimizes parasitic ... | 07/29/2008 |
| 7402893 | System and method for improved auto-boating According to one embodiment of the invention, a system used in auto-boating includes a tape substrate supported by a boat. The tape substrate includes a pair of lateral edges parallel to one another and each having respective first and second ends, and a pair of lon... | 07/22/2008 |
| 7396478 | Multiple internal seal ring micro-electro-mechanical system vacuum packaging method A Multiple Internal Seal Ring (MISR) Micro-Electro-Mechanical System (MEMS) vacuum packaging method that hermetically seals MEMS devices using MISR. The method bonds a capping plate having metal seal rings to a base plate having metal seal rings by wafer bonding the... | 07/08/2008 |
| 7397111 | Semiconductor wafer, an electronic component, and a component carrier for producing the electronic component An electronic component includes a semiconductor chip with a chip topside, an integrated circuit, and a chip backside. The chip backside includes a magnetic layer. The electronic component further includes a chip carrier with a magnetic layer on its carrier topside.... | 07/08/2008 |
| 7382046 | Semiconductor device protection cover, and semiconductor device unit including the cover A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the... | 06/03/2008 |
| 7382043 | Method and apparatus for shielding an integrated circuit from radiation A radiation shielding integrated circuit device comprising a x-ray shielding layer for shielding an electronic circuit device from receiving an amount of x-rays greater than the total dose tolerance of the electronic circuit device; a base coupled to the x-ray shiel... | 06/03/2008 |
| 7368815 | Semiconductor device which prevents light from entering therein A CSP type semiconductor device protects a circuit from the influences exerted by an external light on a circuit. In the CSP type semiconductor device, a light-shielding material, such as a silicone-based resin, an epoxy-based resin, or a metal, is deposited onto a ... | 05/06/2008 |
| 7364778 | Container for an electronic component A container for an electronic component made of a resin, wherein when the container and an electronic component contained in the container are rubbed 20,000 times, a static electrification voltage of at most 2,000V by the absolute value on the surface of the electro... | 04/29/2008 |
| 7362121 | Self-heating mechanism for duplicating microbump failure conditions in FPGAs and for logging failures A system replicates the rapid temperature increases that are believed to cause microbump failures in certain applications of programmable logic devices (PLDs). The system configures a PLD under test with a circuit that switches a large amount of current and generate... | 04/22/2008 |
| 7358532 | Electro-optical device and electronic apparatus An electro-optical device includes first switching elements which are correspondingly provided at intersections of a plurality of scanning lines and a plurality of data lines in a display region, at least three metal layers which are provided in the display region, ... | 04/15/2008 |
| 7345362 | Electronic component and method for manufacturing the same An electronic component, in which a chip can be mounted on a certain predetermined place of the package at a high accuracy level, which package having a stepped level-difference in the inner wall of a cavity. The package is provided with a stepped level-difference i... | 03/18/2008 |
| 7329846 | Electric range An electric range includes a circuit board provided with at least one semiconductor chip and adapted to control an electric current to be applied to an induction heating device, a heat sink to absorb heat of the semiconductor chip to discharge the heat to the outsid... | 02/12/2008 |
| 7327015 | Semiconductor device package A semiconductor device package includes a semiconductor device mounted to a substrate, a wall erected around the semiconductor device with a height taller than the height of the semiconductor device, at least one metal member provided in the wall or against the wall... | 02/05/2008 |
| 7304369 | Integral charge storage basement and wideband embedded decoupling structure for integrated circuit A capacitive structure and technique for allowing near-instantaneous charge transport and reliable, wide-band RF ground paths in integrated circuit devices such as integrated circuit dies, integrated circuit packages, printed circuit boards, and electronic circuit s... | 12/04/2007 |
