Bizarre Patents
Mountable Printable Placard With Headband
A resilient headband in a shape for being mounted on the head of the user. The headband is equipped with a longitudinal slotted member for holding a placard.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8174085 | Method of manufacturing MEMS sensor and MEMS sensor A method of manufacturing an MEMS sensor according to the present invention includes the steps of: forming a first sacrificial layer on one surface of a substrate; forming a lower electrode on the first sacrificial layer; forming a second sacrificial layer made of a... | 05/08/2012 |
| 8174084 | Stress sensor for in-situ measurement of package-induced stress in semiconductor devices A stress sensor is disclosed herein. The stress sensor includes a plurality of carbon nanotubes in a substrate, and first and second contacts electrically connectable with the plurality of carbon nanotubes. Methods of making and using the stress sensor are also disc... | 05/08/2012 |
| 8154094 | Micromechanical component having a cap having a closure A micromechanical component having a substrate, having a cavity and having a cap that bounds the cavity. The cap has an access opening to the cavity. The cap has a diaphragm for closing the access opening. ... | 04/10/2012 |
| 8106471 | Semiconductor dynamic quantity sensor and method of producing the same A semiconductor dynamic quantity sensor includes a sensor part and a cap connected to the sensor part. Dynamic quantity is detected based on a capacitance of a capacitor defined between a movable electrode and a fixed electrode of the sensor part. A float portion of... | 01/31/2012 |
| 8076738 | Integrally fabricated micromachine and logic elements Embodiments of the invention are related to micromachine structures. In one embodiment, a micromachine structure comprises a first electrode, a second electrode, and a sensing element. The sensing element is mechanically movable and is disposed intermediate the firs... | 12/13/2011 |
| 8063457 | Semiconductor strain gauge and the manufacturing method A high-density impurity diffused layer of an identical conduction type to the semiconductor substrate on which the impurity is doped higher in density than the semiconductor substrate around the diffuse resistance region is provided, one side of the electrodes is fo... | 11/22/2011 |
| 8013405 | Transducer with fluidly isolated connection A transducer for use in a harsh environment including a substrate and a transducer die directly coupled to the substrate by a bond frame positioned between the substrate and the transducer die. The transducer die includes a transducer element which provides an outpu... | 09/06/2011 |
| 8008739 | Microelectromechanical apparatus and method for producing the same A microelectromechanical apparatus (X) includes a microelectromechanical component (10), an insulating substrate (21), a through via (22c) disposed in the insulating substrate (21), a sealing member (30) and a conductive con... | 08/30/2011 |
| 8004053 | Micromechanical device and method of manufacturing micromechanical device A micromechanical device according to an aspect of the present invention includes, a substrate, a micromachine which is mounted on the substrate, is provided with a mechanism deformed by a function of an electric field, and changes the electrical characteristics con... | 08/23/2011 |
| 7956430 | Semiconductor device including groove width variation portion for inspection An accelerator sensor includes a semiconductor substrate having a main front surface and a main rear surface, a first groove portion being formed along a front surface pattern, in the main front surface, a second groove portion being formed along a rear surface patt... | 06/07/2011 |
| 7952154 | High temperature resistant solid state pressure sensor A harsh environment transducer including a substrate having a first surface and a second surface, wherein the second surface is in communication with the environment. The transducer includes a device layer sensor means located on the substrate for measuring a parame... | 05/31/2011 |
| 7932570 | Silicon tab edge mount for a wafer level package A Micro-ElectroMechanical Systems (MEMS) device having electrical connections (a metallization pattern) available at an edge of the MEMS die. The metallization pattern on the edge of the die allows the die to be mounted on edge with no further packaging, if desired.... | 04/26/2011 |
| 7906823 | MEMS apparatus and method of manufacturing the same A MEMS apparatus includes a MEMS unit formed on a semiconductor substrate and a cover provided with a pore and serving to seal the MEMS unit. The pore is sealed with a sealing material shaped in a sphere or a hemisphere. ... | 03/15/2011 |
