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| Number | Title | Issue Date |
| 8183649 | Buried aperture nitride light-emitting device A buried aperture in a nitride light emitting device is described. The aperture is formed in an aperture layer, typically an amorphous or polycrystalline material over an active layer that includes a nitride material. The aperture layer material typically also inclu... | 05/22/2012 |
| 8183648 | Nanoscopic electrode molecular probes The present invention relates to a method and apparatus for enhancing the electron transport property measurements of a molecule when the molecule is placed between chemically functionalized carbon-based nanoscopic electrodes to which a suitable voltage bias is appl... | 05/22/2012 |
| 8174082 | Micromechanical component having multiple caverns, and manufacturing method A micromechanical component having at least two caverns is provided, the caverns being delimited by the micromechanical component and a cap, and the caverns having different internal atmospheric pressures. The micromechanical component and cap are hermetically joine... | 05/08/2012 |
| 8154093 | Nano-electronic sensors for chemical and biological analytes, including capacitance and bio-membrane devices Embodiments of nanoelectronic sensors are described, including sensors for detecting analytes inorganic gases, organic vapors, biomolecules, viruses and the like. A number of embodiments of capacitive sensors having alternative architectures are described. Particula... | 04/10/2012 |
| 8154092 | Silicon carbide MEMS structures and methods of forming the same MEMS structures that include silicon carbide micromechanical components, as well as methods of forming and using the same, are provided. The silicon carbide micromechanical components may be integrated on the same structure with electronic components that control or... | 04/10/2012 |
| 8115265 | Interconnection system on a plane adjacent to a solid-state device structure An interconnection system is provided for a solid-state device. The solid-state that includes, a first layer, multiple devices and a first face. A second layer is bonded to the first face at a bonded face of the second layer that faces the first face. Electrically c... | 02/14/2012 |
| 8102014 | Proximity head heating method and apparatus Provided is an apparatus and a method for heating fluid in a proximity head. A method for semiconductor wafer processing, includes providing liquid to a proximity head including a heating portion, heating the liquid within the heating portion of the proximity head a... | 01/24/2012 |
| 8067810 | Self-actuating RF MEMS device by RF power actuation Systems and methods for controlling a micro electromechanical device using power actuation are disclosed. The disclosed micro electromechanical systems comprise at least one electrostatically actuatable micro electromechanical device and an actuation device. The mic... | 11/29/2011 |
| 8063454 | Semiconductor structures including a movable switching element and systems including same Semiconductor structures including a movable switching element having a base disposed on a conductive pad, a body extending from the base, and an end laterally adjacent and spaced apart from a conductive contact are disclosed. Upon application of a threshold voltage... | 11/22/2011 |
| 8039909 | Semiconductor nanowires charge sensor A semiconductor nanowire is coated with a chemical coating layer that comprises a functional material which modulates the quantity of free charge carriers within the semiconductor nanowire. The outer surface of the chemical coating layer includes a chemical group th... | 10/18/2011 |
| 8035175 | Field effect transistor for detecting ionic material and method of detecting ionic material using the same A field effect transistor for detecting ionic material and a method of detecting ionic material using the field effect transistor. The field effect transistor for detecting ionic material includes a substrate formed of a semiconductor material, a source region and a... | 10/11/2011 |
| 8026559 | Biosensor devices and method for fabricating the same A biosensor device is provided, including a first semiconductor layer formed over an interconnect structure. A plurality of detection elements are formed in the first semiconductor layer. An optical filter layer is formed over and physically contacts the first semic... | 09/27/2011 |
| 8018009 | Forming large planar structures from substrates using edge Coulomb forces A movable substrate is placed over a bottom substrate where both substrates contain Coulomb islands. The Coulomb islands can be adjusted in charge and are used to develop a force between two opposing Coulomb islands. Information from sensors is applied to a control ... | 09/13/2011 |
