Class 257/620 - With peripheral feature due to separation of smaller semiconductor chip from larger wafer (e.g., scribe region, or means to prevent edge effects such as leakage current at peripheral chip separation area)

Subclass of Class 257 - Active solid-state devices (e.g., transistors, solid-state diodes)
Definition: Subject matter wherein the physical configuration is at
No. of patents: 690
Last issue date: 05/29/2012

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Number	Title	Issue Date
8188575	Apparatus and method for uniform metal plating Apparatus and methods for uniform metal plating onto a semiconductor wafer, such as GaAs wafer, are disclosed. One such apparatus can include an anode and a showerhead body. The anode can include an anode post and a showerhead anode plate. The showerhead anode plate...	05/29/2012
8164164	Semiconductor wafer, and semiconductor device formed therefrom A semiconductor wafer has a substrate, and a plurality of active areas formed on the substrate. Integrated circuits are formed in the active areas. The semiconductor wafer also has dicing areas formed between the adjacent active areas. A seal ring is formed along th...	04/24/2012
8164163	Semiconductor device having sealing ring A semiconductor device includes: an interlayer insulating film formed on a substrate; a wiring formed in the interlayer insulating film in a chip region of the substrate; a seal ring formed in the interlayer insulating film in a periphery of the chip region and cont...	04/24/2012
8125053	Embedded scribe lane crack arrest structure for improved IC package reliability of plastic flip chip devices A system, method, and apparatus for suppressing cracks in the wafer dicing process. A wafer includes a plurality of die attached to a frame and mounting tape, with the die separated by a plurality of scribe lanes. An existing die seal generally protects the boundary...	02/28/2012
8125052	Seal ring structure with improved cracking protection An integrated circuit structure includes a semiconductor chip comprising a plurality of dielectric layers, wherein the plurality of dielectric layers includes a top dielectric layer; and a first seal ring adjacent edges of the semiconductor chip. The integrated circ...	02/28/2012
8125054	Semiconductor device having enhanced scribe and method for fabrication In a semiconductor device for use in a wafer level chip scale package (WLCSP) and a method for fabrication, an inner scribe seal is formed around a functional circuit area that does not extend all the way into the corners of the rectangular die, and an outer scribe ...	02/28/2012
8102027	IC package sacrificial structures for crack propagation confinement Systems and methods for preventing damage to a unit with preventive structures are presented. In an embodiment, a unit of a collection of units includes a functional area and a preventive structure configured to prevent cracks from propagating into the functional ar...	01/24/2012
8102028	Semiconductor component with marginal region A semiconductor component having a semiconductor body includes an active region and a marginal region surrounding the active region. The marginal region extends from the active region as far as an edge of the semiconductor body. A zone composed of porous material is...	01/24/2012
8076756	Structure for inhibiting back end of line damage from dicing and chip packaging interaction failures A semiconductor product comprises a semiconductor substrate having a top surface and a bottom surface including a semiconductor chip. The semiconductor substrate has a top surface and a perimeter. A barrier is formed in the chip within the perimeter. An Ultra Deep I...	12/13/2011
8067819	Semiconductor wafer including semiconductor chips divided by scribe line and process-monitor electrode pads formed on scribe line The present invention discloses a semiconductor wafer having a scribe line dividing the semiconductor wafer into a matrix of plural semiconductor chips. The semiconductor wafer includes a polysilicon layer, a poly-metal interlayer insulation film formed on the polys...	11/29/2011
8063468	Semiconductor device, method for manufacturing semiconductor device, and method for designing manufacturing semiconductor device A semiconductor device includes a semiconductor chip, a moisture resistant ring provided in the semiconductor chip and having a chamfered flat part in a position corresponding to a corner of the semiconductor chip, and a first monitor pattern formed inside the moist...	11/22/2011
8053868	Wafer level chip scale package of image sensor and manufacturing method thereof Provided are a wafer level chip scale package of an image sensor and a manufacturing method thereof. The wafer level chip scale package includes: a wafer including an image sensor and a pad on the top surface thereof and inclined surfaces on both ends thereof; expan...	11/08/2011
