Bizarre Patents
User-operated amusement apparatus for kicking the user's buttocks
An apparatus including a user-operated and controlled apparatus for self-infliction of repetitive blows to the user's buttocks by a plurality of elongated arms bearing flexible extensions that rotate under the user's control.
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| Number | Title | Issue Date |
| 8188554 | Memory device having movable electrode and method of manufacturing the memory device A memory device includes a bit line, a first word line, a bit line contact, an electrode, a second word line and a contact tip. The bit line may extend along a first direction. The first word line is formed over the bit line and extends in a second direction. The bi... | 05/29/2012 |
| 8188556 | Semiconductor sensor and method of manufacturing the same A semiconductor sensor has a first semiconductor layer as a base, an insulating layer formed on the first semiconductor layer, and a second semiconductor layer formed on the insulating layer. A recess is formed from a bottom surface of the first semiconductor layer ... | 05/29/2012 |
| 8188555 | Capacitive sensor and manufacturing method therefor A capacitive sensor includes a semiconductor substrate, a fixed electrode serving as a first electrode formed on a surface of or in the semiconductor substrate, a structure formed on the semiconductor substrate to have a vibratable second electrode that is formed to... | 05/29/2012 |
| 8183651 | MEMS sensor, method of manufacturing MEMS sensor, and electronic apparatus A MEMS sensor includes: a substrate; a fixed electrode portion formed in the substrate; a movable weight portion formed above the fixed electrode portion via a gap; a movable electrode portion formed in the movable weight portion and disposed so as to face the fixed... | 05/22/2012 |
| 8183650 | MEMS device and MEMS spring element A micro electromechanical system (MEMS) spring element is disposed on a substrate, and includes a fixing portion and a moveable portion. The fixing portion is fixed on the substrate, and includes an insulating layer, a plurality of metal-fixing layers and a pluralit... | 05/22/2012 |
| 8178935 | MEMS chip and package method thereof The present invention proposes a MEMS chip and a package method thereof. The package method comprises: making a capping wafer by: providing a first substrate and forming an etch stop layer on the first substrate; making a device wafer by: providing a second substrat... | 05/15/2012 |
| 8174083 | Dual-suspension system for MEMS-based devices A dual-suspension system for MEMS-based devices includes a proof mass, an upper spring system, and a lower spring system. The proof mass is formed from a handle wafer, a first layer of silicon coupled to one side of the handle wafer, and a second layer of silicon co... | 05/08/2012 |
| 8148791 | Head gimbal assembly apparatus having an actuator mounted on a mounting plate comprising a ceramic sub-plate formed on a stainless steel mounting plate A test assembly for a disk drive suspension head gimbal assembly includes a steel mount plate and a mount sub-plate of a material such as silicon carbide having a modulus of elasticity to density ratio that is significantly higher than the ratio for stainless steel.... | 04/03/2012 |
| 8148790 | Thin-film lid MEMS devices and methods Thin film encapsulation devices and methods for MEMS devices and packaging are provided. For a MEMS device encapsulated by a sacrificial layer, a lid layer can be deposited over the MEMS device without touching the MEMS device. The lid layer can be patterned and etc... | 04/03/2012 |
| 8148793 | Three dimensional integrated passive device and method of fabrication An integrated passive device (20) includes a first wafer (22), a first integrated device (28) formed on a first surface (24) of the wafer (22), and a second integrated device (30) formed on a second surface (26) of th... | 04/03/2012 |
| 8148792 | Pressure sensor and method for manufacturing the pressure sensor A pressure sensor of the present invention includes a lower substrate which has an insulating layer having a through-hole penetrating from one side to the other side, and an active layer formed to have a uniform thickness on the insulating layer and having a portion... | 04/03/2012 |
| 8138560 | Microstructure, micromachine, and manufacturing method of microstructure and micromachine Without sacrificial layer etching, a microstructure and a micromachine are manufactured. A separation layer 102 is formed over a substrate 101, and a layer 103 to be a movable electrode is formed over the separation layer 102. At an inter... | 03/20/2012 |
