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| Number | Title | Issue Date |
| 8188570 | Structure and method for buried inductors for ultra-high resistivity wafers for SOI/RF SiGe applications A design structure is embodied in a machine readable medium for designing, manufacturing, or testing a design. The design structure includes a high resistivity substrate and a buried inductor formed directly in the high resistivity substrate and devoid of an insulat... | 05/29/2012 |
| 8174092 | Semiconductor device having high frequency wiring and dummy metal layer at multilayer wiring structure A semiconductor device, includes a semiconductor device, a wiring layer provided on the semiconductor substrate, a high frequency wiring provided in the wiring layer, and plural dummy metals provided in the wiring layer apart from the high frequency wiring, wherein ... | 05/08/2012 |
| 8169050 | BEOL wiring structures that include an on-chip inductor and an on-chip capacitor, and design structures for a radiofrequency integrated circuit Back-end-of-line (BEOL) wiring structures that include an on-chip inductor and an on-chip capacitor, as well as design structures for a radiofrequency integrated circuit. The on-chip inductor and an on-chip capacitor, which are fabricated as conductive features in d... | 05/01/2012 |
| 8164158 | Semiconductor device and method of forming integrated passive device An IPD semiconductor device has a capacitor formed over and electrically connected to a semiconductor die. An encapsulant is deposited over the capacitor and around the semiconductor die. A first interconnect structure is formed over a first surface of the encapsula... | 04/24/2012 |
| 8164159 | Semiconductor resonators with electromagnetic and environmental shielding and methods of forming same A reference signal generator includes an integrated circuit substrate having a semiconductor resonator therein. The resonator includes an inductor extending adjacent a first surface of the integrated circuit substrate. A vertically-stacked composite of at least firs... | 04/24/2012 |
| 8164157 | Signal absorption induction circuit This patent pertains to a new technique of increasing the amount of energy absorbed by an antenna. It accomplishes this by broadcasting a spike that attracts the signal when the fields of its oscillating charge are at their strongest. ... | 04/24/2012 |
| 8159044 | Density transition zones for integrated circuits An integrated circuit is provided with a spiral inductor and a transition zone surrounding the spiral inductor. The transition zone may have a geometry that is substantially eight-sided or octagonal. Metal layers in the transition zone may have metal fill that is su... | 04/17/2012 |
| 8159043 | Semiconductor device A semiconductor device such as an ID chip of the present invention includes an integrated circuit using a semiconductor element formed by using a thin semiconductor film, and an antenna connected to the integrated circuit. It is preferable that the antenna is formed... | 04/17/2012 |
| 8143696 | Integrated circuit inductors with reduced magnetic coupling An IC inductor structure is provided which includes a first inductor element formed on a semiconductor substrate and at least a second inductor element formed on the semiconductor substrate proximate the first inductor element. The first inductor element has a first... | 03/27/2012 |
| 8134221 | Inductor and filter An inductor includes a first air-bridge section and a second air-bridge section. The first air-bridge unit extends in a floating location over a substrate between a plurality of support locations on the substrate. The second air-bridge unit extends in a floating loc... | 03/13/2012 |
| 8120142 | Applying trenched transient voltage suppressor (TVS) technology for distributed low pass filters An electronic circuit includes a filtering circuit implemented with a distributed inductor-and-capacitor (LC) network that includes metal oxide effect (MOS) trenches opened in a semiconductor substrate filled with dielectric material for functioning as capacitors fo... | 02/21/2012 |
| 8110894 | Protection for an integrated circuit chip containing confidential data An integrated circuit chip for holding or processing data on information for secure protection. A first side of the chip has at least one first conductor element and another side of the chip has another conducting element. ... | 02/07/2012 |
| 8110895 | Circuit substrate structure and circuit apparatus A first wiring layer in a circuit substrate structure is provided with a first inductor and a second inductor. A dielectric layer is provided with a first via and a second via electrically connected to the first inductor and the second inductor, respectively. A seco... | 02/07/2012 |
