Did You Know...
...that to encourage use of his new invention, the shopping cart, market owner Sylvan Goldman hired fake shoppers to push the carts around his store in Oklahoma City? Seems his customers were reluctant to give up their hand-carried baskets.
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| Number | Title | Issue Date |
| 7242538 | Optical device An optical device includes a base of ring shape, and a light emitting/receiving element and a transparent plate both attached to the base. A side face of the opening of the base is formed to have a taper serving as a draft for a molding resin. A side surface of the ... | 07/10/2007 |
| 7242599 | Self-analyzing memory word A content-addressable memory stores a plurality of words, each word with intrinsic capability: Global bus-1 selects a set of bits in each word. Global bus-2 selects a disjoint set of bits in each word. Circuits approximately adiabatic in each word, toggle bus-2 bits... | 07/10/2007 |
| 7238960 | QWIP with enhanced optical coupling A QWIP structure is disclosed that is configured with enhanced optical coupling to improve absorption capability and efficiency. A waffle-type light-coupling grating having a pattern of etched wells operates to improve absorption by preventing photons from bouncing ... | 07/03/2007 |
| 7235852 | Integrated variable optical attenuator A variable optical attenuator. A PIN structure is integrated with an optical detector such as a PIN diode or an APD diode. When the PIN structure is forward biased, the light signal is not affected and is detected by the optical detector. When the PIN structure is r... | 06/26/2007 |
| 7235831 | Light-receiving element and photoelectric conversion device In order to reduce the capacitance of a light-receiving element, the present invention provides a light-receiving element which includes a first semiconductor region of the first conductivity type, a second semiconductor region of the second conductivity type, provi... | 06/26/2007 |
| 7235833 | Image sensor device and manufacturing method thereof An image sensor and a manufacturing method thereof are provided. The image sensor includes a plurality of sensors, an inter-layer dielectric layer formed over the sensors, a first inter-metal dielectric layer formed over the inter-layer dielectric layer, and a plura... | 06/26/2007 |
| 7233027 | Arrangement comprising at least two different electronic semiconductor circuits The invention relates to an arrangement comprising at least two different electronic semiconductor circuits (HS) in which each of the semiconductor circuits (HS) is a component made of semiconductor material and which has an electrically active surface and electroni... | 06/19/2007 |
| 7233718 | Optical device and method of manufacturing the same An optical device integrally including an optical waveguide and an optical detector, and a method of manufacturing the same. The optical device includes: a substrate; a first single crystalline growth layer grown on the substrate; an optical waveguide provided with ... | 06/19/2007 |
| 7230224 | Solid state image pickup device with two photosensitive fields per one pixel A solid state image pickup device having: a semiconductor substrate having a light receiving area; a number of pixels formed in the light receiving area of the semiconductor substrate in a matrix shape, each of the pixels having a main photosensitive field having a ... | 06/12/2007 |
| 7230278 | Optoelectronic semiconductor device and light signal input/output device A optoelectronic semiconductor device, mountable on and electrically connectable to an electro-optical wiring board, a substrate thereof having a light input/output through-hole and electric connection through-holes, the light input/output through-hole being not for... | 06/12/2007 |
| 7230288 | Solid-state image pickup device and fabrication method thereof A solid-state image pickup device includes: a plurality of light receiving portions arranged in a matrix, and a vertical transfer register which is four-phase driven by first, second, third and fourth transfer electrodes of a three-layer structure. The vertical tran... | 06/12/2007 |
| 7227692 | Method and apparatus for balancing color response of imagers A micro-lens array with reduced or no empty space between individual micro-lenses and a method for forming same. The micro-lens array is formed by patterning a first set of micro-lens material in a checkerboard pattern on a substrate. The first set of micro-lens mat... | 06/05/2007 |
| 7227236 | Image sensor package and its manufacturing method Disclosed are an image sensor package and its manufacturing method. As an example, an infrared ray protection glass is positioned directly on an image sensing region of an image sensor die. An electrically conductive wire and so forth located outside the image sensi... | 06/05/2007 |
