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Class 252/514 - Noble metal (gold, silver, ruthenium, rhodium, palladium, osmium, iridium, platinum)


Subclass of Class 252 - Compositions
Definition: Compositions wherein the free metal is a noble metal.
No. of patents: 1095
Last issue date: 05/29/2012


  2                    
NumberTitleIssue Date
7824580Silver-containing aqueous formulation and its use to produce electrically conductive or reflective coatings
A silver-containing, disperse, water-containing formulation and its use to produce electrically conductive and/or optically reflective coatings is described. The formulation contains at least a) 0.5 to 30 parts by wt. of silver metal particles with an e...
11/02/2010
7807073Conductor composition, a mounting substrate and a mounting structure utilizing the composition
A conductor composition being able to easily secure the conductivity at the same level as an Ag bulk at low temperature process, a mounting substrate utilizing the conductor composition and a mounting structure utilizing the conductor composition are provided. In a ...
10/05/2010
7790066Nanorice particles: hybrid plasmonic nanostructures
A new hybrid nanoparticle, i.e., a nanorice particle, which combines the intense local fields of nanorods with the highly tunable plasmon resonances of nanoshells, is described herein. This geometry possesses far greater structural tunability than previous nanoparti...
09/07/2010
7790065Conductive compositions and processes for use in the manufacture of semiconductor devices: Mg-containing additive
Described herein are a silicon semiconductor device and a conductive silver paste for use in the front side of a solar cell device. ...
09/07/2010
7785500Electrically conductive adhesive
The present invention provides an electrically conductive adhesive which prevents migration and sulfuration of a metal component in electronic component mounting. The electrically conductive adhesive includes a thermosetting resin and metal filler particles disperse...
08/31/2010
7780878Lead-free conductive compositions and processes for use in the manufacture of semiconductor devices: Mg-containing additive
Described herein are a silicon semiconductor device and a conductive lead-free silver paste for use in the front side of a solar cell device. ...
08/24/2010
7771625Method for producing surface-treated silver-containing powder and silver paste using surface-treated silver-containing powder
A method for producing a surface-treated silver-containing powder comprises vacuum freeze drying a dispersion liquid, which is obtained by dispersing silver or silver compound particles (a) in a solvent together with a surfactant (b) of an alkylamine type or an alky...
08/10/2010
7767115Metal particle dispersion liquid, method for manufacturing metal particle dispersion liquid, method for manufacturing conductive-film-forming substrate, electronic device and electronic apparatus
A metal particle dispersion liquid comprises: a compound including a sulfur atom; metal particles whose diameter ranges from 1 to 100 nm and made of a material including a precious metal material; and a dispersion medium. The metal particles is covered by the compou...
08/03/2010
7740773Conductive composition and conductive paste
The present invention provides a conductive composition and a conductive paste from which a conductive film having a high conductivity and a low thermal expansion coefficient can be formed. The thermal expansion coefficient of an island fixing type conductive...
06/22/2010
7731867Electrochemical sensor ink compositions, electrodes, and uses thereof
The invention is directed to conductive polymer compositions, catalytic ink compositions (e.g., for use in screen-printing), electrodes produced by deposition of an ink composition, as well as methods of making, and methods of using such compositions and electrodes....
06/08/2010
7731868Thick film conductive composition and process for use in the manufacture of semiconductor device
The present invention is directed to a thick film conductive composition comprising: a) electrically conductive silver powder; b) ZnO powder; c) lead-free glass frits wherein based on total glass frits: Bi2O3: >5 mol %, B2O3
06/08/2010
7727424Paste for solar cell electrodes, method for the manufacture of solar cell electrodes, and the solar cell
Disclosed is an electrically conducting paste comprising a silver powder, a glass frit, a resin binder and a sintering inhibitor. The paste is used in the manufacture of solar cell electrodes by applying the electrically conducting paste to a substrate and then firi...
06/01/2010
7718094Preparation of metallic nanoparticles
A method for the formation of metallic nanoparticles, such as gold and silver nanoparticles, which involves, combining in a single solution, solvent, metal ions and copolymers under conditions such that metal nanoparticles are formed. The copolymers have both reduci...
