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Patent No. 5500234

Crispy Chip Sandwich and Process of Producing a Sandwich Product

A food product comprising a multilayer cookie or snack having outer layers formed from a crispy type edible food product such as a potato chip or corn chip, etc. with an intermediate marshmallow layer being in contact with the inner surface of each crispy chip and one or more filler substances.

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Class 257/420 - Means to reduce sensitivity to physical deformation


Subclass of Class 257 - Active solid-state devices (e.g., transistors, solid-state diodes)
Definition: Subject matter wherein the device contains means to reduce
No. of patents: 180
Last issue date: 02/28/2012


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NumberTitleIssue Date
8125039One-time programmable, non-volatile field effect devices and methods of making same
One-time programmable, non-volatile field effect devices and methods of making same. Under one embodiment, a one-time-programmable, non-volatile field effect device includes a source, drain and gate with a field-modulatable channel between the source and drain. Each...
02/28/2012
8120125MEMS devices having overlying support structures
Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in th...
02/21/2012
7915698Nitride semiconductor substrate having a base substrate with parallel trenches
The present invention relates to a nitride semiconductor substrate such as gallium nitride substrate and a method for manufacturing the same. The present invention forms a plurality of trenches on a lower surface of a base substrate that are configured to absorb or ...
03/29/2011
7400514Non-rigid conductor link measurement sensor and method for the production thereof
The invention relates to electronic sensors comprising an electromechanical microsensor cell such as a micro-accelerometer, and it more particularly relates to the way in which the microsensor cell per se is mounted in a package that furthermore comprises a printed ...
07/15/2008
7358579Reducing the actuation voltage of microelectromechanical system switches
A microelectromechanical system switch may include a relatively stiff cantilevered beam coupled, on its free end, to a more compliant or flexible extension. A contact may be positioned at the free end of the cantilevered beam. The extension reduces the actuation vol...
04/15/2008
7320896Infrared radiation detector
Electronic devices are disclosed that may be used for infrared radiation detection. An example electronic device includes a substrate, a transistor included in the substrate and a silicon-germanium (Si—Ge) structural layer coupled with the transistor. The structur...
01/22/2008
7321099Component mounting substrate and structure
To provide a component mounting substrate and a component mounting structure which absorb stresses caused by impact or by the difference in the thermal extension coefficient between substrate and component, without increasing the required accuracy in soldering the s...
01/22/2008
7304358MOS transistor with a deformable gate
A MOS transistor with a deformable gate formed in a semiconductor substrate, including source and drain areas separated by a channel area extending in a first direction from the source to the drain and in a second direction perpendicular to the first one, a conducti...
12/04/2007
7301801Tuned pinned layers for magnetic tunnel junctions with multicomponent free layers
Apparatus and methods for optimizing a toggle window for a magnetic tunnel junction (MTJ) having a multicomponent free layer are provided. In accordance with an aspect of the invention, a MTJ comprises a free layer, a pinned layer, and a barrier layer formed between...
11/27/2007
7298014Use of visco-elastic polymer to reduce acoustic and/or vibration induced error in microelectromechanical devices and systems
A system and method for reducing rectification error in a MEMS device cause by noise and/or vibration. A visco-elastic polymer is situated around at least part of the MEMs device, wherein the visco-elastic polymer converts at least some of the acoustic and/or vibrat...
11/20/2007
7298017Actuation using lithium/metal alloys and actuator device
In one embodiment, a solid state actuator is provided having a solid state lithium storage material and a solid state volume changing material having a metal capable of changing volume in response to lithium insertion and removal. A solid state lithium ion transport...
11/20/2007
7289357Isolation structure for deflectable nanotube elements
Nanotube-based switching elements and logic circuits. Under one embodiment of the invention, a switching element includes an input node, an output node, a nanotube channel element having at least one electrically conductive nanotube, and a control electrode. The con...