| 8134214 | Electronic device, system, and method comprising differential sensor MEMS devices and drilled substrates Electronic device which comprises a substrate provided with at least one passing opening, a MEMS device with function of differential sensor provided with a first and a second surface and of the type comprising at least one portion sensitive to chemical and/or physi... | 03/13/2012 |
| 8129802 | Integrated micro electro-mechanical system and manufacturing method thereof In the manufacturing technology of an integrated MEMS in which a semiconductor integrated circuit (CMOS or the like) and a micro machine are monolithically integrated on a semiconductor substrate, a technology capable of manufacturing the integrated MEMS without usi... | 03/06/2012 |
| 8129801 | Discrete stress isolator attachment structures for MEMS sensor packages A discrete stress isolation apparatus for a Micro Electro-Mechanical System (MEMS) inertial sensor device having a mechanism die and a package. A capacitive device mechanism is formed in a substrate layer positioned between the mechanism die and package substrate. A... | 03/06/2012 |
| 8129803 | Micromachined microphone and multisensor and method for producing same A micromachined microphone is formed from a silicon or silicon-on-insulator (SOI) wafer. A fixed sensing electrode for the microphone is formed from a top silicon layer of the wafer. Various polysilicon microphone structures are formed above a front side of the top ... | 03/06/2012 |
| 8115266 | MEMS device having a movable electrode A microelectromechanical system (MEMS) device includes a semiconductor substrate, a MEMS including a fixed electrode and a movable electrode formed on the semiconductor substrate through an insulating layer, and a well formed in the semiconductor substrate below the... | 02/14/2012 |
| 8106470 | Triple-axis MEMS accelerometer having a bottom capacitor An integrated circuit structure includes a substrate having a top surface; a first conductive layer over and contacting the top surface of the substrate; a dielectric layer over and contacting the first conductive layer, wherein the dielectric layer includes an open... | 01/31/2012 |
| 8093667 | Flexible gate electrode device for bio-sensing Briefly, disclosed is an apparatus and method for detecting an analyte wherein a flexible gate electrode may respond to mechanical stress and/or electrostatic changes induced by bonding of a biomolecular probe and an analyte. ... | 01/10/2012 |
| 8089131 | Micro movable device A micro movable device includes a protection cap for protecting a movable unit arranged above a semiconductor substrate and the movable unit, signal line for transmitting a high-frequency signal formed above the semiconductor substrate, and insulation layer that has... | 01/03/2012 |
| 8063456 | Mechanical switch with a curved bilayer An apparatus includes a mechanical switch. The mechanical switch includes a bilayer with first and second stable curved states. A transformation of the bilayer from the first state to the second state closes the switch. ... | 11/22/2011 |
| 8063455 | Multi-terminal electromechanical nanocsopic switching device with control and release electrodes A multi-terminal electromechanical nanoscopic switching device which may be used as a memory device, a pass gate, a transmission gate, or a multiplexer, among other things. ... | 11/22/2011 |
| 8053850 | Minute structure, micromachine, organic transistor, electric appliance, and manufacturing method thereof A micromachine is generally formed using a semiconductor substrate such as a silicon wafer. One of the objects of the present invention is to realize further reduction in cost by integrating a minute structure and a semiconductor element controlling the minute struc... | 11/08/2011 |
| 8035176 | MEMS package and packaging method thereof Provided are a Micro Electro-Mechanical System (MEMS) package and a method of packaging the MEMS package. The MEMS package includes: a MEMS device including MEMS structures formed on a substrate, first pad electrodes driving the MEMS structures, first sealing parts ... | 10/11/2011 |
| 8026560 | Ultra-sensitive detection techniques Techniques for ultra-sensitive detection are provided. In one aspect, a detection device is provided. The detection device comprises a source; a drain; a nanowire comprising a semiconductor material having a first end clamped to the source and a second end clamped t... | 09/27/2011 |
| 8022490 | Micro electro-mechanical sensor (MEMS) fabricated with ribbon wire bonds A micro electro-mechanical sensor is provided. The micro electro-mechanical sensor includes a substrate, and a conducting plane disposed on the substrate. A conducting via is disposed on the substrate, such as adjacent to the conducting plane. A plurality of ribbon ... | 09/20/2011 |
