Bizarre Patents
User-operated amusement apparatus for kicking the user's buttocks
An apparatus including a user-operated and controlled apparatus for self-infliction of repetitive blows to the user's buttocks by a plurality of elongated arms bearing flexible extensions that rotate under the user's control.
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| Number | Title | Issue Date |
| 8188560 | Optical color sensor system An optical color sensor system is provided including providing a substrate having an optical sensor therein and forming a passivation layer over the substrate. The passivation layer is planarized and color filters are formed over the passivation layer. A planar tran... | 05/29/2012 |
| 8183656 | Photodiode A photodiode includes: an upper spacer layer including a semiconductor transparent to incident light; a metal periodic structure provided on the upper spacer layer and arranged to induce surface plasmon, the metal periodic structure including first and second electr... | 05/22/2012 |
| 8178938 | Active pixel sensor having two wafers A vertically-integrated active pixel sensor includes a sensor wafer connected to a support circuit wafer. Inter-wafer connectors or connector wires transfer signals between the sensor wafer and the support circuit wafer. The active pixel sensor can be fabricated by ... | 05/15/2012 |
| 8169043 | Optical seneor package structure and manufactueing method thereof An optical sensor package structure includes a substrate, a metal plate, an optical sensing chip, a plurality of bonding wires and a lens module. The substrate includes a top surface, a bottom surface and a hole penetrating the top surface and the bottom surface. Th... | 05/01/2012 |
| 8154097 | Image sensor and method of manufacturing the same An image sensor and a method of manufacturing the same are provided. The image sensor includes a substrate having a sensor array area and a peripheral circuit area a first insulating film structure formed on the peripheral circuit area and including a plurality of f... | 04/10/2012 |
| 8154098 | Reverse image sensor module and method for manufacturing the same A reverse image sensor module includes first and second semiconductor chips, and first and second insulation layers. The first semiconductor chip includes a first semiconductor chip body having a first surface and a second surface facing away from the first surface,... | 04/10/2012 |
| 8148794 | Photodetector in germanium on silicon A photodetector structure includes a silicon-based waveguide in which optical signals to be detected travel in a given direction and are confined therein and a germanium layer disposed in contact with a portion of the silicon-based waveguide so that an evanescent ta... | 04/03/2012 |
| 8143685 | Image sensor having nanodot An image sensor includes a plurality of pixels disposed in an array, each pixel comprising a first region and a second region, the first region and the second region separated from each other in a semiconductor layer, and doped with impurities having different condu... | 03/27/2012 |
| 8138564 | Image sensor unit and image sensor apparatus An image sensor unit includes a fixed substrate, a movable substrate, an actuate section including an actuator for moving the movable substrate against the fixed substrate, an image sensor having an imaging surface on a front surface of the image sensor, and at leas... | 03/20/2012 |
| 8134218 | Solid-state image capturing device, solid-state image capturing apparatus, and electronic information device A solid-state image capturing device is provided, and in a pixel section in the center of a chip where a plurality of light receiving elements are arranged in two dimensions, an on-chip lens for focusing incident light is provided on each of the plurality of light r... | 03/13/2012 |
| 8120128 | Optical device An optical device includes a base and an optical element. The base has a through hole in a center and includes leads and a resin. Each lead has an L-shaped cross-section and is formed by an inner lead extending from the center toward a peripheral edge and an outer l... | 02/21/2012 |
| 8120129 | Image sensor and method of manufacturing the same An image sensor and a method of manufacturing the same are disclosed. The image sensor includes a plurality of photodiodes on a substrate, an dielectric layer on the plurality of the photodiodes, a metal line layer in the dielectric layer corresponding to a border r... | 02/21/2012 |
| 8110884 | Methods of packaging imager devices and optics modules, and resulting assemblies A method of packaging imager devices and optics modules is disclosed which includes positioning an imager device and an optics module in each of a plurality of openings in a carrier body, introducing an encapsulant material into each of the openings in the carrier b... | 02/07/2012 |