| 7227182 | Optical property normalization for a transparent electrical device Optical property normalization for a transparent electrical device is described. In an embodiment, an electrical device includes a plurality of laterally displaced regions that are substantially transparent. Each region of the plurality of regions includes a normali... | 06/05/2007 |
| 7227193 | Solid-state image sensor with micro-lenses for preventing shading A solid-state image sensor prevents shading while maintaining the wide dynamic range of an image signal without reducing its resolution. The image sensor has its photodiode array including arrangement patterns, each of which includes a smaller micro-lens and larger ... | 06/05/2007 |
| 7224056 | Back-face and edge interconnects for lidded package A packaged microelectronic device is provided which includes: (a) a unit having a chip with an upwardly-facing front surface and a downwardly-facing rear surface, a lid overlying at least a portion of the front surface of the chip, the lid having a top surface facin... | 05/29/2007 |
| 7223449 | Film deposition method A film deposition method and film deposition system for depositing a halogen compound film, capable of depositing such a film while suppressing abuse that occurs due to deficiency of a halogen element even if the halogen element is dissociated from a film material. ... | 05/29/2007 |
| 7221502 | Microscope and sample observation method For a semiconductor device S as a sample of an observed object, there are provided an image acquisition part 1 for carrying out observation of the semiconductor device S, and an optical system 2 comprising an objective lens 20. A solid immersion... | 05/22/2007 |
| 7221691 | Versatile method and system for single mode VCSELs A system and method for providing a single mode VCSEL (vertical cavity surface emitting laser). A lower mirror is formed on a substrate. An active region including one or more quantum wells is formed over the lower mirror. The upper mirror formed over the active reg... | 05/22/2007 |
| 7221693 | Surface-emitting type semiconductor laser, optical module, and optical transmission device Exemplary embodiments of the present invention include surface-emitting type semiconductor lasers including photodetector sections, which have a degree of freedom in designing its structure and are capable of high-speed driving. A surface-emitting type semiconductor... | 05/22/2007 |
| 7218483 | Magnetoresistive effect element, magnetic head and magnetic reproducing apparatus A spin valve type magnetoresistive effect element for vertical electric conduction includes a magnetoresistive effect film in which a resistance adjustment layer made of a material containing conductive carriers not more than 1022/cm3 is insert... | 05/15/2007 |
| 7214996 | Optical semiconductor housing with transparent chip and method for making same Optical semiconductor package and its method of fabrication, which package comprises a semiconductor component (6), a rear face of which is attached to a front face of a mounting and electrical connection support (2) and a front face of which comprises... | 05/08/2007 |
| 7214960 | Electro-optical device and electronic apparatus An electro-optical device includes a plurality of pixels arranged on a substrate. Each of the pixels includes a plurality of EL light-emitting elements that are disposed on the substrate and are connected in series. Each of the EL light-emitting elements includes a ... | 05/08/2007 |
| 7214998 | Complementary metal oxide semiconductor image sensor layout structure A complementary metal oxide semiconductor (CMOS) image sensor layout structure is described. The CMOS image sensor layout structure includes a substrate, a plurality of light sensing devices, a plurality of transistors and a plurality of color-filtering film layers.... | 05/08/2007 |
| 7214971 | Semiconductor light-receiving device A semiconductor light-receiving device has a substrate including upper, middle and lower regions in its front side. A p-type layer on the lower region has a top surface including a portion on a level with the middle region. An electrode covers at least part of the b... | 05/08/2007 |
| 7214997 | Integrated optical device An integrated optical device allowing for higher flexibility in designing its outer shape and securing hermetic sealing is provided, which includes a ceramic substrate mounting a light source, a covering member fixed to the substrate for covering the light source, a... | 05/08/2007 |
