Quotables
"What, sir, would you make a ship sail against the wind and currents by lighting a bonfire under her deck? I pray you, excuse me, I have not the time to listen to such nonsense."
Napoleon Bonaparte ; When told of the Robert Fulton steamboat
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| Number | Title | Issue Date |
| 8013359 | Optically controlled electrical switching device based on wide bandgap semiconductors A power switching device includes an optically controlled component using a semiconducting carbon nanotube. An optical signal transmitted over an optical fiber controls the conductivity of the nanotube. The nanotube transmits a signal controlled by the optical signa... | 09/06/2011 |
| 7948004 | Light source head and image forming apparatus A self-scanning light source head comprising: a substrate, surface emitting semiconductor lasers arranged in an array on the substrate, and at least one thyristor disposed on the substrate and serving as a switching element selectively turning ON and OFF light emiss... | 05/24/2011 |
| 7397066 | Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers Microelectronic imagers with curved image sensors and methods for manufacturing curved image sensors. In one embodiment, a microelectronic imager device includes an imager die having a substrate, a curved microelectronic image sensor having a face with a convex and/... | 07/08/2008 |
| 7352010 | Photoelectric conversion module with cooling function A photoelectric conversion module with a cooling function has a semiconductor element to transmit/receive an optical signal, a stem to fix the semiconductor element, a cap to cover the semiconductor element, and a lead to apply an electrical signal to the semiconduc... | 04/01/2008 |
| 7323730 | Optically-configurable nanotube or nanowire semiconductor device The invention relates to a semiconductor device comprising at least two electrodes and at least one nanotube or nanowire, in particular a carbon nanotube or nanowire, the device including at least one semiconductive nanotube or nanowire having at least one region th... | 01/29/2008 |
| 7250674 | Coolant cooled type semiconductor device A coolant cooled type semiconductor device capable of achieving a superior heat radiation capability is provided, while having a simple structure. While a plurality of semiconductor modules are arranged in such a manner that main surface directions of these semicond... | 07/31/2007 |
| 7247877 | Integrated carbon nanotube sensors A method and structure for an integrated circuit comprising a first transistor and an embedded carbon nanotube field effect transistor (CNT FET) proximate to the first transistor, wherein the CNT FET is dimensioned smaller than the first transistor. The CNT FET is a... | 07/24/2007 |
| 7242699 | Wavelength tunable semiconductor laser apparatus The present invention relates to wavelength tunable DBR semiconductor laser devices in which light waves generated from a plurality of laser portions (or laser channels) are combined. This type of semiconductor laser device requires that the laser channels together ... | 07/10/2007 |
| 7233027 | Arrangement comprising at least two different electronic semiconductor circuits The invention relates to an arrangement comprising at least two different electronic semiconductor circuits (HS) in which each of the semiconductor circuits (HS) is a component made of semiconductor material and which has an electrically active surface and electroni... | 06/19/2007 |
| 7214971 | Semiconductor light-receiving device A semiconductor light-receiving device has a substrate including upper, middle and lower regions in its front side. A p-type layer on the lower region has a top surface including a portion on a level with the middle region. An electrode covers at least part of the b... | 05/08/2007 |
| 7193303 | Supporting frame for surface-mount diode package A supporting frame is used to solidly bridge to the two metallic contacts of a surface mount diode chip. Any bending or twisting stress between the two contacts is borne by the supporting frame instead of the diode chip. Otherwise the stress may damage the diode chi... | 03/20/2007 |
| 7178994 | Fiber optic circuit connector A circuit board uses both electrical and optical connectors to carry signals in both electrical and light form. The optical connector employs redundant alignment features to provide for reliable connectivity between plug in boards and the electro-optic back plane. A... | 02/20/2007 |