| 7880248 | Destructor integrated circuit chip, interposer electronic device and methods A semiconductor device. The device includes a substrate and an integrated circuit chip. The device also includes an electrically or thermally reactive layer located between a top surface of the substrate and a bottom surface of the integrated circuit chip, wherein t... | 02/01/2011 |
| 7868403 | Integrated MEMS resonator device The present invention provides a method for manufacturing a micro-electro-mechanical system (MEMS) resonator device using the same device layer, dielectric layer, and conductive layer that is used to create other electrical devices in a complementary metal oxide sem... | 01/11/2011 |
| 7843023 | Electromechanical switch An electromechanical filter of the present invention is an electromechanical switch formed on a substrate. The switch has a fixed electrode which is to become a signal transmission line, and a movable electrode formed in a levitating manner while being spaced from t... | 11/30/2010 |
| 7821085 | Physical quantity sensor and method for manufacturing the same A physical quantity sensor includes: a sensor substrate including a first support substrate, a first insulation film and a first semiconductor layer, which are stacked in this order; a cap substrate including a second support substrate disposed on the first semicond... | 10/26/2010 |
| 7795694 | Quantum device, manufacturing method of the same and controlling method of the same By bringing a tip of an AFM into contact with the surface of a GaAs substrate or an AlGaAs substrate, for example, applying a negative bias to the tip, and applying a positive bias to the GaAs substrate or the AlGaAs substrate, a donut-shaped oxide film is formed. T... | 09/14/2010 |
| 7795693 | Flat substrate having an electrically conductive structure The description is of a flat substrate with an electrically conductive structure integrated inside the flat substrate or applied to a surface of the flat substrate and/or with a technically improved surface. The invention is characterised in that at least one... | 09/14/2010 |
| 7791151 | Force input control device and method of fabrication Method of fabricating 3-dimensional force input control device are disclosed. These roughly follow a process of providing a first substrate having side one and side two, fabricating stress-sensitive IC components and signal processing IC on the side one of the first... | 09/07/2010 |
| 7768082 | Surface-shape sensor and method of manufacturing the same According to the present embodiment, a surface-shape sensor is provided. The surface-shape sensor includes a silicon substrate, an interlayer insulating film formed over the silicon substrate, a first moisture-barrier insulating film formed on the interlayer insulat... | 08/03/2010 |
| 7763947 | Piezo-diode cantilever MEMS A piezo thin-film diode (piezo-diode) cantilever microelectromechanical system (MEMS) and associated fabrication processes are provided. The method deposits thin-films overlying a substrate. The substrate can be made of glass, polymer, quartz, metal foil, Si, sapphi... | 07/27/2010 |
| 7705412 | SOI substrate and semiconductor acceleration sensor using the same According to the present invention, a SOI substrate includes a first silicon substrate having first and second surfaces; a second silicon substrate having first and second surfaces; and a first insulating layer formed between first surface of the first silicon subst... | 04/27/2010 |
| 7671431 | Cloverleaf microgyroscope with through-wafer interconnects and method of manufacturing a cloverleaf microgyroscope with through-wafer interconnects The present invention relates to a method of manufacturing a cloverleaf microgyroscope containing an integrated post comprising: attaching a post wafer to a resonator wafer, forming a bottom post from the post wafer being attached to the resonator wafer, preparing a... | 03/02/2010 |
| 7615835 | Package for semiconductor acceleration sensor A semiconductor device comprises a package having a cavity in the interior thereof, a chip having a semiconductor element, a board having the chip fixed to a first region on the upper face thereof, and an adhesive portion formed in a second region on the bottom face... | 11/10/2009 |
| 7608900 | Semiconductor device and method of manufacturing and inspection thereof An accelerator sensor includes a semiconductor substrate having a main front surface and a main rear surface, a first groove portion being formed along a front surface pattern, in the main front surface, a second groove portion being formed along a rear surface patt... | 10/27/2009 |