05/18/2010
7704416Conductor paste for ceramic substrate and electric circuit
A conductor paste for a ceramic substrate contains a) a conductive metal powder comprising a silver powder and a palladium powder; b) a glass powder; and c) an organic solvent, wherein the conductive metal powder has an average particle diameter of not more than 1.2...
04/27/2010
7686983Stable metal/conductive polymer composite colloids and methods for making and using the same
Stable metal/conductive polymer composite colloids and methods for making the same are provided. The subject colloids find use in a variety of different applications, including analyte detection applications. Also provided are kits that include the subject colloids....
03/30/2010
7686982Conductive filler
Disclosed is a conductive filler which can be fusion-bonded under lower temperature conditions (with the peak temperature of not less than 181° C.) than the reflow heat treatment conditions for an Sn-37Pb eutectic solder. This conductive filler is applicable to hea...
03/30/2010
7678296Black conductive thick film compositions, black electrodes, and methods of forming thereof
This invention is directed to black conductive compositions, black electrodes made from such compositions and methods of forming such electrodes. In particular, the invention is directed to a single layer bus electrode. ...
03/16/2010
7666328Thick film conductor composition(s) and processing technology thereof for use in multilayer electronic circuits and devices
The invention relates to thick film conductor compositions which are useful in application to both via-fill and/or line conductors to manufacture of Low Temperature Co-fireable Ceramic (LTCC) devices and other Multilayer Interconnect (MLI) ceramic composite circuits...
02/23/2010
7648655Conductive composition for black bus electrode, and front panel of plasma display panel
The black bus electrode of plasma display panel is formed from a conductive composition comprising a conductive powder, glass powder, organic binder, organic solvent, and black pigment, wherein the conductive powder is coated with metal selected from the group of Ru...
01/19/2010
7648656Process of making a visible polarizing glass
The invention is directed to a silver-containing polarizing boroaluminosilicate glass composition that has been doped with a noble metal selected from the group consisting of Pt, Pd, Os, Ir, Rh and Ru, including mixtures thereof, to nucleate and precipitate silver i...
01/19/2010
7618560Stable metal/conductive polymer composite colloids and methods for making and using the same
Stable metal/conductive polymer composite colloids and methods for making the same are provided. The subject colloids find use in a variety of different applications, including analyte detection applications. Also provided are kits that include the subject colloids....
11/17/2009
7611645Thick film conductor compositions and the use thereof in LTCC circuits and devices
The present invention is directed to a thick film composition for use in low temperature co-fired ceramic circuits comprising, based on weight percent total thick film composition: (a) 30-98 weight percent finely divided particles selected from noble metals, alloys ...
11/03/2009
7608205Decentralized solution of microscopic particles and circuit formation device
Microscopic particle decentralized solution having microscopic particles with different diameters are decentralized, wherein: the microscopic particle decentralized solution has two peaks in a granularity distribution, at a large diameter and a small diameter; and m...
10/27/2009
7604756Preparation of silver particles using thermoplastic polymers
This invention relates to the synthesis and isolation of colloidal silver particles through the use of thermomorphic polymers and the resulting composition. It further relates to the use of the resulting composition in the preparation of inks for printing with silve...
10/20/2009
7569164Solder precoating method
A solder paste composition used in a solder precoating method of forming solder bumps by forming a dam around electrodes on a substrate, filling a solder paste composition on the electrodes within opening parts surrounded by the dam, and heating the solder paste com...
08/04/2009
7560052Silver ink compositions containing a cationic styrene/acrylate copolymer additive for inkjet printing
The present invention provides an aqueous ink containing ≧3% silver particles having much improved adhesion. It has been found that the adhesion can be improved by adding an aqueous cationic dispersion of a styrene/acrylate copolymer, PEI (polyethyleneimine), or a...
07/14/2009
7560051Metal particle dispersion liquid, method for manufacturing metal particle dispersion liquid, method for manufacturing conductive-film-forming substrate, electronic device and electronic apparatus
A metal particle dispersion liquid comprises: a compound including a sulfur atom; metal particles whose diameter ranges from 1 to 100 nm and made of a material including a precious metal material; and a dispersion medium. The metal particles is covered by the compou...