10/30/2007
7284443Semiconductor pressure sensor and process for fabricating the same
This invention aims to realize reduction in size without impairing measurement accuracy or connection reliability in a semiconductor pressure sensor in which a glass substrate is adhered to a rear-surface side of a pressure-sensitive chip in which piezoresistive pre...
10/23/2007
7283025Micro-electromechanical systems switch and method of fabricating the same
Provided is a micro-electromechanical systems switch for controlling signal delivery in a high frequency band wireless communication and a radio frequency (RF) system and, comprising: a substrate; a signal line formed on the substrate and having a predetermined open...
10/16/2007
7256467Materials and methods for forming hybrid organic-inorganic anti-stiction materials for micro-electromechanical systems
A micro-electromechanical device is formed on a substrate. The device has sliding, abrading or impacting surfaces. At least one of these surfaces is covered with an anti-stiction material. The anti-stiction material is provided from a slicon compound precursor (e.g....
08/14/2007
7252007Method for the manufacturing of a capacitive pressure sensor, and a capacitive pressure sensor
The invention relates to measuring devices for the measuring of pressure, and more specifically to capacitive pressure sensors. The silicon crystal planes {111} are located at the corners of a wet etched membrane well of a pressure sensor element according to...
08/07/2007
7244368Manufacturing process of a magnetic head, magnetic head, pattern formation method
A manufacturing method of a magnetic head includes a process for forming a lift-off mask pattern on a magnetoresistance effect element, such that the upper part of the lift-off mask pattern is larger in size than the lower part, a process for forming a couple of ele...
07/17/2007
7230308Magnetic random access memory
A magnetic random access memory according to an example of the present invention includes a magnetoresistive element, a write line for use in generation of a magnetic field for data writing with respect to the magnetoresistive element, and a strained layer which is ...
06/12/2007
7214995Mechanism to prevent actuation charging in microelectromechanical actuators
According to one embodiment a microelectromechanical (MEMS) switch is disclosed. The MEMS switch includes a top movable electrode, and an actutaion electrode with an undoped polysilicon stopper region to contact the top movable electrode when an actuation current is...
05/08/2007
7207226Semiconductor pressure sensor
In an ECU in which a sensor IC and various engine control devices are mounted on a board in a case, the sensor IC has a pressure sensor element covered with mold resin having a pressure introduction hole extending outward from the pressure sensor element so as to op...
04/24/2007
7199448Integrated circuit configuration comprising a sheet-like substrate
An integrated circuit is formed on a non-planar substrate. The integrated circuit is formed over a plurality of layers. Chemical or physical changes in the microstructure of the substrate cause the bending of the substrate, in one or more propagation directions....
04/03/2007
7190245Multi-stable micro electromechanical switches and methods of fabricating same
A micro electromechanical (MEMS) switch suitable for use in medical devices is provided, along with methods of producing and using MEMS switches. In one aspect, a micro electromechanical switch including a moveable member configured to electrically cooperate with a ...
03/13/2007
7172911Deflectable microstructure and method of manufacturing the same through bonding of wafers
A method of making a deflectable, free hanging micro structure having at least one hinge member, the method includes the steps of providing a first sacrificial wafer having a single crystalline material constituting material forming the micro structure. A second sem...
02/06/2007
7152300Method of manufacturing a micromechanical structure
A microactuator includes a stationary element, a movable element, and a first microstructure. The stationary element is fixed on a substrate and has a plurality of stationary element electrodes arranged at a predetermined pitch. The movable element has a plurality o...
12/26/2006
7148549Data storage module suspension system
A micro-electro-mechanical device includes a moveable mass supported within a frame. To support the mass within the frame, a first flexure extends between the mass and the frame. An angle softening element is positioned between a first end of the first flexure and t...
12/12/2006
7145253Encapsulated sensor device
Disclosed is a semiconductor device and its manufacturing method. By way of example, the semiconductor device includes a semiconductor die for sensing an external physical quantity, an insulating gel covering the semiconductor die, and an encapsulant which covers th...
