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| Number | Title | Issue Date |
| 8104663 | Solder ball mounting method and apparatus The periphery of a mask (3) is formed higher than a region where a ball holding hole (3a) is formed, a work (1) is arranged at a lower section of the ball holding hole (3a) of the mask (3), and the ball holding hole (... | 01/31/2012 |
| 7886955 | Solder ball mounting device A solder ball mounting device that can mount minute solder balls with a diameter of 200 μm or less onto a connection pad. The solder ball mounting device can mount solder balls to be solder bumps on a printed circuit board using a mask having a plurality of opening... | 02/15/2011 |
| 7866529 | Solder ball loading method and solder ball loading unit A solder ball loading unit for loading a solder balls to be turned to a solder bumps on a connection pad of a printed wiring board, including a ball arranging mask having a plurality of openings corresponding to the connection pad of the printed wiring board, a cyli... | 01/11/2011 |
| 7845541 | Soldering apparatus and soldering method A soldering apparatus has a fixture receiving an electronic component and a conducting wire, with a free end of the conducting wire superimposed on the soldering area of the electronic component, a convey mechanism capable of transmitting the fixture downstream, a d... | 12/07/2010 |
| 7762446 | Method and device for transferring a solder deposit configuration Method and device for transferring a solder deposit configuration having multiple solder deposits onto a terminal surface configuration of a contact surface of a substrate (36) using a removal of multiple solder deposits from a solder deposit reservoir (25... | 07/27/2010 |
| 7665648 | Fabrication method and structure of PCB assembly, and tool for assembly thereof A fabrication method and structure for a PCBA, and tool for assembly of the structure. The structure includes a circuit board, at least one first solder joint, a plurality of second solder joints, and an electronic device. The circuit board has a solder mask, having... | 02/23/2010 |
| 7654433 | Flux overspray removal masks with channels, methods of assembling same, and systems containing same Some embodiments include an apparatus comprising a spray head to spray a substrate, the substrate having a region to be sprayed and a region to be masked, the two regions separated by a boundary, and a mask having channels, the mask located between the spray head an... | 02/02/2010 |
| 7644853 | Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux A method of attaching solder balls to a BGA package using a ball pickup tool is disclosed. An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. The ball pickup tool picks up solder balls with a vacuu... | 01/12/2010 |
| 7607559 | Conductive ball arraying apparatus A conductive ball arraying apparatus includes an arraying jig including conductive ball insertion parts in a predetermined array pattern, a ball cup that has an opening formed in a bottom surface thereof and is capable of housing a plurality of conductive balls alon... | 10/27/2009 |
| 7597233 | Apparatus and method of mounting conductive ball There is provided a conductive ball mounting apparatus for mounting one conductive ball on each of a plurality of connection pads formed on a substrate. The conductive ball mounting apparatus includes: an outer frame; an inner cylinder provided in the outer frame, w... | 10/06/2009 |
| 7546941 | Ball attaching apparatus for correcting warpage of substrate and method of attaching solder balls using the same A ball attaching apparatus for respectively attaching solder balls onto a plurality of ball lands of a material which has mold caps formed between the ball lands. The apparatus includes an indexer on which the material is seated and fixed; a holder located above the... | 06/16/2009 |
| 7506792 | Solder sphere placement apparatus A method and apparatus are disclosed for placing solder spheres on electronic receiving pads of a ball grid array (BGA) component package, such as by a BGA solder sphere placement apparatus. The solder spheres are held to a pattern of solder sphere apertures in a fo... | 03/24/2009 |
| 7455209 | Filling device and method for filling balls in the apertures of a ball-receiving element A filling device for and a method of filling balls in an array of apertures in a ball-receiving element, the filling device comprising: a housing including an opening at a lower surface thereof and defining in part a chamber for containing a supply of balls, the hou... | 11/25/2008 |
| 7407081 | Methods and apparatus for transferring conductive pieces during semiconductor device fabrication In a first aspect, a programmable transfer device is provided for transferring conductive pieces to electrode pads of a target substrate. The programmable transfer device includes (1) a transfer substrate; and (2) a plurality of individually addressable electrodes f... | 08/05/2008 |
| 7404511 | Laser trimming problem suppressing semiconductor device manufacturing apparatus and method A semiconductor device manufacturing apparatus includes a substrate holding section that holds a semiconductor wafer substrate, a discharge mechanism that discharges liquid drops of metal paste from a discharge nozzle toward a surface of the semiconductor wafer subs... | 07/29/2008 |
| 7392924 | Automated ball mounting process and system with solder ball testing An automated ball mounting system is disclosed In which solder balls are tested by heating the solder balls to a temperature between the eutectic temperature of lead-tin and the melting temperature of a lead free solder ball. If the heated solder balls melt they are... | 07/01/2008 |
| 7364622 | Method and apparatus for fabricating a device, and the device and an electronic equipment The invention provides an apparatus for fabricating a device, in which a high operation efficiency is maintained in a drying treatment for a multilayer-interconnection device. The device can also be fabricated inexpensively. An apparatus for fabricating a device has... | 04/29/2008 |
| 7360679 | Method for the production of a soldered connection A method for the production of a soldered joint between at least two contact partners (22, 23) of a bonding arrangement (21), with a formed piece of solder material (27) being arranged at a distance to the bonding arrangement. The formed piece o... | 04/22/2008 |
| 7357295 | Solder ball supplying method and supplying device After introducing a solder ball from a hopper into a receiving hole of a ball separator, the ball separator is slid between blocks, and the solder ball is sent out to a portion outside of the blocks. By suctioning the solder ball from within a projected region on a ... | 04/15/2008 |
