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| Number | Title | Issue Date |
| 7708183 | Reflow solder oven with cooling diffuser A diffuser plate for a reflow oven includes an upper surface and a plurality of nozzle openings therein. Each of the plurality of nozzle openings has a raised surrounding portion for restricting condensed flux on the upper surface of the diffuser plate from flowing ... | 05/04/2010 |
| 7392925 | Handheld fluid cooled electric solder tweezers A handheld fluid cooled electric solder tweezers. A pair of soldering heads extend from a pair of tweezer members, respectively, and are operatively connected to a cooling apparatus. The cooling apparatus of each tweezer member includes a pair of heat dissipating tu... | 07/01/2008 |
| 7350684 | Apparatus and method for forming bump A preheat device (160) is provided to execute, before forming bumps (16) to electrode parts (15), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal... | 04/01/2008 |
| 7316062 | Solder extraction tool and method Methods and apparatus are provided for removing plating from a device. The method and apparatus may be used for preparing an electrical connector for connecting at least one wire or other terminus thereto where the electrical connector has at least one electrical co... | 01/08/2008 |
| 7259351 | Heat treating assembly and method The subject invention provides a heat treating assembly. The heat treating assembly comprises a laser, a substrate, and a tool. The laser emits laser energy directed toward the substrate and the tool. The substrate absorbs the laser energy and produces heat energy w... | 08/21/2007 |
| 7237445 | Test fixture for the aging of wiper blades in a laboratory A test fixture facilitates the laboratory testing of windshield wiper blades for vehicles. The test fixture includes a base frame on which are mounted a number of windshield wiper arms oriented generally parallel for engagement with a stainless steel test surface. P... | 07/03/2007 |
| 7208839 | Semiconductor component assemblies having interconnects Methods relating to forming interconnects through injection of conductive materials, to fabricating semiconductor component assemblies, and to resulting assemblies. A semiconductor component substrate, such as a semiconductor die or other substrate, has dielectric m... | 04/24/2007 |
| 7208410 | Methods relating to forming interconnects Methods relating to forming interconnects through injection of conductive materials, to fabricating semiconductor component assemblies, and to resulting assemblies. A semiconductor component substrate, such as a semiconductor die or other substrate, has dielectric m... | 04/24/2007 |
| 7156279 | System and method for mounting electronic components onto flexible substrates A system and method for reflowing solder to interconnect a plurality of electronic components (24) to a substrate (12) is disclosed. The system includes an oven for preheating the substrate (12) and the plurality of electronic components (24 | 01/02/2007 |
| 7150387 | Process and apparatus for flow soldering An apparatus for mounting an electric component onto a board by means of a lead-free solder material. The apparatus of the present invention has a solder material supplying chamber in which a melt of the solder material is supplied to the board by a solder material ... | 12/19/2006 |
| 7138720 | Semiconductor component assemblies having interconnects Methods relating to forming interconnects through injection of conductive materials, to fabricating semiconductor component assemblies, and to resulting assemblies. A semiconductor component substrate, such as a semiconductor die or other substrate, has dielectric m... | 11/21/2006 |
| 7131566 | Packaging method using lead-free solder This invention relates to a packaging method using lead-free solder, characterized by including a reflow-soldering step in which a surface mount device is soldered to a circuit board with a lead-free solder paste; an inserting step in which the lead or terminal of a... | 11/07/2006 |
| 7124931 | Via heat sink material The invention provides thermally conductive material so that less heat traveling from one side of a layer will reach connection material on another side of a layer. Rather, some of the heat will be conducted away by the thermally conductive material and dissipated. | 10/24/2006 |
| 7014092 | Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrate The present invention provides a bump forming apparatus which can prevent charge appearance semiconductor substrates from pyroelectric breakdown and physical failures, a method carried out by the bump forming apparatus for removing charge of charge appearance semico... | 03/21/2006 |
| 6971571 | Reflow soldering apparatus and reflow soldering method A bath apparatus 12 reserves a liquid 13 as a heating medium and includes an input partition bath 31, a first intermediate partition bath 32, a heat partition bath 33, a second intermediate partition bath 34 and a removing p... | 12/06/2005 |
| 6910614 | Vacuum compression brazing furnace and method of using same A vacuum heat treating furnace for brazing a large metallic part is disclosed. The vacuum furnace includes a pressure vessel having a cylindrical wall and a door dimensioned and positioned for closing an end of the cylindrical wall. A workpiece handling system is mo... | 06/28/2005 |
| 6827253 | Method and means for rapid heat-sink soldering A method and system for rapid heat-sink soldering, having a workpiece gripper, an intense heat source, and an optional air-jet cooling system, is provided for soldering workpieces to substrates of dissimilar material composition. The workpiece gripper selectively po... | 12/07/2004 |
| 6827249 | Fluxless tube seal A solder machine that can automatically solder a fiber optic cable to a package. The solder machine includes a fixture for supporting the cable and the package. The machine has a gas heater that emits a heated inert gas. The gas heats at least a portion of the packa... | 12/07/2004 |
| 6796483 | Method and device for producing a soldered joint A method and device is provided for thermal treatment of workpieces or components, in particular for producing a soldered joint between a solder material and at least one component or workpiece which is used as a carrier for said solder material, by melting of the s... | 09/28/2004 |
| 6772935 | Method and device for friction stir welding with simultaneous cooling A method for friction stir welding using liquid cooling. The method includes the steps of moving a pin tool across a welding location, spraying a cooling liquid in a localized manner from a cooling ring moving with the pin tool onto a trailing region and onto latera... | 08/10/2004 |
