Famous Patents
3M employee and church chorister Art Fry needed something to temporarily mark pages in his hymnal. He was in luck because his colleague, Spencer Silver, accidentally developed a glue that was too weak for other purposes. After initially discouraging consumer response, Post-it Notes became a hit in 1979.
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| Number | Title | Issue Date |
| 8120145 | Structure for a through-silicon-via on-chip passive MMW bandpass filter A design structure is embodied in a machine readable medium for designing, manufacturing, or testing a design. The design structure includes a substrate including a silicon layer. Furthermore, the design structure includes a metal layer on a bottom side of the silic... | 02/21/2012 |
| 8106479 | Patterned capacitor ground shield for inductor in an integrated circuit Integrated circuits are disclosed including at least one inductor-capacitor component, where each of the inductor-capacitor components includes an inductor and a capacitor constructed between the inductor and a substrate. The inductor includes at least one metal loo... | 01/31/2012 |
| 7989918 | Implementing tamper evident and resistant detection through modulation of capacitance A method and tamper detection circuit for implementing tamper and anti-reverse engineering evident detection in a semiconductor chip, and a design structure on which the subject circuit resides are provided. A capacitor is formed with the semiconductor chip includin... | 08/02/2011 |
| 7989917 | Integrated circuit device including a resistor having a narrow-tolerance resistance value coupled to an active component The invention relates to an electronic device provided with an electronic component which comprises an integrated circuit arrangement including a semiconducting substrate, active components, and passive components such as capacitors and resistors. The resistors comp... | 08/02/2011 |
| 7847372 | Ferroelectric capacitor, method of manufacturing ferroelectric capacitor, and ferroelectric memory A ferroelectric capacitor including: a substrate; a first electrode formed above the substrate; a first ferroelectric layer formed above the first electrode and including a complex oxide shown by Pb(Zr,Ti)O3; a second ferroelectric layer formed above the ... | 12/07/2010 |
| 7763954 | Post last wiring level inductor using patterned plate process A semiconductor structure. The semiconductor structure includes: a substrate having at least one metal wiring level within the substrate; an insulative layer on a surface of the substrate; an inductor within the insulative layer; and a wire bond pad within the insul... | 07/27/2010 |
| 7732895 | Semiconductor device including triple-stacked structures having the same structure In a semiconductor device, a plurality of triple-stacked structures all having the same structure are provided. Each of the triple-stacked structures includes one lower electrode layer, at least one upper electrode layer and one dielectric layer sandwiched by the lo... | 06/08/2010 |
| 7557428 | Semiconductor integrated circuit having a reduced parasitic capacitance and short start-up time A semiconductor integrated circuit that includes a circuit element with a reduced parasitic capacitance and has a short start-up time. A well of the different type of conduction from that of the substrate is formed in the area of the surface of the semiconductor sub... | 07/07/2009 |
| 7473982 | Point contact array, not circuit, and electronic circuit comprising the same A NOT circuit realized using an atomic switch serving as a two terminal device and including a first electrode made of a compound conductive material having ionic conductivity and electronic conductivity and a second electrode made of a conductive substance. Ag... | 01/06/2009 |
| 7368045 | Gate stack engineering by electrochemical processing utilizing through-gate-dielectric current flow A method is provided for electroplating a gate metal or other conducting or semiconducting material directly on a dielectric such as a gate dielectric. The method involves selecting a substrate, dielectric layer, and electrolyte solution or melt, wherein the combina... | 05/06/2008 |
| 7355854 | Apparatus for improved grounding of flange mount field effect transistors to printed wiring boards An apparatus for improved grounding and heat transfer between flange mount field effect transistors and printed wiring boards is provided comprising a cut-out formed in the printed wiring board, extending between its top and bottom surfaces, defining an edge which i... | 04/08/2008 |
| 7338879 | Method of fabricating a semiconductor device having dual stacked MIM capacitor Semiconductor devices having a dual stacked MIM capacitor and methods of fabricating the same are disclosed. The semiconductor device includes a dual stacked MIM capacitor formed on the semiconductor substrate. The dual stacked MIM capacitor includes a lower plate p... | 03/04/2008 |