| 7215849 | Connection structure between optical fibers on a substrate and connection method for coupling the same To provide a connection structure between optical fibers and a connection method to couple optical fibers that make it possible to secure optical transmission, a connection structure between optical fibers includes a plurality of optical fibers, a base member provid... | 05/08/2007 |
| 7208809 | Semiconductor device having MEMS In a semiconductor device having a MEMS according to this invention, a plurality of units having movable portions for constituting a MEMS are monolithically mounted on a semiconductor substrate on which an integrated circuit including a driving circuit, sensor circu... | 04/24/2007 |
| 7208783 | Optical enhancement of integrated circuit photodetectors A semiconductor integrated circuit structure and method for fabricating. The semiconductor integrated circuit structure includes a light sensitive device integral with a semiconductor substrate, a cover dielectric layer disposed over the light sensitive device, and ... | 04/24/2007 |
| 7205646 | Electronic device and chip package The package includes a substrate, a first chip, a second chip, multiple first bumps and multiple second bumps. The substrate has a first region and a second region. The first region is substantially coplanar with the second region. The first bumps connect the first ... | 04/17/2007 |
| 7204609 | Light-emitting diode light source unit A light-emitting diode light source unit has a printed circuit board mounting a light-emitting diode (LED) element on its surface. Between the LED element surface-mounted on the printed circuit board and a wiring land formed on the printed circuit board, there is su... | 04/17/2007 |
| 7205532 | Integrated ball grid array optical mouse sensor packaging A compact optical sensor package for use in an optical mouse. The optical sensor package includes a chip enclosure which is physically and electrically bonded to a main circuit Board using Ball Grid Array (BGA) technology. The chip enclosure includes a windowed cove... | 04/17/2007 |
| 7202465 | Photosensor and solid state imaging device The photosensor includes a semiconductor substrate provided with a light receiving portion for converting incident light and a signal readout portion; a light shielding layer formed above the light receiving portion and having an aperture; and a transparent insulati... | 04/10/2007 |
| 7202511 | Near-infrared visible light photon counter Electromagnetic energy is detected with high efficiency in the spectral range having wavelengths of about 1–2 microns by coupling an absorber layer having high quantum efficiency in the spectral range having wavelengths of about 1–2 microns to an intrinsic semic... | 04/10/2007 |
| 7202596 | Electron emitter and process of fabrication An electron emitter is formed by in situ growth from the vapor on catalyst clusters that are adhered by an adhesion layer to a conductive electrode. The emitter comprises hemispheroidal nanofiber clusters that emit electrons at low field strengths and high current d... | 04/10/2007 |
| 7199440 | Techniques for joining an opto-electronic module to a semiconductor package The present invention provides a low cost device that has a true die to external fiber optic connection. Specifically, the present invention relates to an optical device package joined to a semiconductor device package. In some cases, the combination is joined using... | 04/03/2007 |
| 7199454 | Optoelectronic semiconductor component A radiation-emitting and/or radiation-receiving semiconductor component in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the sem... | 04/03/2007 |
| 7199436 | Attachment structure for solid-state imaging device An attachment structure is used for attaching a solid-state imaging device to a light exit end face of a color-separating prism. When bonding the light exit end face on the color-separating prism side and the light entrance face on the solid-state imaging device sid... | 04/03/2007 |
| 7199410 | Pixel structure with improved charge transfer An active pixel is described comprising a semiconductor substrate and a radiation sensitive source of carriers in the substrate, such as for instance, a photodiode. A non-carrier storing, carrier collecting region in the substrate is provided for attracting carriers... | 04/03/2007 |
| 7199350 | Optical input device with a light source die mounted on a detecting die and manufacture method thereof A light source die of an optical input device is mounted on a detecting die of the optical input device in order to reduce the size of the optical input device. The light source die emits light to a reflective surface, and light sensing elements formed on the detect... | 04/03/2007 |