| 8008735 | Micromachine device with a spatial portion formed within A semiconductor element of the electric circuit includes a semiconductor layer over a gate electrode. The semiconductor layer of the semiconductor element is formed of a layer including polycrystalline silicon which is obtained by crystallizing amorphous silicon by ... | 08/30/2011 |
| 7994592 | Method for integrating micro and nanoparticles into MEMS and apparatus including the same MEMs devices are integrally fabricated with included micro or nanoparticles by providing a mixture of a sacrificial material and a multiplicity of particles, disposing the mixture onto a substrate, fabricating a MEMs structure on the substrate including at least par... | 08/09/2011 |
| 7994593 | Quantum wire sensor and methods of forming and using same A solid-state field-effect transistor device for detecting chemical and biological species and for detecting changes in radiation is disclosed. The device includes a quantum wire channel section to improve device sensitivity. The device is operated in a fully deplet... | 08/09/2011 |
| 7989904 | Micro-electromechanical device and manufacturing method thereof A micro-electromechanical device includes a substrate, a first patterned conductive layer, a second patterned conductive layer and a first patterned blocking layer. The first patterned conductive layer is disposed on the substrate. The second patterned conductive la... | 08/02/2011 |
| 7986017 | Semiconductor sensor and method for manufacturing the same A semiconductor sensor includes: a semiconductor substrate; a plurality of piezoelectric thin films layered on the semiconductor substrate, the plurality of piezoelectric thin films including at least a pair of the piezoelectric thin films layered above and below; a... | 07/26/2011 |
| 7977756 | Semiconductor storage device using magnetoresistive effect element and method of manufacturing the same A semiconductor storage device includes a semiconductor substrate, a source region, a source line, and a bit line. The source region is formed in an element region formed on the semiconductor substrate. The source line is formed to overlap with the source region in ... | 07/12/2011 |
| 7973373 | Microminiature moving device A microminiature moving device has disposed on a single-crystal silicon substrate movable elements such as a movable rod and a movable comb electrode that are displaceable in parallel to the substrate surface and stationary parts that are fixedly secured to the sing... | 07/05/2011 |
| 7956427 | Nanosensors Electrical devices comprised of nanowires are described, along with methods of their manufacture and use. The nanowires can be nanotubes and nanowires. The surface of the nanowires may be selectively functionalized. Nanodetector devices are described. ... | 06/07/2011 |
| 7948041 | Sensor having a thin-film inhibition layer Sensors and detection systems suitable for measuring analytes, such as biomolecule, organic and inorganic species, including environmentally and medically relevant volatiles and gases, such as NO, NO2, CO2, NH3, H2, CO and the like, are provided. Certain embodiments... | 05/24/2011 |
| 7928520 | Micro-fluidic structure A microfabricated structure that includes a first layer of material on a substrate, and a second layer of material over the first layer that forms an encapsulated cavity, and a structural support layer added to the second layer. Openings can be formed in the cavity,... | 04/19/2011 |
| 7923789 | Method of fabricating reflective spatial light modulator having high contrast ratio The contrast offered by a spatial light modulator device may be enhanced by positioning nonreflective elements such as supporting posts and moveable hinges, behind the reflecting surface of the pixel. In accordance with one embodiment, the reflecting surface is susp... | 04/12/2011 |
| 7911009 | Nanosensors Electrical devices comprised of nanowires are described, along with methods of their manufacture and use. The nanowires can be nanotubes and nanowires. The surface of the nanowires may be selectively functionalized. Nanodetector devices are described. ... | 03/22/2011 |
| 7898044 | MEMS sensor and production method of MEMS sensor An MEMS sensor of the present invention includes a substrate, a lower thin film provided on a surface of the substrate, an upper thin film opposed to the lower thin film at an interval on the side opposite to the substrate, and a wall portion surrounding the lower t... | 03/01/2011 |