8053869	Package having exposed integrated circuit device A package (10) includes an integrated circuit device (12) having an electrically active surface (16) and an opposing backside surface (14). A dielectric molding resin (26) at least partially encapsulates the integrated circuit die ...	11/08/2011
8049309	Edge seal for a semiconductor device In one embodiment, an edge seal region of a semiconductor die is formed by forming a first dielectric layer on a surface of a semiconductor substrate near an edge of the semiconductor die and extending across into a scribe grid region of the semiconductor substrate....	11/01/2011
8035197	Electronic device and method for fabricating the same An electronic device has an element formed in the chip region of a substrate, a plurality of interlayer insulating films formed on the substrate, a wire formed in the interlayer insulating films in the chip region, and a plug formed in the interlayer insulating film...	10/11/2011
8022508	Semiconductor wafer A semiconductor wafer 10 has a plurality of semiconductor chip areas 10a and a scribe area 10b, each of the semiconductor chip areas 10a having semiconductor elements and electrode pads (electrode portions) 16	09/20/2011
8022509	Crack stopping structure and method for fabricating the same A crack stopping structure is disclosed. The crack stopping structure includes a semiconductor substrate having a die region, a die seal ring region, and a scribe line region; a metal interconnect structure disposed on the semiconductor substrate of the scribe line ...	09/20/2011
8018030	Semiconductor chip with seal ring and sacrificial corner pattern A semiconductor device according to the invention is a semiconductor device which includes a low dielectric constant film of which the relative dielectric constant is less than 3.5, is provided with one or more seal rings that are moisture blocking walls in closed l...	09/13/2011
8013425	Scribe line structure for wafer dicing and method of making the same The scribe line structure for wafer dicing according to the present invention includes a plurality of metal structures arranged up-and-down on a substrate in a dielectric layer, and an upper one of the metal structures has a lower metal density than a lower one of t...	09/06/2011
8008750	Crack stops for semiconductor devices Crack stops for semiconductor devices, semiconductor devices, and methods of manufacturing semiconductor devices are disclosed. In one embodiment, a barrier structure for a semiconductor device includes a plurality of substantially V-shaped regions. Each of the plur...	08/30/2011
8004066	Crack stop and moisture barrier A design for a crack stop and moisture barrier for a semiconductor device includes a plurality of discrete conductive features formed at the edge of an integrated circuit proximate a scribe line. The discrete conductive features may comprise a plurality of staggered...	08/23/2011
7994613	Semiconductor device and method for manufacturing the same A semiconductor device may include a chip including a chip including a silicon substrate having a semiconductor device area, a pad area and a scribe lane defining an outer contour of the chip. A semiconductor device may be formed in the semiconductor device area, an...	08/09/2011
7977770	Semiconductor device and method of manufacturing the same A method of manufacturing a semiconductor device includes: forming a first pad including a first metal and an inter-connection line including the first metal in a scribe lane region; forming a second pad including the first metal in a chip region; sequentially formi...	07/12/2011
7968974	Scribe seal connection A feedthrough in an IC scribe seal is disclosed. The feedthrough is structured to maintain isolation of components in the IC from mechanical damage and chemical impurities introduced during fabrication and assembly operations. A conductive structure penetrates the s...	06/28/2011
7960814	Stress relief of a semiconductor device A semiconductor device includes a die including an active region, a scribe region, and a perimeter, wherein the scribe region is closer to the perimeter than the active region. In one embodiment, the die further comprises a crack arrest structure formed in the scrib...	06/14/2011
7952169	Isolation circuit An isolation circuit, comprising a first transistor having a gate, a first source/drain terminal, and a second source/drain terminal, a first pad coupled to the gate of the first transistor, the first pad operable to receive an enable signal, a second pad coupled to...	05/31/2011
7952168	Substrate strip for semiconductor packages A substrate strip for semiconductor packages to slow the crack growth, primarily comprises a molding area and two side rails. The molding area includes a plurality of packaging units. The side rails are located outside the molding area and include two opposing longe...	05/31/2011