| 7554168 | Semiconductor acceleration sensor device A semiconductor device comprises a package having a cavity in the interior thereof, a chip having a semiconductor element, and an adhesive portion comprised of a silicone or fluorine resin and particles each having a predetermined shape. The adhesive portion fixes t... | 06/30/2009 |
| 7518202 | Mechanical quantity measuring apparatus A semiconductor mechanical quantity measuring apparatus in which the reverse surface of a strain-detecting semiconductor element is bonded to an object of measurement, and a member having a small elastic modulus is interposed between the wiring board for supporting ... | 04/14/2009 |
| 7495301 | Thin film accelerometer A thin film structure including a conductive thin film provided on a substrate and configured to be displaced in response to an applied acceleration, a pair of electrode pads formed on the substrate such that the pair of electrode pads are disposed on respective sid... | 02/24/2009 |
| 7489013 | Destructor integrated circuit chip, interposer electronic device and methods A semiconductor device. The device includes a substrate and an integrated circuit chip. The device also includes an electrically or thermally reactive layer located between a top surface of the substrate and a bottom surface of the integrated circuit chip, wherein t... | 02/10/2009 |
| 7466000 | Semiconductor device having multiple substrates A semiconductor device includes a first substrate including first, second and third layers; a second substrate; and a loop bump. The first and second substrates provides an electric device and physical quantity sensor. The first layer is a shield for protecting the ... | 12/16/2008 |
| 7462918 | Pressure sensor having gold-silicon eutectic crystal layer interposed between contact layer and silicon substrate A pressure sensor includes a gold-silicon eutectic crystal layer interposed between the contact layer and the silicon substrate. Because the contact layer and the silicon substrate are electrically connected to each other by using a gold-silicon eutectic reaction at... | 12/09/2008 |
| 7443002 | Encapsulated microstructure and method of producing one such microstructure A microstructure including in a first layer insulated from a substrate by an insulator layer at least one sensitive element connected to at least one contact pad by an electrical connection and protected by a package cap. The sensitive element, the electrical connec... | 10/28/2008 |
| 7436037 | Moisture resistant pressure sensors A differential pressure sensor has a semiconductor wafer having a top and bottom surface. The top surface of the wafer has a central active area containing piezoresistive elements. These elements are passivated and covered with a layer of silicon dioxide. Each eleme... | 10/14/2008 |
| 7427797 | Semiconductor device having actuator A semiconductor device having a surface MEMS element, includes a semiconductor substrate, and an actuator which is arranged above the semiconductor substrate via a space and has a lower electrode, an upper electrode, and a piezoelectric layer sandwiched between the ... | 09/23/2008 |
| 7425749 | MEMS pixel sensor A MEMS pixel sensor is provided with a thin-film mechanical device having a mechanical body, with a mechanical state responsive to a proximate environment. A thin-film electronic device converts the mechanical state into electrical signals. A pixel interface supplie... | 09/16/2008 |
| 7405099 | Wide and narrow trench formation in high aspect ratio MEMS Methods have been provided for forming both wide and narrow trenches on a high-aspect ratio microelectromechanical (MEM) device on a substrate including a substrate layer (126), an active layer (128), and a first sacrificial layer (130) disposed... | 07/29/2008 |
| 7394138 | Capacitance-type dynamic-quantity sensor and manufacturing method therefor A capacitance-type dynamic-quantity sensor has a silicon substrate having etched recessed upper and lower surface portions forming a weight supported by beam portions and mounted to undergo displacement due to an applied external dynamic quantity such as acceleratio... | 07/01/2008 |
| 7393711 | Method of producing a digital fingerprint sensor and the corresponding sensor An embodiment of the present invention related to fingerprint sensors is described. The sensor comprises an integrated-circuit chip having a sensitive surface, a substrate provided with electrical connections and wire-bonding wires connecting the chip to the electri... | 07/01/2008 |
| 7380461 | Micro-electromechanical capacitive strain sensor A micro-electromechanical capacitive strain sensor. The micro-electromechanical capacitive strain sensor comprises a first bent beam, a second bent beam, and a straight center beam. The first bent beam, second bent beam, and straight center beam are aligned in the X... | 06/03/2008 |