| 8093673 | Columnated backside illumination structure Imager devices, systems including the imager devices and methods of forming the imager devices are provided. The imager device has a substrate with first and second opposing sides. The imager also includes an array of imager pixels at the first side of the substrate... | 01/10/2012 |
| 8093672 | Solid-state imaging device Provided is a manufacturing method of a solid-state imaging device, which is able to realize a solid-state imaging device whose reflection prevention coating is even and that does not have image noise in case of adopting a spincoating method in applying a material o... | 01/10/2012 |
| 8089133 | Optical assemblies for transmitting and manipulating optical beams Optical cubes and optical cube assemblies for directing optical beams are provided. The optical cubes are optically transparent modules that can be adapted to reflect, transmit, and/or partially reflect and transmit optical beams. The optical cubes may include bi-di... | 01/03/2012 |
| 8080855 | Semiconductor device and method of manufacturing the same According to the present invention, a protective seal S1 for protecting a transparent member 11 is composed of an organic base 16, adhesive layers 17, and a second adhesive layer 18 having low adhesion. The adhesive layers 17 | 12/20/2011 |
| 8076743 | Image sensor Embodiments relate to an image sensor and a method of manufacturing the image sensor. An image sensor according to the embodiment includes: silicon patterns that are formed on a flexible substrate; a device isolation pattern that is formed between the silicon patter... | 12/13/2011 |
| 8076742 | Image sensor and method for manufacturing the same An image sensor according to embodiments may include a semiconductor substrate, photodiodes disposed over the semiconductor substrate, a dielectric layer formed over the photodiodes, a color filter layer formed over the dielectric layer, a planarization layer formed... | 12/13/2011 |
| 8063461 | Solid-state imaging device, camera module and electronic equipment module To provide a back-illuminated type solid-state imaging device capable of color separation of pixels without using a color filter, and a camera module and an electronic equipment module which incorporate the solid-state imaging device. A solid-state imaging de... | 11/22/2011 |
| 8053856 | Backside illuminated sensor processing The present disclosure provides methods and apparatus for reducing dark current in a backside illuminated semiconductor device. In one embodiment, a method of fabricating a semiconductor device includes providing a substrate having a frontside surface and a backside... | 11/08/2011 |
| 8053855 | CMOS image sensor for photosensitivity and brightness ratio A CMOS image sensor for improving light sensitivity and peripheral brightness ratio, and a method for fabricating the same. The CMOS image sensor includes a substrate on which a light sensor and device isolating insulation films are formed, in which the top of the s... | 11/08/2011 |
| 8049289 | Image sensor and method for manufacturing the same Disclosed are an image sensor and a method for manufacturing the same. The image sensor includes a semiconductor substrate including a unit pixel, first to third color filters provided on the semiconductor substrate, a first micro-lens provided on each of the first ... | 11/01/2011 |
| 8044474 | Optoelectronic module, and method for the production thereof An optoelectronic module having a carrier element, at least one semiconductor component for emitting or detecting electromagnetic radiation, said semiconductor component being applied on the carrier element and being electrically conductively connected and having a ... | 10/25/2011 |
| 8044475 | Chip package A chip package includes a bump connecting said semiconductor chip and said circuitry component, wherein the semiconductor chip has a photosensitive area used to sense light. The chip package may include a ring-shaped protrusion connecting a transparent substrate and... | 10/25/2011 |
| 8039914 | Solid-state imaging device, method of making the same, and imaging apparatus A solid-state imaging device includes the following elements. A photoelectric conversion section is arranged in a semiconductor layer having a first surface through which light enters the photoelectric conversion section. A signal circuit section is arranged in a se... | 10/18/2011 |
