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| Number | Title | Issue Date |
| 8188557 | Single die MEMS acoustic transducer and manufacturing method The invention relates to an acoustic micro-electrical-mechanical-system (MEMS) transducer formed on a single die based on a semiconductor material and having front and back surface parts opposed to each other. The invention further relates to a method of manufacturi... | 05/29/2012 |
| 8178936 | Double-side mountable MEMS package The MEMS package has a mounting substrate on which one or more transducer chips are mounted wherein the mounting substrate has an opening. A top cover is attached to and separated from the mounting substrate by a spacer forming a housing enclosed by the top cover, t... | 05/15/2012 |
| 8169041 | MEMS package and method for the production thereof A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier s... | 05/01/2012 |
| 8143681 | Saw devices, processes for making them, and methods of use The design, fabrication, post-processing and characterization of a novel SAW (Surface Acoustic Wave) based bio/chemical sensor in CMOS technology is introduced. The sensors are designed in AMI 1.5 μm 2 metal, 2 poly process. A unique maskless post processing sequen... | 03/27/2012 |
| 8129804 | Electronic device, resonator, oscillator and method for manufacturing electronic device An electronic device includes a substrate, a functional structural body formed on the substrate and a covering structure for defining a cavity part having the functional structural body disposed therein, wherein the covering structure is provided with a side wall pr... | 03/06/2012 |
| 8102015 | Microphone package with minimum footprint size and thickness A microphone package includes a carrier, a cap, an integrated circuit chip, and a microphone unit. The cap covers the carrier to form a storage space. The integrated circuit chip is disposed in the storage space. The microphone unit is disposed in the storage space ... | 01/24/2012 |
| 8080854 | Electronic device on substrate with cavity and mitigated parasitic leakage path An electronic device. The electronic device includes a first electrode and a coating layer. The electronic device is fabricated on a substrate; the substrate has a cavity created in a top surface of the substrate; and the first electrode is electrically coupled to t... | 12/20/2011 |
| 8076737 | Systems and methods for acoustic sensing An optical-based acoustic sensor system detects sound. An exemplary embodiment has a substrate with a surface and an internal region; a shell disposed above the substrate surface, the shell operable to receive incident light emitted by a light source; a beam dispose... | 12/13/2011 |
| 8072036 | Micro-electromechanical system microphone structure A method of fabricating a micro-electromechanical system microphone structure is disclosed. First, a substrate defining a MEMS region and a logic region is provided, and a surface of the substrate has a dielectric layer thereon. Next, at least one metal interconnect... | 12/06/2011 |
| 8067811 | MEMS device, MEMS device module and acoustic transducer A MEMS device includes a first insulating film formed on a semiconductor substrate, a vibrating film formed on the first insulating film, and a fixed film above the vibrating film with an air gap being interposed therebetween. The semiconductor substrate has a regio... | 11/29/2011 |
| 8049287 | Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device A substrate-level assembly having a device substrate of semiconductor material with a top face and housing a first integrated device, including a buried cavity formed within the device substrate, and with a membrane suspended over the buried cavity in the proximity ... | 11/01/2011 |
| 8039911 | MEMS sensor The MEMS sensor according to the present invention includes a diaphragm. In the diaphragm, an angle formed by two straight lines connecting supporting portions and the center of a main portion with one another respectively is set to satisfy the relation of the follo... | 10/18/2011 |
| 8039910 | Electro-acoustic sensing device An electro-acoustic sensing device including a sensing chip, a carrier chip and a sealing element is provided. The sensing chip is for electro-acoustic transuding and thereby outputting an electrical signal. The carrier chip disposed below the sensing chip has at le... | 10/18/2011 |
| 8018010 | Circular surface acoustic wave (SAW) devices, processes for making them, and methods of use The design, fabrication, post-processing and characterization of a novel circular design SAW (Surface Acoustic Wave) based bio/chemical sensor in CMOS technology is introduced. The sensors are designed in AMI 1.5 μm 2 metal, 2 poly process. A unique maskless post p... | 09/13/2011 |
