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An armor with rollers is provided that enables a user to move in all positions by rolling on a hard and smooth surface while constantly varying his bearing points on the ground.
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| Number | Title | Issue Date |
| 7560803 | Method for fabricating semiconductor device and apparatus for fabricating the same In a semiconductor-device fabrication method, a plurality of recessed portions are first formed in the principal surface of a substrate. Then, a through hole, passing through the substrate in the front-to-back direction of the substrate, is formed under a portion of... | 07/14/2009 |
| 7372142 | Vertical conduction power electronic device package and corresponding assembling method A vertical conduction power electronic device package and corresponding assembly method comprising at least a metal frame suitable to house at least a plate or first semiconductor die having at least a first and a second conduction terminal on respective opposed sid... | 05/13/2008 |
| 7228935 | Attachment pin for an exhaust-gas muffler The invention relates to an attachment pin (1) for fixing an exhaust-gas muffler (2) in an apparatus part (4) of a portable handheld work apparatus (5) driven by an internal combustion engine. The exhaust-gas muffler (2) includes e... | 06/12/2007 |
| 7211888 | Encapsulation of pin solder for maintaining accuracy in pin position Solder joints coupling pins to a microelectronic package substrate are enshrouded with an encapsulation material. In this manner, pin movement is limited even if the pin solder subsequently melts. ... | 05/01/2007 |
| 7200007 | Power stack A power stack includes cooling pipes and semiconductor modules which are alternately laminated. Each cooling pipe includes an inside space dissected into cooling passages in which coolant flows. Both surfaces of the semiconductor module in a laminating direction are... | 04/03/2007 |
| 7140929 | Electronic connector terminal, a method for plating, and a terminal stack An electronic connector terminal and its method of formation comprising a terminal base material 2 formed from a thin metal plate including and a high cost metal plating layer 17, which covers the terminal base material 2. The terminal base mate... | 11/28/2006 |
| 7138713 | Chip-type solid electrolytic capacitor and method of producing the same A chip-type solid electrolytic capacitor comprises capacitor elements. A cathode terminal comprising a plate-like conductor is interposed between cathode layers of the capacitor elements. The capacitor elements are bonded to each other by a bonding agent such as a s... | 11/21/2006 |
| 7061090 | Semiconductor device A semiconductor device comprises a semi-conductor chip bonded on a top surface inside a case electrode by a bonding material and a lead electrode bonded on a top surface of the semiconductor chip by a bonding material with a space of the case electrode filled with a... | 06/13/2006 |
| 7030476 | Rectifier diode device Disclosed is a rectifier diode device. The rectifier diode device includes a conductive base, a semiconductor chip, a conductive lead and insulation resin. A trench and a post are formed in the conductive base in order to increase a bonding surface between the condu... | 04/18/2006 |
| 7014092 | Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrate The present invention provides a bump forming apparatus which can prevent charge appearance semiconductor substrates from pyroelectric breakdown and physical failures, a method carried out by the bump forming apparatus for removing charge of charge appearance semico... | 03/21/2006 |
| 7002247 | Thermal interposer for thermal management of semiconductor devices A thermal interposer is provided for attachment to the back surface of a semiconductor device so as to give a very low thermal resistance. In one preferred embodiment, the thermal interposer has two plates containing wick structures such as grooves. The thermal inte... | 02/21/2006 |
| 6995486 | Electronic package for electrical machine An electronic package for an electrical machine preferably a rotary current generator includes a slip ring end (SRE) frame defining one end of a housing configured for mounting a rotor therein so as to be rotatable; a plurality of negative diodes dispersed in an ang... | 02/07/2006 |
| 6933588 | High performance SCR-like BJT ESD protection structure In a NPN transistor electrostatic discharge (ESD) protection structure, certain parameters, including maximum lattice temperature, are improved by introducing certain process changes to provide for SCR-like characteristics during ESD events. A p+region is formed adj... | 08/23/2005 |
| 6914276 | Molecular device, molecule array, rectifier device, rectifying method, sensor device, switching device, circuit device, logical circuit device, operational device and information processing device A rectifier device, based on a novel operation principle completely different from that of conventional molecular electronic devices, is made by coupling two or more molecules or molecule arrays (11) at certain joints. By making use of the phenomenon that tra... | 07/05/2005 |
| 6809418 | Integrated circuit package structure A reliable new IC package structure comprises an IC package having a plurality fo grounding conductor plates provided around its surrounding, a first conductor plate for covering over the IC package has downwardly flexed edges at its both sides to form two lugs, and... | 10/26/2004 |
| 6713937 | Minitab rectifier for alternators A diode for use in an under-the-hood automotive application has a TO 220 outline and consists of a diode die on a two piece lead frame which has a thick section to which the bottom of the die is soldered, and a thinner section which extends through a plastic housing... | 03/30/2004 |
| 6627975 | Minitab rectifying diode package with two different types of diodes for alternators A diode for use in an under-the-hood automotive application has a TO 220 outline and consists of a diode die on a two piece lead frame which has a thick section to which the bottom of the die is soldered, and a thinner section which extends through a plas... | 09/30/2003 |
| 6566721 | Semiconductor device It is intended to provide a semiconductor device in which a fuse required conventionally is omitted and an initial resistance value can be maintained even under stress imposed due to packaging or the like, a high-accuracy bleeder resistance circuit that c... | 05/20/2003 |