| 8072042 | Integrated inductor and method for manufacturing an integrated inductor A method for integrating an inductor into a semiconductor substrate is provided. The method includes providing a semiconductor substrate having a first surface and a second surface and forming at least a first trench and at least two openings in the semiconductor su... | 12/06/2011 |
| 8067816 | Techniques for placement of active and passive devices within a chip A semiconductor die includes a semiconductive substrate layer with first and second sides, a metal layer adjacent the second side of the semiconductive substrate layer, one or more active devices in an active layer on the first side of the semiconductive substrate l... | 11/29/2011 |
| 8053864 | Switching element, variable inductor, and electronic circuit device having circuit configuration incorporating the switching element and the variable inductor An inexpensive variable inductor has inductance value continuously changeable without reducing a Q value. When a control voltage is applied to a control terminal of a MOS transistor from a power supply, a continuity region is formed in a channel, and a region betwee... | 11/08/2011 |
| 8049300 | Inductor energy loss reduction techniques An inductive device including an inductor coil located over a substrate, at least one electrically insulating layer interposing the inductor coil and the substrate, and a plurality of current interrupters each extending into the substrate, wherein a first aggregate ... | 11/01/2011 |
| 8049301 | Semiconductor transformers A planar transformer structure, which can be constructed in an integrated semiconductor circuit without using traditional metallic windings. To avoid large thermal expansion of metallic spiral windings and associated mechanical stress on a metal-semiconductor interf... | 11/01/2011 |
| 8035192 | Semiconductor device and manufacturing method thereof A semiconductor device has a semiconductor chip and through electrodes formed passing through the semiconductor chip. A ground layer connected to the through electrode and a patch antenna connected to the through electrode are provided through an inorganic insulatin... | 10/11/2011 |
| 8018026 | Circuit board and semiconductor device A semiconductor device, includes: a semiconductor substrate; a multilayered interconnect structure formed on the semiconductor substrate; a terminal for flip-chip packaging arranged on the surface of the multilayered interconnect structure; and a spiral inductor for... | 09/13/2011 |
| 8018027 | Flip-bonded dual-substrate inductor, flip-bonded dual-substrate inductor, and integrated passive device including a flip-bonded dual-substrate inductor A flip-bonded dual-substrate inductor includes a base substrate, a first inductor body portion provided on a surface of the base substrate, a cover substrate, a second inductor body portion provided on a surface of a cover substrate, and a nanoparticle bonding mater... | 09/13/2011 |
| 8004061 | Conductive trace with reduced RF impedance resulting from the skin effect The radio frequency (RF) impedance of a metal trace at gigahertz frequencies is reduced by forming the metal trace to have a base region and a number of fins that extend away from the base region. When formed in a spiral configuration having a number of loops, the m... | 08/23/2011 |
| 8004062 | Semiconductor device A multilayer wiring layer 400, a first inductor 310 and a second inductor 320 are formed on a substrate 10. The multilayer wiring layer is formed by alternately stacking an insulating layer and a wiring layer in this order t or more times... | 08/23/2011 |
| 7994608 | Magnetically alignable integrated circuit device An integrated circuit device includes a semiconductor chip having an active surface with a plurality of chip contact pads, a rewiring substrate and an electrically conductive inductor coil for magnetically aligning the semiconductor chip with the rewiring substrate.... | 08/09/2011 |
| 7982286 | Method to improve metal defects in semiconductor device fabrication The invention, in one aspect, provides a method of manufacturing a semiconductor device. This method includes providing a semiconductor substrate and depositing a metal layer over the semiconductor substrate that has an overall thickness of about 1 micron or greater... | 07/19/2011 |
| 7977767 | Spiral planar inductor and manufacturing method thereof An inductor includes an inductor wiring made of a metal layer and having a spiral planar shape. In a cross-sectional shape in a width direction of the inductor wiring, the inductor wiring has a larger film thickness at least in its inner side end than in its middle ... | 07/12/2011 |
