Bizarre Patents
Hands free towel carrying system
A hands free towel carrying system for coupling a towel to a user to prevent loss, theft or contamination.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8186562 | Apparatus for increasing coverage of shielding gas during wire bonding A main body of an apparatus for delivering shielding gas during wire bonding of an electronic device has a through-hole in the main body which is sized for allowing a capillary tip of a bonding tool to be insertable through the main body when performing wire bonding... | 05/29/2012 |
| 8141765 | Cutting blade for a wire bonding system A cutting blade for a wire bonding system is provided. The cutting blade comprises a body portion having an end portion. The end portion includes a blade tip configured to penetrate into a conductive material The end portion further includes a stepped portion proxim... | 03/27/2012 |
| 8096461 | Wire-bonding machine with cover-gas supply device A wire-bonding machine includes a main body, a fixture block, a mounting block, a gas supply tube, a cover-gas supply device, a capillary tool and an electrode. The fixture block is provided with a chamber defined therein and a central bore formed at one side wall o... | 01/17/2012 |
| 8091757 | Wire alignment tool for use during soldering A wire alignment tool for use during soldering is disclosed. The tool includes a handle configured to contain a supply of solder, a solder advancement mechanism constructed and arranged to move the supply of solder from the handle to a soldering locus, and a clampin... | 01/10/2012 |
| 8066171 | Conductive metal ball bonding with electrostatic discharge detection An apparatus for bonding a conductive lead to a conductive terminal of a device by the use of a conductive metal ball is disclosed. A ball-forming wire comprises a first conductive metal having a first melting temperature. A clamping surface has a closed position in... | 11/29/2011 |
| 8066170 | Gas delivery system for reducing oxidation in wire bonding operations A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire b... | 11/29/2011 |
| 8056794 | Combination wedge bonding and ball bonding transducer A transducer configured for use with a manual wire bonding machine includes a body portion including an end portion, the end portion defining a bonding tool aperture configured to receive at least a portion of a bonding tool. The transducer also includes a first tig... | 11/15/2011 |
| 8025201 | Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles Techniques for ball bonding wires in an integrated circuit are provided which allow formation of desired wire bond profile shapes for optimal performance. A wire is ball bonded to a first bond site in the integrated circuit with a bonding tool and at least one bend ... | 09/27/2011 |
| 8011557 | Automatic soldering machine An automatic soldering machine for soldering wires, each exposing at least one core wire and electronic components with at least one soldering portion respectively is disclosed. The automatic soldering machine comprises an equipment, a delivery mechanism, a pluralit... | 09/06/2011 |
| 7954689 | Vacuum wire tensioner for wire bonder A wire tensioner is provided for a wire bonder, the wire tensioner comprising a tubular body having a bore through which bonding wire is receivable and a bore outlet at an end of the tubular body from which the bonding wire is extendable towards a bonding tool. A ch... | 06/07/2011 |
| 7946465 | Wirebonder forming low profile wire bonds between integrated circuits dies and printed circuit boards A wirebonder for electrically connecting an integrated circuit die with conductors on a printed circuit board. The wirebonder has a bonding tool for attaching wire bonds from the integrated circuit die to the conductors of the printed circuit board and a wire engagi... | 05/24/2011 |
| 7938308 | Wire bonder for improved bondability of a conductive wire and method therefor A wire bonder has a capillary through which a wire passes. A discharge tip is positioned near a bottom section of the capillary and provides a flame to a distal end of the wire. A gas diffuser is positioned beside the capillary to diffuse a heated gas to the distal ... | 05/10/2011 |
| 7934632 | Apparatus for manufacturing semiconductor package for wide lead frame and method of constructing semiconductor package using the same An apparatus for manufacturing a semiconductor package includes an index rail transferring a lead frame in forward and backward directions, the lead frame having a first surface and a second surface that is opposite to the first surface, a loader portion connected t... | 05/03/2011 |
| 7918378 | Wire bonding deflector for a wire bonder Methods and systems are described for enabling the efficient fabrication of wedge-bonding of integrated circuit systems and electronic systems. ... | 04/05/2011 |
| 7810695 | Wire bonding machine capable of removing particles from capillary and cleaning method of capillary bottom tip A wire bonding machine capable of removing particles from capillary and cleaning method of capillary bottom tip uses a grinding film of the wire bonding machine mounted on a clamp block. The capillary of the wire bonding machine periodically moves on the grinding fi... | 10/12/2010 |
| 7766212 | Spool wound with a gold alloy wire used for a bonding process A spool includes a body and a chromium layer. The body integrally includes a first portion having an annular shape and a second portion having a tubular shape. The body is formed using plastic. The first portion is provided on both sides of the second portion. The c... | 08/03/2010 |
| 7766211 | Temperature control of a bonding stage A bonding apparatus is provided comprising a bonding stage for holding a bonding tool, an air distribution system mounted to the bonding stage and an air inlet attached to the air distribution system. The air distribution system is connected to the air inlet for rec... | 08/03/2010 |
| 7735707 | Wire bonding apparatus A wire bonding apparatus including a bonding arm provided at a tip end thereof with an ultrasonic horn that has a capillary at its tip end, wherein the bonding arm is provided therein with a pressure sensor that detects the pressing load applied by the capillary on ... | 06/15/2010 |