| 7332792 | Magnetic layer processing A dielectric layer is formed over a substrate comprising a semiconductor material. A magnetic layer is formed over the dielectric layer. The magnetic layer comprises an amorphous alloy comprising cobalt. ... | 02/19/2008 |
| 7326979 | Resistive memory device with a treated interface A multi-resistive state element that uses a treated interface is provided. A memory plug includes at least two electrodes that sandwich a multi-resistive state element. Using different treatments on both electrode/multi-resistive state element interfaces improves th... | 02/05/2008 |
| 7319254 | Semiconductor memory device having resistor and method of fabricating the same A semiconductor device having resistors in a peripheral area and fabrication method thereof are provided. A mold layer is formed on a semiconductor substrate. The mold layer is patterned to form first molding holes and a second molding hole in the mold layer. A stor... | 01/15/2008 |
| 7312528 | Semiconductor device having antenna connection electrodes A semiconductor device includes first and second antenna connection electrodes placed on the periphery of a semiconductor chip, an on-chip antenna connection electrode placed in the inner area of the semiconductor chip compared to the first and second antenna connec... | 12/25/2007 |
| 7309906 | Apparatus and methods for providing highly effective and area efficient decoupling capacitance in programmable logic devices Improved decoupling capacitor designs and layout schemes are provided that generate high effective capacitance and high area efficiency at higher frequencies than that of previously known decoupling capacitor designs. The improved decoupling capacitor designs utiliz... | 12/18/2007 |
| 7307335 | Semiconductor device having MOS varactor and methods for fabricating the same A semiconductor device with having a MOS varactor and methods of fabricating the same are disclosed. The MOS varactor includes a metal gate electrode, an active semiconductor plate interposed between the metal gate electrode and the semiconductor substrate, and a ca... | 12/11/2007 |
| 7291896 | Voltage droop suppressing active interposer The invention proposes an interposer assembly architecture for noise suppression circuits on the package of a CPU or high power, high frequency VLSI device. In this architecture, charge is stored on dedicated capacitors at a voltage substantially higher than the ope... | 11/06/2007 |
| 7265403 | Semiconductor device A semiconductor device is composed at least of a memory circuit part having capacitors and a peripheral circuit part for controlling the memory circuit part and has a first hydrogen barrier film of hydrogen resistance covering a region in which the capacitors are fo... | 09/04/2007 |
| 7262481 | Fill structures for use with a semiconductor integrated circuit inductor A semiconductor integrated circuit includes an inductor formed by a conductive loop that is fabricated on one or more metal layers. The inductor also includes a dielectric region provided adjacent to the conductive loop. The semiconductor integrated circuit may also... | 08/28/2007 |
| 7230316 | Semiconductor device having transferred integrated circuit It is an object to provide a semiconductor device integrating various elements without using a semiconductor substrate, and a method of manufacturing the same. According to the present invention, a layer to be separated including an inductor, a capacitor, a resistor... | 06/12/2007 |
| 7230320 | Electronic circuit device with reduced breaking and cracking In an electronic circuit device including a substrate including a front surface on which an electronic circuit element is mounted and a reverse surface opposite to the front surface in a thickness direction of the substrate, an electrically conductive terminal membe... | 06/12/2007 |
| 7202567 | Semiconductor device and manufacturing method for the same A lower interconnection is provided on a semiconductor substrate. A MIM capacitive element is provided on a first interlayer insulation film in which the lower interconnection is buried, and includes a lower electrode, an upper electrode, and a dielectric film sandw... | 04/10/2007 |
| 7199016 | Integrated circuit resistor An integrated circuit resistor is provided that comprises a mesa 14 between electrical contacts 16 and 18. The electrical resistance between electrical contacts 16 and 18 is selectively increased through the formation of recesses | 04/03/2007 |
| 7199415 | Conductive container structures having a dielectric cap Container structures for use in integrated circuits and methods of their manufacture. The container structures have a dielectric cap on the top of a conductive container to reduce the risk of container-to-container shorting by insulating against bridging of conducti... | 04/03/2007 |
