Bizarre Patents
Cloaking System Using Optoelectronically Controlled Camouflage
A Cloaking System designed to operate in the visible light spectrum, utilizes optoelectronics and/or photonic components to conceal an object within it.
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| Number | Title | Issue Date |
| 8444041 | Brazing system and method A brazing system has a first gas source, a second gas source, a first enclosure, a second enclosure, a brazing torch, and a control system configured to control a ratio of the first gas source and the second gas source. ... | 05/21/2013 |
| 8328067 | Inert environment enclosure A novel inert environment enclosure includes an object inlet where production objects enter the enclosure and an object outlet where the production objects exit. At least one of the object inlet and the object outlet includes both a top-side flow obstructer and a bo... | 12/11/2012 |
| 8205783 | Soldering apparatus In a reflow soldering apparatus, when changing the operation mode from a production mode to a temperature profile mode, a warning-issue-time is set to a point of time (for example, several seconds) before the circuit board reaches an exit of the main body of the sol... | 06/26/2012 |
| 8132707 | Flow soldering apparatus and flow soldering method using a water content sensor The present invention provides a flow soldering apparatus that can suppress the occurrence of soldering defects, even if VOC-free flux or low-VOC flux is applied to an electronic circuit substrate. In other words, the flow soldering apparatus according to the presen... | 03/13/2012 |
| 8042722 | Conductive ball arraying apparatus A conductive ball arraying apparatus includes an arraying jig having ball insertion parts at a predetermined array pattern, a ball cup that has an opening part on a lower surface thereof and is capable of housing a plurality of conductive balls, moving means that mo... | 10/25/2011 |
| 7950564 | Soldering iron device, soldering iron control module and soldering control method thereof A soldering iron control module applied to a soldering iron and a soldering iron stand is provided. The soldering iron stand accommodates the soldering iron which has a soldering iron bit. The soldering iron control module includes a sensing unit and a soldering iro... | 05/31/2011 |
| 7886954 | Solder handling temperature controller with temperature lock mechanism A solder handling temperature controller comprises a body (10) of the solder handling temperature controller, a rotating shaft (77) housed in the body (10) and adapted to be rotatable about its axis, a set temperature changing means (75) ... | 02/15/2011 |
| 7413106 | Method for fixing a miniaturized component to a carrier plate The invention relates to a method, a device and a system for fixing a miniaturized component—especially carrying or containing at least one optical element—to a carrier plate in a highly-precise manner, by means of a soldered joint, a welded joint or an adhesive... | 08/19/2008 |
| 7407081 | Methods and apparatus for transferring conductive pieces during semiconductor device fabrication In a first aspect, a programmable transfer device is provided for transferring conductive pieces to electrode pads of a target substrate. The programmable transfer device includes (1) a transfer substrate; and (2) a plurality of individually addressable electrodes f... | 08/05/2008 |
| 7392924 | Automated ball mounting process and system with solder ball testing An automated ball mounting system is disclosed In which solder balls are tested by heating the solder balls to a temperature between the eutectic temperature of lead-tin and the melting temperature of a lead free solder ball. If the heated solder balls melt they are... | 07/01/2008 |
| 7387229 | Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore A bump forming apparatus which carries out a temperature control of a type different from the conventional art in forming bumps to a semiconductor wafer, and a bump formation method executed by the bump forming apparatus are provided. A bonding stage, a load and tra... | 06/17/2008 |
| 7380697 | Welding condition monitoring device A welding condition monitoring device for monitoring the welding state of a welding work portion by taking an image thereof by an image sensor having a wide dynamic range and capable of taking an image covering a very bright welding portion and relatively dark porti... | 06/03/2008 |
| 7364622 | Method and apparatus for fabricating a device, and the device and an electronic equipment The invention provides an apparatus for fabricating a device, in which a high operation efficiency is maintained in a drying treatment for a multilayer-interconnection device. The device can also be fabricated inexpensively. An apparatus for fabricating a device has... | 04/29/2008 |
| 7353976 | Wire bonder A Wire Bonder contains a bondhead and a rocker arranged on the bondhead that is rotatable on a horizontal axis. A horn with a flange is attached to the rocker in which a capillary is clamped. At least one sensor is attached to the bondhead that detects vibrations of... | 04/08/2008 |
| 7354193 | Clamping device with flexible contact for heat pipe A clamping device with flexible contact for heat pipe includes a clamping body and a thermal couple wire. The clamping body includes a clamping section formed by at least two claws. The thermal couple wire has one end enclosing a pressing element and includes a temp... | 04/08/2008 |
| 7299963 | Temperature sensor for combustion nailer A combustion nailer includes a housing substantially enclosing a combustion engine having a cylinder head, a control unit associated with the housing for controlling operation of the tool, at least one printed circuit board electrically connected to the control unit... | 11/27/2007 |
| 7296725 | Feed devices and methods for injection molded solder systems A solder feeding device having a reservoir, a drive unit, a first lead, and a second lead is provided. The reservoir melts solid solder wire into molten solder, while the drive unit selectively feeds the solid solder wire into the reservoir. The first and second lea... | 11/20/2007 |
| 7296727 | Apparatus and method for mounting electronic components After detection of contact between respective solder bumps of an electronic component, sucked and held by a suction nozzle of a head tool, and respective solder portions of a circuit board, the solder bumps and the solder portions are melted by heating. Releasing of... | 11/20/2007 |
| 7283806 | Wireless sensing system and method An apparatus and method is provided for sensing data relating to a structure (14), including an inspection site sensor system having at least one microprocessor (16) coupled to the structure. At least one sensor (12) for sensing data is connecte... | 10/16/2007 |