| 6702173 | Reflow apparatus in continuous printing and mounting apparatus for film-like printing body When a movement of a film-like printing body is stopped for a longer time than the normal time because of generation of trouble or the like, heat of hot plates for full heating is prevented from being transmitted to the film-like printing body. All of the... | 03/09/2004 |
| 6691910 | Method of joining different metal materials by friction welding A rod material made of Ti alloy has a larger diameter portion at the end, which is joined with the end of material made of Ti--Al intermetallic compound, by friction welding, to form a poppet valve for an internal combustion engine. Instead of providing s... | 02/17/2004 |
| 6642485 | System and method for mounting electronic components onto flexible substrates A system and method for reflowing solder to interconnect a plurality of electronic components to a substrate is disclosed. The system includes an oven for preheating the substrate and the plurality of electronic components disposed thereon, a supplemental... | 11/04/2003 |
| 6585149 | Packaging method using lead-free solder A packaging method using lead-free solder, characterized by including a reflow-soldering step in which a surface mount device is soldered to a circuit board with a lead-free solder paste; an inserting step in which the lead or terminal of a insertion moun... | 07/01/2003 |
| 6550668 | Method and means for rapid heat-sink soldering A method and system for instantaneous heat-sink soldering comprising a gripper device, an intense heat source, and an air-jet cooling system is provided for soldering terminals to structures of dissimilar material composition. The gripper device is adapte... | 04/22/2003 |
| 6443355 | Soldering method and apparatus A soldering method and apparatus in which there is provided a tight contact cover tightly contacting a portion (unused portion) of a re-flow panel other than its portion facing a substrate to be soldered in such a manner as to suppress a hot wind tending ... | 09/03/2002 |
| 6412681 | Soldering machine A soldering machine using lead-free solders is provided which can uniformly heat a printed circuit board and electronic parts to be mounted thereon, and which can solder the electronic parts without thermally damaging them. A porous member having a number... | 07/02/2002 |
| 6402011 | Reflow method and reflow device For reflow soldering, radiant heating is applied to one surface of a printed circuit board on which electronic components are placed and onto which cream solder is supplied and at the same time hot air is blown locally and roughly perpendicular to to-be-c... | 06/11/2002 |
| 6386422 | Solder reflow oven A solder reflow oven for the processing of ball grid array substrates bearing solder balls is described, comprising: input means for introducing substrates into the oven, a processing chamber within which the substrates are subject to a solder reflow proc... | 05/14/2002 |
| 6347732 | Circuit board component retention A method and implementing system is provided in which a gas, such as oxygen, is injected on to area of a circuit board to which an electronic component is being mounted. The injected gas causes a formation of a coating or surface alloy layer such as tin-o... | 02/19/2002 |
| 6347734 | Methods and apparatus for installing a module on a circuit board using heating and cooling techniques The invention is directed to techniques for installing a module on a circuit board by simultaneously heating a perimeter portion of the module, and bringing an inner portion of the module to temperature that is lower than that of the perimeter portion. He... | 02/19/2002 |
| 6345756 | Defectively joined portion removal apparatus for use in a continuous hot rolling process The invention comprises a continuous hot rolling method in which a rear end portion of a preceding metal block and a fore end portion of a succeeding metal block are cut and the metal blocks are joined to each other by heating and pressing followed by a f... | 02/12/2002 |
| 6318622 | High power hybrid modules assembly using vacuum oven for permanent electrical connections The apparatus for assembly of high power hybrid modules including high power semiconductor chips and conventional surface mount technology (SMT) components are disclosed. The vacuum oven is used for creating the permanent electrical connection between eac... | 11/20/2001 |
| 6230962 | Process for cooling soldered objects A process for cooling soldered objects, according to which a liquid is applied onto the soldered object and is evaporated in an accelerated manner. According to a preferred embodiment the soldered object is cooled in a vapor phase soldering apparatus dire... | 05/15/2001 |
| 6164516 | Soldering apparatus and method An automatic soldering apparatus includes a conveyor for conveying a printed circuit board along a predetermined path, a heater located below the conveyor and adapted to heat the lower surface of the printed circuit board on which leads of chips and other... | 12/26/2000 |
| 6123247 | Electronic unit soldering apparatus An electronic unit soldering apparatus includes: a pallet on which an electronic unit to be reflow-soldered is placed; a transporting unit for transporting the pallet having the electronic unit; and a reflow furnace through which the pallet passes, the re... | 09/26/2000 |
| 6059170 | Method and apparatus for insulating moisture sensitive PBGA's Method and apparatus removing a component having a solder ball grid array to a circuitized substrate. The solder balls have a first temperature at which they melt. The component has a second temperature, greater than the first temperature, over which the ... | 05/09/2000 |
| 6045032 | Method of preventing solder reflow of electrical components during wave soldering A method of preventing solder reflow of a SMT component (14) attached with solder (22) to a circuit board (10) that subsequently undergoes a wave soldering operation. The method generally entails the use of a thermal shield (18, 28) that is either part of... | 04/04/2000 |
| 6039236 | Reflow soldering apparatus with improved cooling A reflow soldering apparatus includes a plurality of heating compartments connected in series for heating objects for soldering; transporting means for successively carrying the objects through the compartments; and at least first and second cooling compa... | 03/21/2000 |
| 5942289 | Hardfacing a surface utilizing a method and apparatus having a chill block A hardfacing apparatus includes a deposition head including a heat source, a hardfacing material source, and a chill block having a chill block surface. The deposition head is positioned at a location so as to deposit a mass of the hardfacing material ont... | 08/24/1999 |