7948060	Integrated circuit structure An integrated circuit and corresponding method of manufacture. The integrated circuit has a die comprising: an outer strengthening ring around a periphery of the die, the outer ring having one or more gaps; and an inner strengthening ring within the outer ring and a...	05/24/2011
7948059	Dividable semiconductor device having ceramic substrate and surface mount components collectively sealed on principle surface of ceramic substrate In a semiconductor device comprising a ceramic substrate, a surface mount component, and sealing resin and obtained by division into pieces, the ceramic substrate is composed of a multiple piece substrate provided with dividing grooves for the division into pieces o...	05/24/2011
7939913	Semiconductor device A semiconductor device includes a substrate; a layered body formed on the substrate and including a multilayer interconnection structure, the layered body including multiple interlayer insulating films stacked in layers, the interlayer insulating films being lower i...	05/10/2011
7919833	Semiconductor package having a crack-propagation preventing unit There are provided a semiconductor package comprising: a semiconductor substrate including an integrated circuit unit, and a crack-propagation preventing unit at least partially formed around a peripheral of the integrated circuit unit of the semiconductor substrate...	04/05/2011
7906833	Semiconductor device and manufacturing method thereof A method for manufacturing a semiconductor device has preparation step of preparing a semiconductor substrate having a plurality of semiconductor chip formation regions and a scribe region arranged between the plurality of the semiconductor chip formation regions an...	03/15/2011
7902638	Semiconductor die with through-hole via on saw streets and through-hole via in active area of die A semiconductor wafer contains a plurality of die with contact pads disposed on a first surface of each die. Metal vias are formed in trenches in the saw street guides and are surrounded by organic material. Traces connect the contact pads and metal vias. The metal ...	03/08/2011
7888776	Capacitor-based method for determining and characterizing scribe seal integrity and integrity loss One embodiment of the present invention relates to a scribe seal integrity detector. In this embodiment a scribe seal integrity detector is formed in an integrated circuit chip die. The scribe seal integrity comprises a scribe seal structure that extends along at le...	02/15/2011
7888777	Semiconductor device and method for manufacturing the same A semiconductor device includes a semiconductor substrate, a circuit region on the semiconductor substrate, a plurality of metal wires formed in the circuit region on the semiconductor device and a seal ring region surrounding the circuit region. A distance L betwee...	02/15/2011
7880273	Method of manufacturing semiconductor device from semiconductor wafer In a method of manufacturing a semiconductor device, a semiconductor wafer is provided. The wafer has semiconductor chip regions, a scribing line region and a predetermined region. A passivation layer is formed on the wafer. A photoresist film is formed on the passi...	02/01/2011
7868427	Structure and method for placement, sizing and shaping of dummy structures A material layer on a substrate being processed, e.g. to form chips, includes one or more functional structures. In order to control pattern density during fabrication of the chip, dummy fill structures of different sizes and shapes are added to the chip at differen...	01/11/2011
7859084	Semiconductor substrate A semiconductor substrate (1) includes a plurality of semiconductor elements (2) in which functional elements are constructed and which is formed in a grid pattern, wherein continuous linear grooves (3) are formed on longitudinal and lateral sep...	12/28/2010
7855436	Semiconductor wafer A semiconductor wafer includes an insulation substrate with transparency; a silicon semiconductor layer formed on the insulation substrate; a chip forming area defined on the silicon semiconductor layer; a scribe line area defined on the silicon semiconductor layer ...	12/21/2010
7825494	Image sensor and method for manufacturing the same An image sensor may include a dielectric, a metal interconnection, an align key, a first substrate, a photodiode, and a transparent electrode. The first substrate may include a pixel region, a peripheral circuitry region and a scribe lane. The dielectric may include...	11/02/2010

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Class 257/620 - With peripheral feature due to separation of smaller semiconductor chip from larger wafer (e.g., scribe region, or means to prevent edge effects such as leakage current at peripheral chip separation area)