| 7347975 | Bead dispensing system A bead dispensing system is provided for delivering small amounts of substances onto substrates. The system can include, for example, a movable support structure having an array of spaced-apart projections depending from its lower side. An attraction source, such as... | 03/25/2008 |
| 7348515 | Solder dispenser A solder dispenser provides a cylindrical dispensing container which has a solder inlet for introducing a solder member, and an opening portion for discharging the above-mentioned solder member to the external, and forms an internal space where the solder member can... | 03/25/2008 |
| 7337534 | SMD chip handling apparatus The apparatus is for securely fetching and positioning an SMD chip on a printed circuit board and soldering the same to the board. Two spring plates form the clasping fingers which are wedged apart to a width larger than the width of the SMD chip by an expander form... | 03/04/2008 |
| 7321172 | Selective plating of package terminals In one embodiment, a method including providing a semiconductor pad package having a first pad and a second pad is disclosed. A first layer comprising a first metal is deposited on the first pad using a first process. A second metal is then deposited on the first pa... | 01/22/2008 |
| 7288471 | Bumping electronic components using transfer substrates A method for forming solder bumps on an electronic component. Providing a transfer substrate having a plurality of solder balls, disposing the transfer substrate on the surface of the electronic component, heating to reflow the solder balls onto the electronic compo... | 10/30/2007 |
| 7275676 | Apparatus for locating conductive spheres utilizing screen and hopper of solder balls Apparatus for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop thr... | 10/02/2007 |
| 7244910 | Welding torch nipple In accordance with one embodiment, there is provided a welding torch nipple for coupling a welding cable and neck assembly to one another. The exemplary nipple includes two hollow tubes: an inner tube disposed in an outer tube. The inner tube includes features that ... | 07/17/2007 |
| 7240822 | Ball mounting method A ball mounting apparatus and method for mounting a plurality of balls sucked up and held by a head onto a workpiece. The apparatus includes a positioning mechanism for the workpiece, a ball supply device for supplying the balls, the head for sucking up the balls, a... | 07/10/2007 |
| 7239485 | Localized heating element for a suspension assembly The present invention provides a suspension assembly having a slider body with a trailing edge face. A bond pad is positioned on the trailing edge face and a conductive trace is connected to the bond pad to form an electrical connection. A heating element includes a... | 07/03/2007 |
| 7191930 | Electrostatic methods and apparatus for mounting and demounting particles from a surface having an array of tacky and non-tacky areas Methods and associated apparatus are disclosed for use in mounting particles on and de-mounting particles from a substrate having an array of tacky and non-tacky areas. The particles can be either electrically conducting or electrically non-conducting. Selection of ... | 03/20/2007 |
| 7164097 | Solder ball bonding method and bonding device Provided are a solder ball bonding method and a solder ball bonding device for performing bonding of a plurality of electrode portions formed on objects to be bonded by melting solder balls. The solder balls are suctioned by using a plurality of suction nozzles that... | 01/16/2007 |
| 7121449 | Method and device for applying material to a workpiece In order to apply solder material (20) to a workpiece (1), compressed gas is guided through a bore hole (5) of a capillary (3). A pressure sensor (13) situated in the bore hole (5) measures the dynamic pressure of the compre... | 10/17/2006 |
| 7105432 | Method of locating conductive spheres utilizing screen and hopper of solder balls Methods for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop throu... | 09/12/2006 |
| 7100813 | System and method for achieving planar alignment of a substrate during solder ball mounting for use in semiconductor fabrication A system (10) and method (30) for precisely depositing a solder compound onto a substrate (18). The system (10) generally includes a receiving member (20) having a rotatable portion (21) adapted to receive a planar substrate... | 09/05/2006 |
| 7086147 | Method of accommodating in volume expansion during solder reflow Solder balls such as, low melt C4 solder balls, undergo volume expansion during reflow, such as may occur during attachment of chip modules to a PCB. Where the solder balls are encapsulated, expansion pressure can cause damage to device integrity. A volume expansion... | 08/08/2006 |
| 7077305 | Ball loading apparatus A ball mounting apparatus for mounting a plurality of balls sucked up and held by a head onto a workpiece. The apparatus includes a positioning mechanism for the workpiece, a ball supply device for supplying the balls, the head for sucking up the balls, an force gen... | 07/18/2006 |
| 7073700 | Process and apparatus for applying brazing material to a metallic structure through the use of vibration A process and an apparatus for applying a brazing material to a metallic structure, especially a honeycomb body, include bringing the metallic structure into contact with a pulverulent brazing material in such a way that the brazing material at least partially adher... | 07/11/2006 |
| 7070087 | Method and apparatus for transferring solder bumps The present invention relates to improvements in forming and transferring solder bumps for use in mounting integrated circuit substrates on chip carrier packages. A mold having cavities for the solder bumps is held in contact with a substrate and a compressible devi... | 07/04/2006 |
| 7066377 | Ball mounting method A ball mounting method for mounting a plurality of balls held by a head onto a workpiece. The head is clamped such that a clamping surface mounted to the head is engaged with a rigid lower positioning stop, and then moved above a ball supply section. The balls are h... | 06/27/2006 |
| 7051915 | Capillary for wire bonding and method of wire bonding using it A capillary has a face surface 13 formed at the tip end thereof so that the face surface 13 inclines toward the center thereof so as to have a tapered shape, and has a through hole 11 formed therethrough so as to permit wire to be placed thereth... | 05/30/2006 |
| 7032306 | Method for producing module The invention concerns a method for producing electronic modules with ball connector (7) or integrated preforms capable of being soldered on a printed circuit (3) and a device for implementing said method. The invention concerns a method for producing ... | 04/25/2006 |