| 6331730 | Push-in type semiconductor device including heat spreader A push-in type semiconductor chip has a semiconductor device, a support electrode body bonded to one of the end portions of the semiconductor chip and supported by, and fixed to, a heat spreader at a support fixing portion thereof, a lead electrode body b... | 12/18/2001 |
| 6252258 | High power rectifier A high power rectifier device has an - drift layer on an N+ layer. A number of trench structures are recessed into the drift layer opposite the N+ layer; respective mesa regions separate each pair of trenches. Each trench structure includes oxide side-wal... | 06/26/2001 |
| 5886403 | Sealed rectifier A sealed rectifier used in a vehicle alternator is composed of a semiconductor diode chip, a base electrode having a disk plate which has a central mount for supporting the chip and an annular wall extending higher than the central mount, a pole electrode... | 03/23/1999 |
| 5821618 | Semiconductor component with insulating housing A semiconductor component includes an insulating housing. A plurality of sheet-metal mounting plates are disposed in one and the same plane and are electrically separated from one another in the housing. Semiconductor switches of a rectifier bridge are el... | 10/13/1998 |
| 5765280 | Method for making a carrier based IC packaging arrangement The present invention discloses the use of a dielectric substrate panel suitable for supporting a plurality of independently packaged ICs. The substrate panel has a plurality of conductive landings arranged on its top surface, a plurality of conductive co... | 06/16/1998 |
| 5512784 | Surge protector semiconductor subassembly for 3-lead transistor aotline package The subassembly of the present invention includes three pairs of aligned steering diodes and a single thyristor situated between spaced apart conductive heat sink plates. The subassembly is configured to fit into a standard 3-lead transistor outline packa... | 04/30/1996 |
| 4942139 | Method of fabricating a brazed glass pre-passivated chip rectifier A semiconductor device is fabricated by applying a glass layer of material over a junction area of a semiconductor die. Aluminum metalization layers are applied to the top and bottom of the die at locations spaced from the glass and are used for a high te... | 07/17/1990 |
| 4745315 | Brushless exciter with zero-gravity rectifier assembly A brushless exciter for a dynamoelectric machine includes a rectifier assembly disposed in a cylindrical cavity on an axis of the shaft of the dynamoelectric machine. The rectifier assembly is made up of a stack of generally circular heat-sink discs with ... | 05/17/1988 |
| 4628219 | Rectifier assembly for mounting in a rotor Disclosed is an improved rectifier assembly for use in a rotor of a dynamo electric machine which includes a tubular housing receiving a stack of plates sandwiching diode wafers between studs on certain of the plates and confined by annular ridges on othe... | 12/09/1986 |
| 4571669 | Transformer with rectifier A transformer with a rectifier is disclosed, wherein a transformer main body, having therein a primary coil and a secondary coil, is provided at its front surface with a secondary electrode plate connected to the secondary coil, and to secondary electrode... | 02/18/1986 |
| 4510672 | Process for making stacked high voltage rectifiers A process for making stacked high voltage rectifiers includes initially doping a plurality of silicon wafers with paint-on dopants applied with an applicator that is gradually moved from the center to the outer edge of each wafer while the wafer is periph... | 04/16/1985 |
| 4441150 | High-voltage rectifier unit A high voltage rectifier unit comprises a vessel filled with an electrically insulating fluid and accommodating a transformer having a sectionalized secondary winding, each section 7 of which is provided with a metallic shield and includes two coils 9, a ... | 04/03/1984 |
| 4429453 | Process for anodizing surface of gate contact of controlled rectifier having interdigitated gate and emitter contacts Coplanar interdigitated gate and emitter contacts are accessible at the surface of a large area wafer forming a high power, high speed controlled rectifier. A pressure contact is made to the emitter contact which is raised above the level of the gate cont... | 02/07/1984 |
| 4347543 | Rectifier circuit diode array and circuit protector In a rectifier circuit structure, particularly for automative use, a diode array is in the form of a column and includes a Zener diode in the column which serves to protect the rectifier diodes of the arrangement and to protect an electrical load system c... | 08/31/1982 |
| 4338652 | Stack module and stack loader therefor A packaged stack of flat electrical components is held under controlled pressure in its supporting frame by a stack loader calibrated for applying the exact force required for good thermal and electrical contact. The stack is lowered or raised in the supp... | 07/06/1982 |
| 4229680 | Lamp life extender A thin disc-like device for attachment to the base end of an incandescent light bulb to provide an auxiliary voltage reducing circuit interfaced between the central base contacts of the light bulb and its cooperating lampholder for purposes of extending t... | 10/21/1980 |
| 4169975 | Two-phase transformer and welding circuit therefor An apparatus for converting three-phase electrical energy into direct current includes Scott-connected transformers with oppositely biased SCRs connected in parallel to two of three input terminals. The SCRs are controlled so that they fire in alternate a... | 10/02/1979 |
| 4016483 | Microminiature integrated circuit impedance device including weighted elements and contactless switching means for fixing the impedance at a preselected value A microminiature terminal-adjustable integrated circuit impedance device comprising a substrate, a plurality of impedance elements formed on the substrate with each impedance element having an impedance, a first input terminal, an output terminal, a plura... | 04/05/1977 |
| 4007402 | Three phase full wave rectifier assembly A three phase full wave rectifier assembly includes first and second sub-assemblies each of which includes three semi-conductor diodes. In addition, each sub-assembly includes an electrically conductive heat sink the three diodes of the first sub-assembly... | 02/08/1977 |
| 3959676 | Alternator rectifier bridge and method of assembly An alternator rectifier assembly for rectifying the output of a poly-phase AC alternator and its method of assembly are disclosed. The alternator assembly comprises a pair of heat sinking DC terminal plate members having a plurality of diode containing re... | 05/25/1976 |