| 8035178 | Solid-state imaging device A plurality of pixel portions (12) are formed on a silicon substrate (11). A photoelectric converter portion (10) constituting each of the pixel portions (12) is electrically isolated by an element isolation portion (13) comprising... | 10/11/2011 |
| 8026564 | Image sensor and fabrication method thereof An image sensor and a method of fabricating an image sensor. A method of fabricating an image sensor may include forming a plurality of photodiodes on and/or over a semiconductor substrate, a filter array including color filters arranged corresponding to upper parts... | 09/27/2011 |
| 8018012 | Solid-state image sensor and manufacturing method thereof A solid-state image sensor includes: a photoelectric conversion region formed in an upper part of a semiconductor substrate, for generating charges by photoelectric conversion; a transfer region formed in the upper part of the semiconductor substrate and located on ... | 09/13/2011 |
| 8013410 | Imaging device, method for manufacturing the imaging device and cellular phone An imaging device includes a lens (3), an optical filter (5), a semiconductor imaging element (4) having a light receiving section, and a tridimensional substrate (2) on which the semiconductor imaging element (4) and the optical f... | 09/06/2011 |
| 8013409 | Photoelectric conversion device and fabrication method therefor A photoelectric conversion device comprises a high-refractive-index portion at a position close to a photoelectric conversion element therein. And, the high-refractive-index portion has first and second horizontal cross-section surfaces. The first cross-section surf... | 09/06/2011 |
| 7999341 | Display driver integrated circuit device, film, and module A rectangular display driver integrated circuit device adapted for use with a flat panel display (FPD) device is disclosed and comprises, a plurality of input pads arranged in a central portion of the display driver integrated circuit device, and a plurality of outp... | 08/16/2011 |
| 7994598 | Electronic assembly for image sensor device An electronic assembly for an image sensor device is disclosed. The electronic assembly comprises a package module and a lens set mounted thereon. The package module comprises a device substrate comprising at least one grounding plug therein, in which the grounding ... | 08/09/2011 |
| 7989907 | Backside-illuminated solid-state image pickup device Provided is a backside-illuminated solid-state image pickup device capable of allowing peripheral circuits to produce stable waveforms and thereby achieving image characteristics with less noise, the device including: a first-conductivity-type semiconductor layer ha... | 08/02/2011 |
| 7986019 | Solid-state imaging device and its manufacturing method A solid-state imaging device includes a semiconductor substrate having a photoelectric conversion region, a first microlens provided above the semiconductor substrate, covering the photoelectric conversion region, and having a convex upper surface, for gathering ext... | 07/26/2011 |
| 7986018 | Solid-state imaging device A solid-state imaging device includes a light-receiving portion, an optical filter layer, and quantum dots. The light receiving portion, where a photoelectric conversion is carried out, is formed in a semiconductor substrate. The optical filter layer is directly for... | 07/26/2011 |
| 7986020 | Optical communication module and flexible printed circuit board A flexible printed circuit board includes: a signal wiring pattern including: a transmission line for connecting an end of an optical device with an end of a signal generation circuit; and another transmission line for connecting another end of the optical device wi... | 07/26/2011 |
| 7964927 | Semiconductor device and method for strain controlled optical absorption A semiconductor device which has controlled optical absorption includes a substrate, and a semiconductor layer supported by the substrate. The semiconductor has variable optical absorption at a predetermined optical frequency in relationship to a bandgap of the semi... | 06/21/2011 |
| 7952155 | Reduced edge effect from recesses in imagers Methods for making a recessed color filter array for a semiconductor imager employing a sidewall spacer for reducing an edge effect from the array are disclosed. In one embodiment, a substrate is provided having an upper surface. Then, a recess is formed into the up... | 05/31/2011 |
| 7948046 | Optoelectronic component An optoelectronic component having a basic housing or frame and at least one semiconductor chip, specifically a radiation-emitting or-receiving semiconductor chip, in a cavity of the basic housing. In order to increase the efficiency of the optoelectronic component,... | 05/24/2011 |