| 7898043 | Package, in particular for MEMS devices and method of making same A package includes a substrate provided with a passing opening and a MEMS device. The MEMS device includes an active surface wherein a portion of the MEMS device is integrated sensitive to the chemical/physical variations of a fluid. The active surface of the MEMS d... | 03/01/2011 |
| 7893510 | High temperature-stable sensor A high temperature-stable sensor is provided in which electrodes on a substrate or an insulation layer are in contact with a sensitive layer, wherein the electrodes have platinum, rhodium, or iridium or an electrically conductive oxide layer. For this purpose, an in... | 02/22/2011 |
| 7880244 | Wafer level CSP sensor An electronics package has a wafer level chip scale package (WLCSP) die substrate containing electronic circuits. Through-silicon vias through the die substrate electrically connect the electronic circuits to the bottom surface of the die substrate. A package sensor... | 02/01/2011 |
| 7880245 | Electronic device and method for manufacturing thereof An electronic device, including a substrate, a functional structure constituting a functional element formed on the substrate, and a cover structure forming a cavity portion in which the functional structure is disposed, is disclosed. In the electronic device, the c... | 02/01/2011 |
| 7875941 | Thin film encapsulation of MEMS devices A method of manufacturing a miniature electromechanical system (MEMS) device includes the steps of forming a moving member on a first substrate such that a first sacrificial layer is disposed between the moving member and the substrate, encapsulating the moving memb... | 01/25/2011 |
| 7875940 | Micromachine and production method thereof A micromachine for a high-frequency filter which has a high Q value and a higher frequency band is provided. The micromachine includes an electrode provided on a substrate, an inter-layer insulation film composed of a first insulation film and a second insulation fi... | 01/25/2011 |
| 7872319 | Deflectable structure, micromechanical structure comprising same, and method for adjusting a micromechanical structure A deflectable structure includes a layer having a first area and a second area, a trench structure in the layer which penetrates the layer and separates the first area from the second area, a first junction between the first area and the second area, and a second ju... | 01/18/2011 |
| 7872318 | Sensing devices and methods for forming the same A sensing device includes an optical cavity having two substantially opposed reflective surfaces. At least one nanowire is operatively disposed in the optical cavity. A plurality of metal nanoparticles is established on the at least one nanowire. ... | 01/18/2011 |
| 7868399 | Semiconductor sensing device A semiconductor sensing device in which a sensing layer is exposed to a medium being tested in an area below and/or adjacent to a contact. In one embodiment, the device comprises a field effect transistor in which the sensing layer is disposed below a gate contact. ... | 01/11/2011 |
| 7863696 | Semiconductor sensor and method for manufacturing the same A semiconductor sensor includes: a semiconductor substrate; a plurality of piezoelectric thin films layered on the semiconductor substrate, the plurality of piezoelectric thin films including at least a pair of the piezoelectric thin films layered above and below; a... | 01/04/2011 |
| 7855423 | Semiconductor mount A mount for a semiconductor device has a first surface with at least one contact region and a second surface. The mount has a substrate to receive the second surface of the semiconductor device and a planar element. The planar element has an aperture sized to surrou... | 12/21/2010 |
| 7838951 | Semiconductor sensor and manufacturing method of the same A semiconductor sensor and a manufacturing method of the same capable of making the specific gravity of a weight part to be greater than that of a weight part made of semiconductor material only is disclosed. The semiconductor sensor includes the weight part, a supp... | 11/23/2010 |
| 7838950 | Electro-mechanical component, such as a strained Si Fin-FET The present invention is an electro mechanical component, such as a nano-electro-mechanical component, having a first, a second and a third portion arranged such that the second portion is used to functionally connect the first and the third portion. In the present ... | 11/23/2010 |
| 7838949 | Porous gas sensors and method of preparation thereof A sensor is disclosed. A representative sensor includes a silicon substrate having a porous silicon region. A portion of the porous silicon region has a front contact is disposed thereon. The contact resistance between the porous silicon region and the front contact... | 11/23/2010 |