| 7994594 | Electronic device, resonator, oscillator and method for manufacturing electronic device An electronic device includes a substrate, a functional structural body formed on the substrate and a covering structure for defining a cavity part having the functional structural body disposed therein, wherein the covering structure is provided with a side wall pr... | 08/09/2011 |
| 7923795 | Ultrasonic transducer device A lower electrode is formed over a semiconductor substrate via an insulator film, first and second insulator films are formed to cover the lower electrode, an upper electrode is formed over the second insulator film, third to fifth insulator films are formed to cove... | 04/12/2011 |
| 7898047 | Integrated nitride and silicon carbide-based devices and methods of fabricating integrated nitride-based devices Monolithic electronic device including a common nitride epitaxial layer are provided. A first type of nitride device is provided on the common nitride epitaxial layer including a first at least one implanted n-type region on the common nitride epitaxial layer. The f... | 03/01/2011 |
| 7898048 | MEMS sensor An MEMS sensor is described. The MEMS sensor may include a substrate, a lower thin film provided in contact with a surface of the substrate, and an upper thin film opposed to the lower thin film at an interval on the side opposite to the substrate. ... | 03/01/2011 |
| 7868402 | Package and packaging assembly of microelectromechanical system microphone A package of microelectromechanical system (MEMS) microphone is suitable for being mounted on a printed circuit board. The package has a cover and at least one MEMS microphone. The cover has an inner surface and a conductive trace disposed thereon. The MEMS micropho... | 01/11/2011 |
| 7863699 | Bonded wafer package module Bonded wafer packages having first and second wafers bonded together forming a matrix of sealed devices, at least one of the wafers having a plurality of passive devices formed thereon, including at least one BAW resonator within each of the sealed devices, the firs... | 01/04/2011 |
| 7847359 | MEMS device, MEMS device module and acoustic transducer A MEMS device includes a first insulating film formed on a semiconductor substrate, a vibrating film formed on the first insulating film, and a fixed film above the vibrating film with an air gap being interposed therebetween. The semiconductor substrate has a regio... | 12/07/2010 |
| 7843022 | High-temperature electrostatic transducers and fabrication method A high temperature micromachined ultrasonic transducer (HTCMUT) is provided. The HTCMUT includes a silicon on insulator (SOI) substrate having a doped first silicon layer, a doped second silicon layer, and a first insulating layer disposed between the first and seco... | 11/30/2010 |
| 7843021 | Double-side mountable MEMS package The MEMS package has a mounting substrate on which one or more transducer chips are mounted wherein the mounting substrate has an opening. A top cover is attached to and separated from the mounting substrate by a spacer forming a housing enclosed by the top cover, t... | 11/30/2010 |
| 7829961 | MEMS microphone package and method thereof A MEMS microphone package includes a carrier, an application specific IC, an encapsulant and a microphone chip. The application specific IC and the microphone chip are respectively disposed on first and second surfaces of the carrier, and the application specific IC... | 11/09/2010 |
| 7808060 | MEMS microphone module and method thereof A MEMS microphone module having an application specific IC and a microphone chip is disclosed. The application specific IC has a plurality of first vias and a plurality of first pads, and the first vias are connected to the first pads. The microphone chip has a reso... | 10/05/2010 |
| 7808059 | Semiconductor substrate, and semiconductor device and method of manufacturing the semiconductor device In a semiconductor substrate 1, a plurality of semiconductor elements 2 having diaphragm structures are formed in the form of cells in the longitudinal direction and the lateral direction, and V-grooves 3 are formed by anisotropic etching contin... | 10/05/2010 |
| 7795692 | Resonator and fabrication method thereof A resonator including a substrate, and a resonating unit having an active region that causes resonances and a non-active region that does not cause resonances, and having a first electrode, a piezoelectric film, and a second electrode layered in turn on the substrat... | 09/14/2010 |