| 7183625 | Embedded MIM capacitor and zigzag inductor scheme A new method to form RF devices in the manufacture of an integrated circuit device is achieved. The method comprises providing a substrate. A top metal level is defined overlying the substrate. The top metal level comprises pads and portions of planned RF devices. A... | 02/27/2007 |
| 7154158 | Semiconductor device having MIM structure resistor As for the resistor on the semiconductor substrate, it is required to achieve obtaining a metal resistor, which can be formed in the latter half of a preliminary process for manufacturing a semiconductor, in addition to forming a polysilicon resistor, which is forme... | 12/26/2006 |
| 7098523 | Controlled leakage CMOS decoupling capacitor for application specific integrated circuit libraries A decoupling capacitor includes a fixed resistance in series with the capacitor, the resistance formed by contacts connecting a polysilicon layer to metal and a diffusion layer to metal; the contacts being of location and quantity sufficient for limiting defect curr... | 08/29/2006 |
| 7081659 | Semiconductor apparatus having a built-in electric coil and a method of making the semiconductor apparatus A semiconductor apparatus includes lower conductive film strips, an inter-layer insulating layer, implanted conductive members, and upper conductive film strips. The lower conductive film strips are formed in a pattern closely adjacent in a line width orientation, e... | 07/25/2006 |
| 7075763 | Methods, circuits, and applications using a resistor and a Schottky diode A combination of a current limiting resistor and a clamping Schottky diode prevent substantial forward biasing of a pn junction associated with a pad in a snapback device during normal operation, but do not substantially affect triggering of the device during an unb... | 07/11/2006 |
| 7068788 | Data encryption for suppression of data-related in-band harmonics in digital to analog converters The present invention is related to digital to analog converter (DAC) input data encryption off-chip and decryption on-chip to suppress input data in-band harmonic leakage through package related parasitic capacitance. More specifically, the present invention relate... | 06/27/2006 |
| RE39124 | Integrated circuit having capacitive elements An integrated circuit having capacitive elements for smoothing a supply voltage is described. In this case, at least one additional metal electrode, which is configured as a high frequency-optimized capacitance and is distinguished by an extremely low sheet resistan... | 06/13/2006 |
| 7042041 | Semiconductor device There is here disclosed a semiconductor device comprising a capacitor provided on a substrate and formed by sandwiching a capacitive insulating film between lower and upper electrodes, an interlayer insulating film of an n-th layer (n is 1 or greater integer) provid... | 05/09/2006 |
| 7038294 | Planar spiral inductor structure with patterned microelectronic structure integral thereto Within a method for fabricating a microelectronic fabrication there is first provided a substrate. There is then formed over the substrate a spirally patterned conductor layer which terminates in a microelectronic structure within the center of the spirally patterne... | 05/02/2006 |
| 7009276 | Thin film capacitor, thin film capacitor array and electronic component A thin film capacitor with small electrode resistance and great Q-value which comprises a small number of thin films that are deposited successively is disclosed. It is effective for miniaturization and high density packaging of a device and for preventing poor char... | 03/07/2006 |
| 7005722 | RC terminator and production method therefor A thin-film RC circuit element suitable for a transmission line termination circuit is prepared by a process wherein 1) a first metal layer of an anodizable metal is deposited on a substrate; 2) the exposed surface... | 02/28/2006 |
| 6998696 | Integrated thin film capacitor/inductor/interconnect system and method A system and method for the fabrication of high reliability capacitors (1011), inductors (1012), and multi-layer interconnects (1013) (including resistors (1014)) on various thin film hybrid substrate surfaces (0501) is disclosed. ... | 02/14/2006 |
| 6992374 | Techniques for manufacturing a circuit board with an improved layout for decoupling capacitors A circuit board module has an IC device, discrete components, and a circuit board structure in electrical communication with the IC device and the discrete component. The circuit board structure includes non-conductive material defining a top surface of the circuit ... | 01/31/2006 |
| 6977403 | Semiconductor apparatus having a built-in-electric coil and a method of making the semiconductor apparatus A semiconductor apparatus includes lower conductive film strips, an inter-layer insulating layer, implanted conductive members, and upper conductive film strips. The lower conductive film strips are formed in a pattern closely adjacent in a line width orientation, e... | 12/20/2005 |