| 8022491 | High aspect ratio all SiGe capacitively coupled MEMS devices A method that includes forming an opening between at least one first electrode and a second electrode by forming a recess in a first electrode layer, the recess having sidewalls that correspond to a surface of the at least one first electrode, forming a first sacrif... | 09/20/2011 |
| 8013403 | Sensor apparatus for detecting variations in a dynamic quantity while suppressing detection deviations that are caused by bending deformation of a sensor chip A miniaturized sensor such as a micro-accelerometer includes a sensor chip having a sensor element mounted thereon, with the sensor element being oriented with its central axes passing through the corners of the sensor chip. The corners of the sensor element are the... | 09/06/2011 |
| 8013404 | Folded lead-frame packages for MEMS devices The MEMS package comprises a first and a second pre-molded lead-frame substrate, at least one of them having a cavity formed by plastic sidewalls along its periphery. The first and second pre-molded lead-frame substrates are interconnected with metal leads. At least... | 09/06/2011 |
| 8008736 | Analog interferometric modulator device Disclosed is new architecture of microelectromechanical system (MEMS) device. The device has a partially reflective optical layer, a deformable mechanical layer and a mirror layer, each of which forms an independent electrode. A support post separates the optical la... | 08/30/2011 |
| 8008738 | Integrated differential pressure sensor An integrated differential pressure sensor includes, in a monolithic body of semiconductor material, a first face and a second face, a cavity extending at a distance from the first face and delimited therewith by a flexible membrane formed in part by epitaxial mater... | 08/30/2011 |
| 8008737 | Semiconductor device A micromachine includes a microstructure and a semiconductor element formed over one insulating substrate. The micromachine includes including a movable layer containing polycrystalline silicon and a space below or above the layer. Such polycrystalline silicon is fo... | 08/30/2011 |
| 8004052 | Three-dimensional analog input control device A method and device for one or more dimensional input control of different functions in electronic devices is provided. Certain versions of the Present Invention provide a one or more dimensional input force interface control device for cell phones, portable gamers,... | 08/23/2011 |
| 7999335 | Micromachine and method for manufacturing the same A structure which prevents thinning and disconnection of a wiring is provided, in a micromachine (MEMS structure body) formed with a surface micromachining technology. A wiring (upper auxiliary wiring) over a sacrificial layer is electrically connected to a differen... | 08/16/2011 |
| 7989905 | MEMS device having a movable electrode A microelectromechanical system (MEMS) device includes a semiconductor substrate, a MEMS including a fixed electrode and a movable electrode formed on the semiconductor substrate through an insulating layer, and a well formed in the semiconductor substrate below the... | 08/02/2011 |
| 7973374 | Semiconductor device and method for fabricating the same Embodiments relate to a semiconductor device and a method for fabricating the same. According to embodiments, a semiconductor device may include a metal film spaced from a semiconductor substrate at a predetermined interval and in which a plurality of etching holes ... | 07/05/2011 |
| 7968958 | Semiconductor device and manufacturing method of the same A semiconductor device includes: a sensor element having a plate shape with a surface and including a sensor structure disposed in a surface portion of the sensor element; and a plate-shaped cap element bonded to the surface of the sensor element. The cap element ha... | 06/28/2011 |
| 7960805 | MEMS structure with suspended microstructure that includes dielectric layer sandwiched by plural metal layers and the dielectric layer having an edge surrounded by peripheral metal wall An MEMS structure and a method of manufacturing the same are provided. The MEMS structure includes a substrate and at least one suspended microstructure located on the substrate. The suspended microstructure includes a plurality of metal layers, at least one dielect... | 06/14/2011 |
| 7960804 | Latching zip-mode actuated mono wafer MEMS switch A latching zip-mode actuated mono wafer MEMS switch especially suited to capacitance coupled signal switching of microwave radio frequency signals is disclosed. The single wafer fabrication process used for the switch employs sacrificial layers and liquid removal of... | 06/14/2011 |
| 7956428 | Microelectromechanical devices and fabrication methods There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packagin... | 06/07/2011 |
