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Class 252/62.3C - Binary alloy or carbide; e.g., Al, In, LiC


Subclass of Class 252 - Compositions
No. of patents: 20
Last issue date: 01/06/2004


NumberTitleIssue Date
6672330Valve bonded with corrosion and wear proof alloy and apparatuses using said valve
A valve is characterized by excellent corrosion and wear resistance and maintainability due to use of a bonding corrosion and wear proof alloy containing non-continuously distributed eutectic carbide on the sliding portions of various types of apparatuses...
01/06/2004
6645393Material compositions for transient voltage suppressors
The material for transient voltage suppressors is composed of at least two kinds of evenly-mixed powders including a powder material with non-linear resistance interfaces and a conductive powder. The conductive powder is distributed in the powder with non...
11/11/2003
6602438Structure for polymeric thermistor and method of making the same
A structure for polymeric thermistor device and method of making the same are disclosed. The polymeric thermistor makes use of a polymeric composite filled with conductive filler and show resistance variations at different temperatures. A polymeric substr...
08/05/2003
6589488Molding for supporting a monolith in a catalytic converter
An immobilizing structure for use in immobilizing a ceramic monolith in a catalytic converter employs a molding which comprises finely divided metal oxide and fibers which do not represent a health risk, has a density of 100-240 kg/m3, and has ...
07/08/2003
6273969Alloys and methods for their preparation
The present invention relates to an alloy comprising a first element A, a second element B, a third element C, and a fourth element D. In the alloy, first element A and second element B are present as a binary compound AB, and third element C and fourth e...
08/14/2001
6025289Colorless silicon carbide crystals
Large single crystals of silicon carbide are grown in a furnace sublimation system. The crystals are grown with compensating levels of p-type and n-type dopants (i.e., roughly equal levels of the two dopants) in order to produce a crystal that is essentia...
02/15/2000
5611955High resistivity silicon carbide substrates for high power microwave devices
A substrate for use in semiconductor devices, fabricated of silicon carbide and having a resistivity of greater than 1500 Ohm-cm. The substrate being characterized as having deep level impurities incorporated therein, wherein the deep level elemental impu...
03/18/1997
5200805Silicon carbide:metal carbide alloy semiconductor and method of making the same
A new type of semiconductor material is disclosed which consists of a ଲ-SiC:metal carbide alloy having the general formula Siw (metal 1)x (metal 2)y (metal 3)z C, where w+x+y+z=1 and 1>w>0. The metals are ...
04/06/1993
5082806Semi-conducting ceramic
A semi-conducting ceramic is disclosed. The ceramic consists essentially of from 50 percent to 72 percent of silicon carbide particles, from 25 percent to 47 percent of silicon nitride particles and a modified silicon oxynitride glass bonded to the silico...
01/21/1992
5028346Semi-conducting ceramic
A semi-conducting ceramic is disclosed. The ceramic consists essentially of from 50 percent to 72 percent of silicon carbide particles, from 25 percent to 47 percent of silicon nitride particles and a modified silicon oxynitride glass bonded to the silico...
07/02/1991
5002905Hexagonal silicon carbide platelets and preforms and methods for making and using same
Crystalline silicon carbide wherein at least 90 weight percent of the silicon carbide is formed from a plurality of hexagonal crystal lattices wherein at least 80 weight percent of the crystals formed from the lattices contain at least a portion of opposi...
03/26/1991
4914042Forming a transition metal silicide radiation detector and source
Transition metal silicide semiconductor electromagnetic radiation source and detectors have a thin film of semiconducting silicide grown or deposited on a silicon wafer. The transition metals are chosen from a group consisting of iron, iridium, manganese,...
04/03/1990
4874438Intermetallic compound semiconductor thin film and method of manufacturing same
An intermetallic compound semiconductor thin film comprises a single crystalline deposition thin film made of a III-V group intermetallic compound having a stoichiometry composition ratio of 1:1. When forming the III-V group semiconductor thin film by an ...
10/17/1989
4499331Amorphous semiconductor and amorphous silicon photovoltaic device
An amorphous silicon semiconductor of the general formula: a-Si.sub.(1-x-y) Cx Ny containing hydrogen and/or fluorine, which provides an amorphous silicon PIN junction photovoltaic device having an improved conversion efficiency when...
02/12/1985
4489128Structure containing epitaxial crystals on a substrate
Crystals of silicon carbide and aluminum nitride, substrates containing same, and the fabrication thereof....
12/18/1984
4209474Process for preparing semiconducting silicon carbide sintered body
A silicon carbide sintered body exhibiting N-type semiconductivity is produced by shaping a mixture of ଲ-silicon carbide, boron additive and a carbonaceous additive into a green body and sintering the body in an atmosphere containing nitrogen to pro...
06/24/1980
4147572Method for epitaxial production of semiconductor silicon carbide utilizing a close-space sublimation deposition technique
A method of producing epitaxial semiconductor monocrystal materials of silicon carbide with the silicon carbide crystals being grown by crystallizing sublimed silicon carbide vapors....
04/03/1979
4032371Method of making a thermo-element
The invention relates to a method of making a thermo-element having two sections with two electric conductor materials of different thermo-electric properties connected in series. The method involves forming a porous base body with interconnected pores an...
06/28/1977
3960619Process for preparing layers of silicon carbide on a silicon substrate
In a process for producing an epitaxial layer of hexagonal silicon carbide on a silicon monocrystal substrate by simultaneous reduction or thermal decomposition of a gas mixture containing silicon halides and organosilanes, or mixtures thereof, hydrocarbo...
06/01/1976
3956032Process for fabricating SiC semiconductor devices
Sections are cut from a SiC platelet such that the sections have a-faces parallel to the c-axis of the SiC platelet. The sections serve as substrates for the growth of SiC layers by attaching the substrates to a body which is then placed in a chamber and ...
05/11/1976
 
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