Celebrity Inventors
Glam girl Heddy Lamar may have used her good looks to good effect on the silver screen, but she put her smarts to better use as an inventor. During World War II, she co-patented a frequency-switching system for torpedo guidance that was considered years ahead of its time.
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| Number | Title | Issue Date |
| 8169042 | Integrated microphone A method of forming a microphone having a variable capacitance first deposits high temperature deposition material on a die. The high temperature material ultimately forms structure that contributes to the variable capacitance. The method then forms circuitry on the... | 05/01/2012 |
| 8134215 | MEMS diaphragm A microelectromechanical system (MEMS) diaphragm is provided. The MEMS diaphragm includes a first conductive layer, a second conductive layer and a dielectric layer. The first conductive layer is disposed on a substrate and having a plurality of openings. The dimeni... | 03/13/2012 |
| 8129805 | Microelectromechanical system (MEMS) device and methods for fabricating the same A method of fabricating a microelectromechanical system (MEMS) device includes providing a semiconductor substrate having a semiconductor layer and an interconnect structure. A passivation layer and a photoresist layer are formed over the interconnect structure and ... | 03/06/2012 |
| 8097926 | Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy System, devices and methods are presented that integrate stretchable or flexible circuitry, including arrays of active devices for enhanced sensing, diagnostic, and therapeutic capabilities. The invention enables conformal sensing contact with tissues of interest, s... | 01/17/2012 |
| 8076739 | Micromechanical component and method for producing a micromechanical component A micromechanical component includes a substrate that has a front side and a backside, the front side having a functional pattern, which functional pattern is electrically contacted to the backside in a contact region. The substrate has at least one contact hole in ... | 12/13/2011 |
| 8067812 | Acceleration sensor and method of producing the same An acceleration sensor includes a weight; a base portion, a beam; and a piezo resistance element. The weight is arranged to displace upon receiving acceleration. The base portion is disposed around the weight apart from the weight. The beam has one end portion conne... | 11/29/2011 |
| 8063458 | Micromechanical component, method for fabrication and use A micromechanical component that can be produced in an integrated thin-film method is disclosed, which component can be produced and patterned on the surface of a substrate as multilayer construction. At least two metal layers that are separated from the substrate a... | 11/22/2011 |
| 7994595 | Strained semiconductor by full wafer bonding One aspect of this disclosure relates to a method for forming a wafer with a strained semiconductor. In various embodiments of the method, a predetermined contour is formed in one of a semiconductor membrane and a substrate wafer. The semiconductor membrane is bonde... | 08/09/2011 |
| 7989906 | Bi-directional released-beam sensor An acceleration sensor includes a semiconductor substrate, a first layer formed on the substrate, a first aperture within the first layer, and a beam coupled at a first end to the substrate and suspended above the first layer for a portion of the length thereof. The... | 08/02/2011 |
| 7977757 | MEMS element, MEMS device and MEMS element manufacturing method An MEMS element (A1) includes a substrate (1), and a first electrode (2) formed on the substrate (1). The MEMS element (A1) further includes a second electrode (3) including a movable portion (31) spaced from the firs... | 07/12/2011 |
| 7944008 | Suspended membrane pressure sensing array An accurate and low cost macro pressure sensor is described. The pressure sensor includes an array of capacitive sensing elements formed at the intersections of sets of conductors. A lower set of conductors is supported by a substrate and an upper set of conductors ... | 05/17/2011 |
| 7915697 | Sensor device and fabrication method for the same The sensor device includes: a converter body made of silicon in the shape of a rhombus in plan, the converter body having an opening in the shape of a hexagon in plan; a substrate for holding the converter body; a movable film formed on the opening; a converter elec... | 03/29/2011 |
| 7911012 | Flexible and elastic dielectric integrated circuit General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a semiconductor ... | 03/22/2011 |
| 7888754 | MEMS transducer An MEMS transducer is constituted of a diaphragm, a plate, a support structure for supporting the diaphragm and the plate with a gap layer surrounded by an interior wall, an electrode film (e.g. a pad conductive film) for covering a contact hole formed in the suppor... | 02/15/2011 |
| 7851876 | Micro electro mechanical system Embodiments of a micro electro mechanical system are disclosed. ... | 12/14/2010 |
| 7843025 | Micromechanical semiconductor sensor A manufacturing method for a micromechanical semiconductor element includes providing on a semiconductor substrate a patterned stabilizing element having at least one opening. The opening is arranged such that it allows access to a first region in the semiconductor ... | 11/30/2010 |
| 7834409 | Micromechanical component and corresponding method for its manufacture A micromechanical component having a conductive substrate, an elastically deflectable diaphragm including at least one conductive layer, which is provided over a front side of the substrate, the conductive layer being electrically insulated from the substrate, a hol... | 11/16/2010 |
| 7812418 | Chip-scaled MEMS microphone package An MEMS microphone package includes a circuit board and an MEMS microphone chip. The MEMS microphone chip, mounted on the circuit board, includes a substrate, an MEMS transducer formed on the substrate, and a readout circuit also formed on the substrate. The MEMS tr... | 10/12/2010 |
| 7800190 | Getter on die in an upper sense plate designed system A microelectromechanical system (MEMS) hermetically sealed package device that is less labor intensive to construct and thus less expensive to manufacture. An example package device includes a package having a bottom section and a lid. A MEMS die includes upper and ... | 09/21/2010 |