07/14/2009
7556748Method of manufacture of semiconductor device and conductive compositions used therein
The present invention is directed to a thick film conductive composition comprising: (a) electrically conductive silver powder; (b) Zn-containing additive wherein the particle size of said zinc-containing additive is in the range of 7 nanometers to less than 100 nan...
07/07/2009
7494607Electroconductive thick film composition(s), electrode(s), and semiconductor device(s) formed therefrom
The present invention is directed to an electroconductive thick film composition comprising: (a) electroconductive metal particles selected from (1) Al, Cu, Au, Ag, Pd and Pt; (2) alloy of Al, Cu, Au, Ag, Pd and Pt; and (3) mixtures thereof; (3) glass frit wherein s...
02/24/2009
7494608Stabilized silver nanoparticle composition
A composition comprising a liquid and a plurality of silver-containing nanoparticles with a stabilizer, wherein the silver-containing nanoparticles are a product of a reaction of a silver compound with a reducing agent comprising a hydrazine compound in the presence...
02/24/2009
7485245Electrode paste for solar cell and solar cell electrode using the paste
An electrode paste for a solar cell comprising electrically conductive particles, lead-free glass frit, a resin binder and zinc oxide particles, wherein zinc oxide particles having a specific surface area of 6 m2/g or less are contained at 10% by weight o...
02/03/2009
7481953Thick-film resistor paste and thick-film resistor
A thick-film resistor paste comprised of a resistor composition dispersed in an organic vehicle, the resistor composition containing at least one of RuO2 and a Ru composite oxide as a conductive material, a glass composition, a titanate compound of an alk...
01/27/2009
7470380Conductor compositions for use in electronic circuits
A conductive composition consisting essentially of (a) 50-95 wt % finely divided particles of an electrically-conductive material dispersed in (b) a liquid vehicle, for use in the manufacture of an electrically-conductive pattern on a substrate for the use of reduci...
12/30/2008
7462304Conductive compositions used in the manufacture of semiconductor device
The present invention is directed to a thick film conductive composition comprising: (a) electrically conductive silver powder; (b) Mn-containing additive; (c) glass frit wherein said glass frit has a softening point in the range of 300 to 600° C.; dispersed in (d)...
12/09/2008
7442327Use of dispersions in making electronic devices
Dispersions useful in making capacitors, printed circuit boards, etc., comprising an electronic particulate solid, a carrier and a dispersant of formula (1): R—(O-A-CO)x(O—B—CO)y-Z wherein R is hydrogen or a polymerisation terminating group; A is C8-20-alkylen...
10/28/2008
7442226Ultrafine metal powder slurry
In an ultrafine metal powder slurry containing an organic solvent, a surfactant, and an ultrafine metal powder, the surfactant is oleoyl sarcosine, the content of the ultrafine metal powder in the ultrafine metal powder slurry is 70 to 95 percent by mass, and more t...
10/28/2008
7438834Anisotropic conductive adhesive having PTC characteristics
The present invention relates to an anisotropic conductive adhesive comprising an anisotropic conductive adhesive combined with a crystalline polymer to realize anisotropic conductivity and PTC (Positive Temperature Coefficient) characteristics at the same time. The...
10/21/2008
7438835Transparent conductive film, coating liquid for forming such film, transparent conductive layered structure, and display device
This transparent conductive film comprises a single-layer film obtained by coating on a substrate a transparent conductive film-forming coating liquid which contains chainlike agglomerates of noble metal-coated silver microparticles and a binder, the chainlike agglo...
10/21/2008
7435361Conductive compositions and processes for use in the manufacture of semiconductor devices
The present invention is directed to a thick film conductive composition comprising: (a) electrically conductive silver powder; (b) zinc-containing additive; (c) glass frit wherein said glass frit is lead-free; dispersed in (d) organic medium. The present invention ...
10/14/2008
7435360Manufacturing process of conductive composition and a manufacturing process of conductive paste
A manufacturing method of conductive paste comprising arranging process (S20 to S23) of ceramics particles, arranging process (S10 to S14) of wetted metal particles, forming process (S30) of slurry wherein metal particles and ceram...
10/14/2008
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