| 7255259 | Operator-serviceable wire feed sensor guide for use in semiconductor package fabrication A wire feed sensor guide, used in fabrication of semiconductor packages, guides a wire W from a wire source to a wire bonding location. The wire feed sensor guide has a unitary slider 1 that can be manually slid into and out of a fixed portion (2 or | 08/14/2007 |
| 7232504 | Apparatus and method for distilling waste liquids A distilling apparatus and method use a two step distillation and purification process for processing a waste liquid, such as an impure sulfuric acid solution, to form a highly concentrated sulfuric acid solution. First, the waste liquid is stored in a concentrating... | 06/19/2007 |
| 7219419 | Component mounting apparatus including a polishing device Component (3) is pressed onto a circuit board (4) so that their respective metal interconnects (5), (6) are in close contact with each other, and ultrasonic vibration is applied to the suction nozzle (14) holding the component (... | 05/22/2007 |
| 7159756 | Method of soldering and solder compositions The invention relates to using the heat generated during thermal treatment of one or more glass sheets to melt solder. In one nonlimiting embodiment, a lead providing external access to an electrical conductive arrangement, e.g. a conductive member between and conne... | 01/09/2007 |
| 7131565 | Feed devices and methods for injection molded solder systems A solder feeding device having a reservoir, a drive unit, a first lead, and a second lead is provided. The reservoir melts solid solder wire into molten solder, while the drive unit selectively feeds the solid solder wire into the reservoir. The first and second lea... | 11/07/2006 |
| 7121449 | Method and device for applying material to a workpiece In order to apply solder material (20) to a workpiece (1), compressed gas is guided through a bore hole (5) of a capillary (3). A pressure sensor (13) situated in the bore hole (5) measures the dynamic pressure of the compre... | 10/17/2006 |
| 7104433 | Safety apparatus of air impact driver A nose (5) of an air impact driver (1) is mounted with a slidable contact nose (12) and by the contact nose, a contact valve (23) upward therefrom is operated to switch. An AND circuit operated to pilot an air motor controlling pilot valv... | 09/12/2006 |
| 7096912 | Bonding apparatus A bonding apparatus including, on a supporting stand 12, two linear motors 130 and 140 and a bonding head supporting stage 114 which supports the bonding head 120 by means of fluid pressure so that the bonding head 120 is mo... | 08/29/2006 |
| 7093744 | Recognition device, bonding device, and method of manufacturing a circuit device The present invention solves a problem that in a wire bonding process, an inert gas used for prevention of oxidation of a substrate gave rise to shimmer due to the temperature difference during bonding, thereby degrading the precision of pattern recognition. With th... | 08/22/2006 |
| 7086576 | Machine for constructing the side wall of a cylindrical tank The machine is adapted to supply, manipulate and position steel strip, fed from a coil, so as to bring it into gapped relationship beneath the side wall of a partly constructed, elevated tank. This is done so that the strip can be welded to the side wall to add a co... | 08/08/2006 |
| 7083077 | Method and contact point for establishing an electrical connection A method for establishing an electrical connection between a first contact surface and a second contact surface, with a wire-bonding tool being used to provide a contact wire between the contact surfaces by bonding the contact wire to the first contact surface and s... | 08/01/2006 |
| 7066372 | Recognition device, bonding device, and method of manufacturing a circuit device The present invention solves a problem that in a wire bonding process, an inert gas used for prevention of oxidation of a substrate gave rise to shimmer due to the temperature difference during bonding, thereby degrading the precision of pattern recognition. With th... | 06/27/2006 |
| 7054707 | Electronic component mounting system and electronic component mounting method This invention is directed to prevention of setting a component feeding unit set with other storage member than a storage member storing same type of components as components in shortage in an electronic component mounting apparatus. A component mounting apparatus s... | 05/30/2006 |
| 7048172 | Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and the leveling squeegee to approach the pan surface of a transfer unit on... | 05/23/2006 |
| 7044354 | Soldering system with indicator lights displaying system status A soldering station with indicator lights to display system status is provided. The soldering station comprising a power supply and a control board coupled to the power supply. The control board is operable to adjust output of the power supply. The soldering station... | 05/16/2006 |
| 7040524 | Automated packaging apparatus and method of optical elements An automatic packaging method of optical elements includes a focusing platform set, a Z-axis feeder set and an automatic feeding set. The Z-axis feeder set is provided above the focusing platform set. An automatic feeding set is arranged on a horizontal plane betwee... | 05/09/2006 |
| 7017792 | Integrated piping plate, machining method for same, machining apparatus for same, and machining equipment for same A machining method for an integrated piping plate, for example, composed of a plurality of plates joined together, and in which an instrument and a component constituting an apparatus, or the instrument, or the component are or is disposed on one surface or both sur... | 03/28/2006 |
| 7014092 | Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrate The present invention provides a bump forming apparatus which can prevent charge appearance semiconductor substrates from pyroelectric breakdown and physical failures, a method carried out by the bump forming apparatus for removing charge of charge appearance semico... | 03/21/2006 |
| 7004370 | Device and method for determining parameters of a welding system The invention relates to a device and method for determining parameters of a welding system. According to the invention, a welding area (18, 21, 22) is subjected to the action of ultrasonic waves, preferably to the action of shear waves, by using an ultrasoun... | 02/28/2006 |
| 6983538 | Method of mounting component on a circuit board A method of mounting a component on an electrode on a board. Mounting coordinates for mounting the component are calculated. A determination is made of printing positions where solder for the component is situation on the electrode. The printing positions of the sol... | 01/10/2006 |
| 6983872 | Substrate alignment method and apparatus The invention provides a method and apparatus for aligning a substrate. The apparatus comprises a ball pick head for picking up a plurality of solder balls in a ball pick-up process and depositing them onto the substrate, and a vision system adapted to view and obta... | 01/10/2006 |
