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| Number | Title | Issue Date |
| 8020744 | Methods for connecting a wire to a metalized circuit path on a plastic part A method and apparatus for connecting wires to circuits, including the formation of at least one electrically conductive path having a plastic base with a metal foil formed of laser direct processes. ... | 09/20/2011 |
| 7841505 | Wire clamp and wire bonding apparatus having the same A wire clamp includes a pair of clamp arms at a predetermined distance from each other to define an interval therebetween for a bonding wire, a clamp body coupled to the clamp arms, the clamp body configured to adjust the predetermined distance between the clamp arm... | 11/30/2010 |
| 7578423 | Assembly for reducing oxidation of semiconductor devices An assembly for reducing oxidation of a semiconductor device comprises a holding device for securing the semiconductor device to a platform. The holding device includes at least one opening for providing access by a bonding tool to bonding areas where the semiconduc... | 08/25/2009 |
| 7546943 | Apparatus, system, and method for positioning a printed circuit board component An apparatus, system, and method are disclosed for positioning a printed circuit board component. A clamping member applies a clamping force to a levering member linked to a positioning member. The levering member biases the positioning member toward a printed circu... | 06/16/2009 |
| 7357288 | Component connecting apparatus When a component, that has a connection portion to be connected to an electrode of a board and a weak heat-resistant portion of a lower heat-resisting property than a fusing point of a connection material for connecting the electrode of the board with the connection... | 04/15/2008 |
| 7344059 | Apparatus and method for mounting an electrical connector to a glass sheet of a vehicle window An electrical connector is soldered or affixed to a conductive element of a glass sheet of a vehicular window via radiation heating of a layer of solder with an infrared radiative heating device. The heating device may include an infrared lamp and a reflector, which... | 03/18/2008 |
| 7308999 | Die bonding apparatus A die bonding apparatus for die bonding at least two members, which are heated in a heat treatment furnace, comprising a first member having a surface to be die bonded on which solder is disposed and a second member disposed to face the first member in a state in wh... | 12/18/2007 |
| 7305808 | Packaging machine A packaging machine moves its heater unit for longitudinal sealing of a tubularly formed film between a sealing position at which the heater unit contacts the film and a retracted position at which it is separated from the film. In addition to the mechanism for this... | 12/11/2007 |
| 7288471 | Bumping electronic components using transfer substrates A method for forming solder bumps on an electronic component. Providing a transfer substrate having a plurality of solder balls, disposing the transfer substrate on the surface of the electronic component, heating to reflow the solder balls onto the electronic compo... | 10/30/2007 |
| 7268646 | Temperature controlled MEMS resonator and method for controlling resonator frequency There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a temperature compensated microelectromechanical resonator as well as fabricating, manufacturing, providing and/or controlling microelectromechanical reso... | 09/11/2007 |
| 7265315 | Method of joining terminals by soldering A method of joining terminals by soldering is provided which allows control of increasing gas supply even in soldering performed in a gas atmosphere within a gas chamber. Utilizing a springback phenomenon occurring at a flat portion of a terminal, a solder joint of ... | 09/04/2007 |
| 7246735 | Wire clamping plate A wire clamping plate is provided for a wire clamp that is adapted to contact a length of metallic wire when the wire clamp is applying a clamping force on the wire. The wire clamping plate comprises doped silicon carbide, which makes it electrically conductive and ... | 07/24/2007 |
| 7240820 | Clamping device for processing electronic devices A clamping device is provided for holding an electronic device, such as a semiconductor carrier in the form of a leadframe, during processing thereof. It includes a main body for covering the electronic device and an opening in the main body for providing access to ... | 07/10/2007 |
| 7229000 | Adjustable frame fixture An adjustable frame fixture aims to hold a printed-circuit board (PCB) to pass over a tin oven to process wave soldering. The fixture includes at least two side frames and at least two fasteners. The two side frames are coupled to form a holding dock. The positions ... | 06/12/2007 |
| 7185420 | Apparatus for thermally coupling a heat dissipation device to a microelectronic device An apparatus is provided for thermally coupling a heat dissipation device to a microelectronic device. A thermal compression bonding apparatus is provided comprising a bonding head adapted to apply heat and pressure to the heat dissipation device to provide the desi... | 03/06/2007 |
| 7178711 | Method and device to elongate a solder joint A method and device to elongate a solder joint are provided. The method begins by forming an elongator on a first substrate. The elongator comprises an expander and an encapsulant to encapsulate the expander. A solder joint is formed to connect the first substrate t... | 02/20/2007 |
| 7172106 | Printed circuit board which can be connected with pin connector and method of manufacturing the printed circuit board A printed circuit board that can be connected with a pin connector and a method of manufacturing the printed circuit board are provided. Solidified solder can be formed on the tap unit without the need for additional processes, by applying solder printing to the tap... | 02/06/2007 |
| 7134592 | Method and protection apparatus for installation of a temperature-sensitive electronic component Temperature-sensitive electrical and electronic components which are connected to a board by soldering during the installation process are protected from the heat during the soldering process in order to prevent permanent damage to the components. The solder connect... | 11/14/2006 |
| 7134589 | Wire bonder with a downholder for pressing the fingers of a system carrier onto a heating plate A Wire Bonder has a downholder for pressing the fingers of a system carrier onto a heating plate. The downholder can be raised and lowered. A downholder in accordance with the invention contains four guide elements for bearing a holding plate, whereby each guide ele... | 11/14/2006 |