| 7157747 | Bidirectional photothyristor chip, light-fired coupler and solid state relay A channel isolation region 42 is formed over the entire width of an N-type silicon substrate 41, and photothyristors, in each of which an anode diffusion region 43, a P-gate diffusion region 44, a cathode diffusion region 45 are fo... | 01/02/2007 |
| 7153037 | Multichannel optical communications module 250 μm is the standardized pitch H of the prevalent multichannel ribbonfibers. Current laser diodes and photodiodes have a size larger than 300 μm. Curving lightpaths made on a silicon bench for reconciling the chip size with current ribbonfibers causes bending po... | 12/26/2006 |
| 7112827 | Tunable wavelength laser A light oscillation part including an active layer for generating light by current injection, a tuning layer with an intermediate layer formed between the active layer and the tuning layer, for varying an oscillation wavelength by current injection and a diffraction... | 09/26/2006 |
| 7102185 | Lightshield architecture for interline transfer image sensors An interline transfer type image sensing device that can be operated at high speed and with low image smear is described. The device incorporates a refractory metal layer which is used for both a light shield over the vertical charge transfer region and as a wiring ... | 09/05/2006 |
| 7095101 | Supporting frame for surface-mount diode package A supporting frame is used to solidly bridge to the two metallic contacts of a surface mount diode chip. Any bending or twisting stress between the two contacts is borne by the supporting frame instead of the diode chip. Otherwise the stress may damage the diode chi... | 08/22/2006 |
| 7057214 | Light-activated semiconductor switches Semiconductor switches, such as thyristors, may be light activated by introducing the light into the switch via a groove having a sloped surface to receive the triggering light. The use of a sloped surface increases the surface path length between points of differen... | 06/06/2006 |
| 7033935 | Semiconductor device and method for manufacturing the same The invention simplifies the manufacturing processes and increases the yield. A semiconductor wafer equipped with a plurality of semiconductor chip forming sections is prepared. An electrical characteristic examination is conducted for each of the semiconductor chip... | 04/25/2006 |
| 6995443 | Integrated circuits using optical fiber interconnects formed through a semiconductor wafer An integrated circuit with a number of optical fibers that are formed in high aspect ratio holes. The high aspect ratio holes extend through a semiconductor wafer. The optical fibers include a cladding layer and a core formed in the high aspect ratio hole. These opt... | 02/07/2006 |
| 6900508 | Embedded flat film molding A flat filter layer is received between upper and lower mold portions of a mold for packaging an integrated circuit sensor device, held by the mold over and in contact with the integrated circuit's sensing surface, in light compression between the sensing surface an... | 05/31/2005 |
| 6809355 | Solid-state imaging device A solid-state imaging device having a gate structure including an oxide film and a nitride film includes upper layer films (for example, a planarization film, an insulating film, and a protective film) allowing ultraviolet rays having a wavelength of 400 nm or less ... | 10/26/2004 |
| 6614055 | Surface light-emitting element and self-scanning type light-emitting device A surface light-emitting element having improved external light emission efficiency and a self-scanning light-emitting device using this surface light-emitting element are provided. To improve external light-emission efficiency, the light-emitting center ... | 09/02/2003 |
| 6489177 | Modulator-integrated semiconductor laser and method of fabricating the same A semiconductor laser is fabricated on a substrate having a laser section and a modulator section by forming a light waveguide having an active layer that extends across the laser section and the modulator section from a high reflectivity end portion to a... | 12/03/2002 |
| 6472691 | Distributed feedback semiconductor laser device A DFB semiconductor laser device including: a semiconductor substrate; and an active layer and a diffraction grating overlying the semiconductor substrate, the diffraction grating having a composition of GaInNAs(Sb) and absorbing light having a laser emis... | 10/29/2002 |
| 6100595 | Semiconductor device having optoelectronic remote signal-exchange means A semiconductor device includes a chip forming an integrated circuit; a connection substrate; an internal coupling mechanism; and at least one optical communication system. The connection substrate comprises an external coupling mechanism for electrically... | 08/08/2000 |