| 7973385 | Semiconductor device A semiconductor device including a doped substrate of a first doping polarity and a doped semiconductor material of a second doping polarity. The semiconductor material is on, or in, the substrate, and the second doping polarity is opposite the first doping polarity... | 07/05/2011 |
| 7968968 | Inductor utilizing pad metal layer An inductor utilizing a pad metal layer. The inductor comprises a metal spiral, a metal bridge, and a metal interconnect. The metal bridge is formed with the pad metal layer and a plurality of vias and has one end connected to the metal spiral. The metal interconnec... | 06/28/2011 |
| 7948057 | Electronic component module A ferrite substrate, a winding-embedded ferrite resin layer, and an IC-embedded ferrite resin layer are laminated, the ferrite substrate has a ferrite first protruding part that protrudes into the ferrite resin layer from the surface thereof, the winding inside the ... | 05/24/2011 |
| 7948056 | Integrated electronic device and method of making the same An integrated electronic device includes a substrate, passive components, pads for external connection, and three-dimensional wiring. The passive components includes a multi-stage coil inductor provided on the substrate. The multi-stage coil inductor has a plurality... | 05/24/2011 |
| 7948055 | Inductor formed on semiconductor substrate An inductor formed on a semiconductor substrate is provided in the present invention. The inductor comprises a metal layer and an insulator layer. The metal layer constitutes the coil of the inductor. The insulator layer comprises at least one insulator slot, and ea... | 05/24/2011 |
| 7944019 | Voltage-controlled semiconductor inductor and method A voltage-controlled semiconductor inductor and method is provided. According to various embodiments, the voltage-controlled inductor includes a conductor configured with a number of inductive coils. The inductor also includes a semiconductor material having a conta... | 05/17/2011 |
| 7939909 | Device having inductors and capacitors An LC device having a substrate, a support layer having upper and lower sides formed on the substrate, inductors formed on either the upper or lower side of the support layer, and capacitors formed in the opposite side of the support layer. The support layer may be ... | 05/10/2011 |
| 7936045 | Integrated circuit with multi-stage matching circuit An integrated circuit with a multi-stage matching circuit with an inductive conductive structure with a first end and a second end in the integrated circuit and a capacitor structure in the integrated circuit connected to a tap between the ends of the inductive cond... | 05/03/2011 |
| 7936046 | Integrated circuit devices including passive device shielding structures Integrated circuit devices include a semiconductor substrate and a flux line generating passive electronic element on the semiconductor substrate. A dummy gate structure is arranged on the semiconductor substrate in a region below the passive electronic element. The... | 05/03/2011 |
| 7932577 | Circuit device and method of forming a circuit device having a reduced peak current density In a particular embodiment, a method of forming a field effect transistor (FET) device having a reduced peak current density is disclosed. The method includes forming a field effect transistor (FET) device on a substrate. The FET device includes a drain terminal, a ... | 04/26/2011 |
| 7932578 | Semiconductor device having high frequency wiring and dummy metal layer at multilayer wiring structure A semiconductor device includes, a metal wiring, which functions as an inductor or transformer, formed on a first portion of a semiconductor substrate, a plurality of first dummy layers formed in a first density on the first portion of the semiconductor substrate, a... | 04/26/2011 |
| 7923814 | Semiconductor device including an inductor having soft magnetic thin film patterns and a fabricating method of the same A semiconductor device includes an interlayer insulating film and an inductor. The inductor includes a first soft magnetic thin film pattern formed on the interlayer insulating film, the first soft magnetic film comprising a) at least one material selected from Fe, ... | 04/12/2011 |
| RE42232 | RF chipset architecture A set of radio frequency (RF) integrated circuits includes a transmit chip having a power amplifier and a receive chip adapted to work with the transmit chip. The receive chip has one or more low noise amplifiers to receive RF signals, and a processor coupled to the... | 03/22/2011 |
| 7906831 | Semiconductor device with capacitor arrangement electrically coupled to inductor coil One or more embodiments relate to a semiconductor device, comprising: a inductor coil including a winding; and a capacitor arrangement including at least one capacitor, the capacitor arrangement electrically coupled to the inductor coil, the footprint of the capacit... | 03/15/2011 |