| 7759749 | Metal material, and coating film and wiring for semiconductor integrated circuitry utilizing the metal material When metallic material is employed for various metallic films, it is possible to improve at least one of the mechanical strength, the durability against abrasion, and the uniformess as a film while keeping unchanged the chemical property and the electric property of... | 07/20/2010 |
| 7755151 | Wafer level package for surface acoustic wave device and fabrication method thereof A wafer level package for a surface acoustic wave device and a fabrication method thereof include a SAW device formed with a SAW element on an upper surface of a device wafer; a cap wafer joined on an upper part of the SAW element; a cavity part housing the SAW elem... | 07/13/2010 |
| 7750420 | Integrated circuit having one or more conductive devices formed over a SAW and/or MEMS device An integrated circuit is provided which includes one or more device elements formed above a base substrate, a structure forming a sealed cavity above at least a portion of the one or more device elements, and one or more conductive devices formed above the sealed ca... | 07/06/2010 |
| 7741686 | Trench isolated capacitive micromachined ultrasonic transducer arrays with a supporting frame A one or two-dimensional capacitive micro-machined ultrasonic transducer (CMUT) array with supporting frame is provided. The CMUT array has at least three array elements deposited on a conductive substrate. The invention also has at least one CMUT cell in the array ... | 06/22/2010 |
| 7737513 | Chip assembly including package element and integrated circuit chip The present invention provides an integrated circuit chip assembly and a method of manufacturing the same. The assembly includes a package element having a top surface and an integrated circuit chip having a top surface, a bottom surface, edge surface between the to... | 06/15/2010 |
| 7692257 | Ultrasonic sensor comprising a metal/ferroelectric/metal/insulator/semiconductor structure A semiconductor element, a semiconductor sensor, and a semiconductor memory element are provided, in which an MFMIS structure having a lower electrode and an integrated circuit can be integrated. An epitaxially grown γ-Al2O3 single crystal fil... | 04/06/2010 |
| 7679153 | Sealed surface acoustic wave element package An electronic component includes: a semiconductor substrate having a first surface and a second surface opposing to the first surface; a trans-substrate conductive plug that penetrates the semiconductor substrate from the first surface to the second surface; an elec... | 03/16/2010 |
| 7663196 | Integrated passive device and method of fabrication A device 20 includes substrates 22 and 24 coupled to form a volume 32 between the substrates. A surface 28 of the substrate 22 faces a surface 30 of the substrate 24. A metal-insulator-metal capacitor 34... | 02/16/2010 |
| 7659591 | Apparatus having a layer of material configured as a reservoir having an interior capable of holding a liquid The present invention provides an apparatus. The apparatus, in one embodiment, includes an actuator located over a substrate, a movable feature located over and coupled to the actuator, and a layer of material located above the actuator and movable feature and not c... | 02/09/2010 |
| 7649235 | Electronic component package The electronic component package includes a mounting board, an electronic component and a molding resin. An external electrode is disposed on a surface of the mounting board. The electronic component connected to the mounting board via the external electrode include... | 01/19/2010 |
| 7615833 | Film bulk acoustic resonator package and method of fabricating same A microfabricated device has a first substrate, a second substrate, a film bulk acoustic resonator (FBAR) device, and a circuit. The second substrate is bonded to the first substrate to define a chamber. The FBAR device is located on a surface of the first substrate... | 11/10/2009 |
| 7615834 | Capacitive micromachined ultrasonic transducer(CMUT) with varying thickness membrane Structure for capacitive micromachined ultrasonic transducer (CMUT) device or other vibrating membrane device having non-uniform membrane so that membrane mass and stiffness characteristics may be substantially independently adjusted. CMUT having trenched membrane a... | 11/10/2009 |
| 7545012 | Capacitive micromachined ultrasound transducer fabricated with epitaxial silicon membrane A capacitive micromachined ultrasound transducer (cMUT) cell is presented. The cMUT cell includes a lower electrode. Furthermore, the cMUT cell includes a diaphragm disposed adjacent to the lower electrode such that a gap having a first gap width is formed between t... | 06/09/2009 |