| 6051884 | Method of forming interconnections in an integrated circuit The invention provides a method for producing wiring and contacts in an integrated circuit including the steps of forming insulated gate components on a semiconductor substrate; applying a photo-reducible dielectric layer to cover the substrate; etching h... | 04/18/2000 |
| 6025610 | Solid relay and method of producing the same A solid relay having a light emitter and a photodetector and a method of producing the same are disclosed. A planer thyristor, photodiode, phototransistor or similar photodetector is formed on an Si substrate or wafer. The surface of the photodetector is ... | 02/15/2000 |
| 5929474 | Active matrix OED array An active matrix OED array includes an array area defined on a semiconductor substrate defining rows and columns of pixels and driver areas spaced from the array area with driver circuits including row drivers coupled to row buses and column drivers coupl... | 07/27/1999 |
| 5847416 | Phototrigger thyristor A light travelling from a light transmission window (8) to a light receiving part (2) is transmitted first through a first light guide (11) of linear single core construction and next through a second light guide (12) which is bent and of multicore constr... | 12/08/1998 |
| 5801429 | Semiconductor device It is an object of the present invention to fix a semiconductor substrate and a thermal compensating plate in the alloy-free structure. An insulation resin (23) for side wall protection fixed on the outer periphery of a semiconductor substrate (1) and a p... | 09/01/1998 |
| 5747835 | Serial arrangement of photothyristors A serial arrangement of photosensitive components of the planar-type has a first main surface on which a first photosensitive junction appears at the surface and a second main surface. The components are piled so that the second main surface of a componen... | 05/05/1998 |
| 5663580 | Optically triggered semiconductor device A semiconductor device comprises a semiconductor layer of SiC having an active area through which the device is adapted to be triggered by light incident thereon and means for generating and emitting light with an energy exceeding the bandgap, being the e... | 09/02/1997 |
| 5596210 | Light trigger type semiconductor device with reflection prevention film An object of the present invention is to enhance the transmission efficiency of light signals. An output end of a light guide is coupled to a light receiving portion of a semiconductor substrate with an optical coupling agent. Reflection preventing films ... | 01/21/1997 |
| 5468976 | Semi conductor rectifying module A semiconductor rectifying module has a metal base, a dielectric heat conducting spacer arranged on the metal base and rectifying elements of anode and cathode groups arranged with their cathodes and anodes on the spacer, the rectifying elements being com... | 11/21/1995 |
| 5434939 | Optical fiber module with surface emitting laser An optical fiber module comprises a light-emitting chip based on a semiconductor substrate, a vertical cavity surface emitting laser formed on a primary plane of the light-emitting chip, a guiding hole opened on a secondary plane of the light-emitting chi... | 07/18/1995 |
| 5424573 | Semiconductor package having optical interconnection access A semiconductor package includes a semiconductor chip, an interconnection substrate having the semiconductor chip mounted on one surface of the interconnection substrate, and a package base having the interconnection substrate mounted on one surface of th... | 06/13/1995 |
| 4945400 | Subassembly for optoelectronic devices A subassembly for use in packaging an optoelectronic device (e.g., LED or photodiode) includes a semiconductor (e.g., silicon) base and lid having a variety of etched features (e.g., grooves, cavities, alignment detents) and metalization patterns (e.g., c... | 07/31/1990 |
| 4866500 | Integrated light-triggered and light-quenched static induction thyristor and making method thereof An integrated light-triggered and light-quenched static induction thyristor and fabrication process thereof adapted in such a manner that an integrated SIPT operates in the normal mode in order to enhance current gain, tail current generated at the light-... | 09/12/1989 |
| 4862231 | Non-contact I/O signal transmission in integrated circuit packaging The I/O ports of a packaged IC includes a plurality of optical conduits in the package adjacent electro-optical transmitters and receivers throughout the die spaced from the periphery of the die. The method of assembling the die in the package includes us... | 08/29/1989 |