| 7131568 | Methods for lead penetrating clamping system An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method include the use of a penetrating individual independent lead finger clamp during the ... | 11/07/2006 |
| 7068125 | Temperature controlled MEMS resonator and method for controlling resonator frequency There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a temperature compensated microelectromechanical resonator as well as fabricating, manufacturing, providing and/or controlling microelectromechanical reso... | 06/27/2006 |
| 7060528 | Method for mounting a semiconductor element to an interposer by compression bonding A semiconductor element mounting method is provided with high productivity. The method includes forming bumps on electrodes of a wafer in which a plurality of semiconductor elements have been formed, temporarily compression-bonding the wafer and an interposer via an... | 06/13/2006 |
| 7040525 | Stage structure in bonding machine and method for controlling the same Stage structure in a bonding machine including a plate movably fitted in a bonding chamber, a plurality of blocks of electro-static chucks fitted to the plate for providing an electro-static force to hold a substrate, a plurality of vacuum holes in the plate around ... | 05/09/2006 |
| 7032288 | Methods for magnetically establishing an electrical connection with a contact of a semiconductor device component An electrical connector configured to nonrigidly apply force to a semiconductor substrate in directions substantially normal to a plane of the semiconductor substrate includes a first member with an electrically conductive element and a first attractive element and ... | 04/25/2006 |
| 7026190 | Method of manufacturing circuit device Wire bonding is performed efficiently by pressing circumference end of a block of a conductive foil by a clamper, and by performing wire bonding of a circuit element of a mounting portion in the block and the conductive pattern in a lump. At a time of wire bonding, ... | 04/11/2006 |
| 7015066 | Method for stress reduction in flip chip bump during flip chip mounting and underfill process steps of making a microelectronic assembly A method of making a microelectronic assembly buying restraining a substrate in a fixture at room temperature, placing a flip chip on the substrate so that conductive bumps on the flip chip are aligned with contact pads on the substrate, heating the flip chip, the s... | 03/21/2006 |
| 7007833 | Forming solder balls on substrates A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverte... | 03/07/2006 |
| 6998295 | Method of manufacturing a device package A small ball is formed at an end of a second gold wire that is held and guided by a second capillary. The small ball has a diameter approximately equal to that of a first gold wire. The small ball is bonded to an electrode on an optical device. The second gold wire ... | 02/14/2006 |
| 6978528 | Drain basket support tool A drain basket support tool includes a tubular housing that has a top end a bottom end. Each of a pair of rods extends through the tubular housing and each of the rods includes a pair of arms. Each of a plurality of extension members has a first end and a second end... | 12/27/2005 |
| 6978539 | Method for attaching an integrated circuit package to a circuit board A method for attaching an IC package to a circuit board, the IC package having a plurality of electrical contacts in an arrangement having a perimeter, first positions the IC package adjacent to the circuit board. Then, electrically connects the IC package to the ci... | 12/27/2005 |
| 6958285 | Methods of manufacturing devices having substrates with opening passing through the substrates and conductors in the openings In some embodiments, a fabrication method comprises: forming a structure that has one or more substrates, wherein the one or more substrates are either a single substrate or a plurality of substrates bonded together, wherein the structure comprises a non-electronica... | 10/25/2005 |
| 6942137 | Die removal method and apparatus A method and apparatus for separating a semiconductor device from a substrate in a fixture with a shearing element, wherein the semiconductor device is attached to the substrate by solder connections to form an assembly, includes using the shearing element to apply ... | 09/13/2005 |
| 6935549 | Brazing fixtures and methods for fabricating brazing fixtures used for making feed-through assemblies A brazing fixture for fabricating a feed-through assembly during a brazing process and a method for forming a brazing fixture are provided. The brazing fixture includes a holding tray and a nesting plate removably mounted on the holding tray. The nesting plate has a... | 08/30/2005 |
| 6935556 | Method for mounting electronic components on substrates In the method for mounting electronic components on substrates by means of pressure sintering, a paste which is composed of a metal powder and a solvent is applied between the component and the substrate. Once the paste has dried completely, the component is placed ... | 08/30/2005 |
| 6921017 | Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further com... | 07/26/2005 |
| 6918528 | Transducer tool holder A transducer horn for holding a tool, such as a capillary, for a wire bonder has a pair of resilient arms which flex to clamp about a tool placed in a passage between the arms. The arms have free distal ends between which a wedge is inserted to open the passage to a... | 07/19/2005 |
| 6899262 | Clamping device A clamping device is provided for clamping an object, such as bonding wire for a wire bonding machine. The device comprises a pair of clamping arms arranged in pivotal relationship with each other about a pivot point, the clamping arms having clamping ends movable b... | 05/31/2005 |
| 6886734 | Device and method for clamping and wire-bonding the leads of a lead frame one set at a time A wire-bonding machine includes a heat block for supporting a lead frame during wire-bonding. A clamp mechanism in the machine clamps leads of the lead frame during wire-bonding by fixedly holding sets of the leads against the heat block one set at a time. A wire-bo... | 05/03/2005 |
| 6845898 | Bondhead lead clamp apparatus An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The present invention includes the use of an individual independent lead finger clamp during the wire bonding ... | 01/25/2005 |
| 6840424 | Compression bonding tools and associated bonding methods Compression bonding tools having a CVD-formed pressing member with a non-reactive working surface are disclosed and described. Generally speaking, the pressing member is coupled to a tool body, which may include head member, and a tail member. In some aspects, the t... | 01/11/2005 |