| 7800189 | Microfabricated capacitive ultrasonic transducer The invention relates to a microfabricated capacitive ultrasonic transducer (20) comprising at least one thin plate (21), provided with a metallization (24), suspended over a conductive substrate (23) through supporting elements integrall... | 09/21/2010 |
| 7795695 | Integrated microphone A method of forming a microphone having a variable capacitance first deposits high temperature deposition material on a die. The high temperature material ultimately forms structure that contributes to the variable capacitance. The method then forms circuitry on the... | 09/14/2010 |
| 7786541 | Semiconductor pressure sensor and its fabrication method A semiconductor pressure sensor comprises a silicon support substrate (1), an insulating layer (2) formed on the silicon support substrate (1), and a silicon thin plate (3) formed on the insulating layer (2). A through-hole (1 | 08/31/2010 |
| 7781852 | Membrane die attach circuit element package and method therefor A circuit element package has a substrate having a plurality of electrically conductive patterns, a die pad, and an access hole formed through the die pad and substrate. A plurality of leads is coupled to the substrate. A circuit element die is attached to the die p... | 08/24/2010 |
| 7777285 | Semiconductor device having a suspended micro-system A method is provided for fabricating a semiconductor device that includes a suspended micro-system. According to the method, a silicon porous layer is formed above a silicon substrate, and the silicon porous layer is oxidized. An oxide layer is deposited, and a firs... | 08/17/2010 |
| 7763948 | Flexible and elastic dielectric integrated circuit General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a semiconductor ... | 07/27/2010 |
| 7755152 | Semiconductor component configured as a diaphragm sensor A method for producing a micromechanical diaphragm sensor includes providing a semiconductor substrate having a first region, a diaphragm, and a cavity that is located at least partially below the diaphragm. Above at least one part of the first region, a second regi... | 07/13/2010 |
| 7741687 | Microstructure, semiconductor device, and manufacturing method of the microstructure A microstructure includes a first structural layer and a second structural layer which faces the first structural layer with a space interposed therebetween and is partially fixed to the first structural layer. At least one of the first structural layer and the seco... | 06/22/2010 |
| 7701022 | Semiconductor device and method of producing the same A semiconductor device and a method of producing the same is disclosed, in which a through hole is formed in the upper surface of a semiconductor substrate from the lower surface thereof, and an opening of a desired size is formed in a desired position on the upper ... | 04/20/2010 |
| 7679154 | Method for manufacturing a semiconductor component and a semiconductor component, in particular a diaphragm sensor In a method for manufacturing a semiconductor component having a semiconductor substrate, a flat, porous diaphragm layer and a cavity underneath the porous diaphragm layer are produced to form unsupported structures for a component. In a first approach, the semicond... | 03/16/2010 |
| 7671432 | Dynamic quantity sensor A dynamic quantity sensor includes a sensor chip having a movable portion at one surface side thereof and a silicon layer at another surface side thereof. The movable portion is displaced under application of a dynamic quantity. The silicon layer is separated from t... | 03/02/2010 |
| 7566940 | Electromechanical devices having overlying support structures Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in th... | 07/28/2009 |
| 7560789 | Semiconductor device A microstructure and a semiconductor element which are included in a micromachine have been generally formed in different steps. It is an object to provide a method for manufacturing a micromachine in which a microstructure and a semiconductor element are formed ove... | 07/14/2009 |
| 7550810 | MEMS device having a layer movable at asymmetric rates A microelectromechanical (MEMS) device includes a substrate and a movable layer mechanically coupled to the substrate. The movable layer moves from a first position to a second position at a first rate and from the second position to the first position at a second r... | 06/23/2009 |
| 7538401 | Transducer for use in harsh environments A pressure sensor for use in a harsh environment including a substrate and a sensor die directly coupled to the substrate by a bond frame positioned between the substrate and the sensor die. The sensor die includes a generally flexible diaphragm configured to flex w... | 05/26/2009 |
| 7495302 | Micromechanical component having a diaphragm A micromechanical component having a diaphragm is provided, the structure of which effectively prevents the penetration of dirt particles into the cavity. A method for manufacturing such a component is also provided. The structure of the component is implemented in ... | 02/24/2009 |
| 7462919 | Microelectromechanical component and method for the production thereof A microelectromechanical component and to a method for the production thereof is disclosed. In one embodiment, the microelectromechanical component has a pressure-sensitive semiconductor chip, which is covered in its pressure-sensitive region by a rubber-elastic lay... | 12/09/2008 |
| 7436037 | Moisture resistant pressure sensors A differential pressure sensor has a semiconductor wafer having a top and bottom surface. The top surface of the wafer has a central active area containing piezoresistive elements. These elements are passivated and covered with a layer of silicon dioxide. Each eleme... | 10/14/2008 |
| 7435991 | Micromechanical sensor A micromechanical sensor and a method for manufacturing same are described. A secure diaphragm restraint, independent of fluctuations in the cavern etching process due to the process technology, and a free design of the diaphragm are made possible by designing a sui... | 10/14/2008 |
| 7427820 | Piezoelectric/electrostrictive film element A lower electrode 4 and an auxiliary electrode 8, a piezoelectric/electrostrictive film 5, and an upper electrode 6 are sequentially arranged in layers on a substrate 1. The lower electrode 4 is continuously formed in a regi... | 09/23/2008 |
| 7427797 | Semiconductor device having actuator A semiconductor device having a surface MEMS element, includes a semiconductor substrate, and an actuator which is arranged above the semiconductor substrate via a space and has a lower electrode, an upper electrode, and a piezoelectric layer sandwiched between the ... | 09/23/2008 |