12/05/2006
7122396Semiconductor acceleration sensor and process for manufacturing the same
The present invention provides a semiconductor acceleration sensor wherein a semiconductor element is prevented from being damaged even when at least part of a weight is disposed in an internal space of a semiconductor sensor element and the mass of a weight is acco...
10/17/2006
7115960Nanotube-based switching elements
Nanotube-based switching elements and logic circuits. Under one embodiment of the invention, a switching element includes an input node, an output node, a nanotube channel element having at least one electrically conductive nanotube, and a control electrode. The con...
10/03/2006
7109561Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig
The present invention relates to a method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the ...
09/19/2006
7106233Integrated galvanomagnetic sensor array system
Galvanomagnetic sensor array system and method for providing data interface to a basic sensor array are provided. The sensor system includes an array of galvanomagnetic elements, and a processor coupled to receive each output signal from the array of galvanomagnetic...
09/12/2006
7084726Thin film shape memory alloy actuated microrelay
A microrelay device formed on a silicon substrate wafer for use in opening and closing a current path in a circuit. A pair of electrically conducting latching beams are attached at their proximal ends to terminals on the substrate. Proximal ends of the beams have co...
08/01/2006
7075081Method of fabrication of an infrared radiation detector and infrared detector device
A method of controlling an internal stress in a polycrystalline silicon-germanium layer deposited on a substrate. The method includes selecting a deposition pressure that is at or below atmospheric pressure and selecting a deposition temperature that is no greater t...
07/11/2006
7075162Electrostatic/electrostrictive actuation of elastomer structures using compliant electrodes
A valve structure includes an elastomeric block formed with first and second microfabricated recesses separated by a membrane portion of the elastomeric block. The valve is actuated by positioning a compliant electrode on a first side of the first recess proximate t...
07/11/2006
7067393Substrate assembly for stressed systems
A substrate-assembly having a mechanical stress absorption system. The assembly includes two substrates, one of which has a mechanical stress absorbing system, such as a plurality of motifs that absorb thermoelastic stresses, to prevent cracking or destruction of th...
06/27/2006
7053456Electronic component having micro-electrical mechanical system
An electronic component includes a semiconductor substrate having a first surface and a second surface opposite to the first surface, a cavity that penetrates from the first surface to the second surface of the semiconductor substrate, and an electrical mechanical e...
05/30/2006
7046028Method of inspecting a semiconductor dynamic quantity sensor
A method of inspecting a semiconductor dynamic quantity includes varying a potential applied to a peripheral fixed portion while applying predetermined potentials to fixed electrodes and to movable electrodes to vary the potential difference between the movable elec...
05/16/2006
7042056Chip-size package piezoelectric component
A surface acoustic wave device includes a SAW having an IDT disposed on a piezoelectric substrate, a conductive pad connected to the IDT, and a bonding substrate, wherein the SAW is bonded to the bonding substrate such that a protective space of the IDT is provided....
05/09/2006
7038285Very high sensitivity magnetic sensor
A magnetic sensor includes a thin deformable membrane made of a conductive material forming a first plate of a capacitor which conducts an electric current therethrough. A second capacitor plate of the capacitor includes a doped region of a semiconductor substrate. ...
05/02/2006
7034370MEMS scanning mirror with tunable natural frequency
In one embodiment of the invention, a MEMS structure includes a first electrode, a second electrode, and a mobile element. The first electrode is coupled to a first voltage source. The second electrode is coupled to a second voltage source. The mobile element includ...
04/25/2006
6967351Finfet SRAM cell using low mobility plane for cell stability and method for forming
The present invention provides a device design and method for forming the same that results in Fin Field Effect Transistors having different gains without negatively impacting device density. The present invention forms relatively low gain FinFET transistors in a lo...
11/22/2005
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