| 7681775 | Multi-layer thermal insulation for a bonding system A thermal insulation system is provided for a component of a bonding system, such as an optical system. The thermal insulation system comprises multiple insulation layers located between the component and a heat source. The multiple insulation layers comprise at lea... | 03/23/2010 |
| 7681774 | Bond head link assembly for a wire bonding machine A bond head assembly for use with a bonding machine includes a wire bonding tool and a link mechanism coupled between the wire bonding tool and the wire bonding machine. The link mechanism includes a frame, a plurality of arm links pivotably connected to the frame, ... | 03/23/2010 |
| 7677429 | Concave face wire bond capillary and method An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire f... | 03/16/2010 |
| 7641097 | Moveable arm assembly for a wire bonder A wire bonding machine includes a moveable arm assembly and at least one component for a ball bonding operation of the wire bonding machine supported by the moveable arm assembly. The moveable arm assembly is configured to move between a ball bonding position and a ... | 01/05/2010 |
| 7637411 | Wire bonding apparatus and process A wire bonding machine includes (1) a support structure for supporting a work piece and (2) a pre-heat structure for supporting the work piece during a pre-heat operation. The pre-heat structure is moveable with respect to the support structure. ... | 12/29/2009 |
| 7631795 | System and method for automated wire bonding A bonder viewer system may provide an automated procedure for determining a wire bonding sequence based on information provided by a drawing management system. The bonder viewer system may include a bonding sequence decision unit receiving pad and lead coordinate da... | 12/15/2009 |
| 7628307 | Apparatus for delivering shielding gas during wire bonding An apparatus is provided for supplying a shielding gas during the bonding of wires to electronic components with a bonding tool comprising a horn and a capillary. The apparatus comprises a main body with an elongated slot having a width that extends into the main bo... | 12/08/2009 |
| 7624904 | Calibration apparatus for bondhead of wire bonding machine A wire bonding machine including a bondhead assembly having a transducer and a bonding tool is provided. The bondhead assembly is configured for substantially vertical movement with respect to a bonding surface of the wire bonding machine during a wire bonding opera... | 12/01/2009 |
| 7614538 | Device clamp for reducing oxidation in wire bonding A device clamp configured for use with a wire bonding machine is provided. The device clamp includes a body portion defining at least one device aperture. Each of the at least one device apertures is configured to be positioned adjacent a bond site area of the wire ... | 11/10/2009 |
| 7597231 | Wire bonding capillary tool having multiple outer steps A bonding tool for bonding a fine wire to a substrate, said bonding tool comprising an at least substantially cylindrical portion having a concentric capillary therein through which the fine wire runs; a working tip portion formed at an end of the cylindrical portio... | 10/06/2009 |
| 7527186 | Method and apparatus for mapping a position of a capillary tool tip using a prism A system for determining wire bonding tool placement for use with a wire bonder and an optical imager is provided. The system includes a prism disposed below the optical imager and the wire bonding tool. The system also includes at least one lens positioned between ... | 05/05/2009 |
| 7523848 | Method and apparatus for measuring the size of free air balls on a wire bonder A system for measuring the size of free air balls for use with a wire bonder having a wire bonding tool and an Electric Flame Off (EFO) device is provided. The system includes an imager disposed above a first image plane, a prism disposed below the imager, and at le... | 04/28/2009 |
| 7500590 | Multi-part capillary A bonding tool for bonding a wire to a substrate. The bonding tool has a cylindrical body portion formed from a first material and a conical tip portion separately formed from a second material. The conical tip portion is coupled to one end of the body portion. ... | 03/10/2009 |
| 7500591 | Low-profile capillary for wire bonding A wire bonding tool includes a first cylindrical portion having a first outside diameter and a second cylindrical portion adjacent the first cylindrical portion. The second cylindrical portion has a second outside diameter, the second outside diameter being less tha... | 03/10/2009 |
| 7469812 | Wire bonding apparatus A wire bonding apparatus includes a heat block (121) and a heat plate (122) provided on the heat block (121). A recess (1221) is provided in the heat plate (122) to receive the first semiconductor chip (41) and wires (51 | 12/30/2008 |
| 7458496 | Wire bonder and method of operating the same Wire bonder having a bonding head which has a bonding tool and a bonding wire guide and, especially, a bonding wire cutting device which comprises a cutter for separation of that section of a bonding wire which projects beyond a bonding contact, the wire bonder havi... | 12/02/2008 |
| 7431192 | Wire bonding apparatus A wire bonding machine includes (1) a support structure for supporting a work piece and (2) a pre-heat structure for supporting the work piece during a pre-heat operation. The pre-heat structure is moveable with respect to the support structure. ... | 10/07/2008 |
| 7427009 | Capillary for wire bonding A capillary tip for deforming a bonding wire during bonding of the wire to a bonding surface comprises a bottom face along an inner periphery of the capillary tip for pressing the bonding wire against a bonding surface, an outer radius along an outer periphery of th... | 09/23/2008 |
| 7416107 | Concave face wire bond capillary and method An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire f... | 08/26/2008 |
| 7413108 | Wedge-bonding of wires in electronic device manufacture with reversible wedge bonding tool In the manufacture of electronic devices (22, 22′), e.g. discrete semiconductor power devices or ICs, a reversible bonding tool (10) is used having a bonding tip or wedge (1, 2) at each of its opposite ends (11, 12). After extensive use... | 08/19/2008 |
| 7411157 | Electronic flame-off electrode with ball-shaped tip An electrode for a wire bonding apparatus is provided. The electrode includes a body portion and a tip portion adjacent the body portion. The tip portion has a substantially spherical configuration. ... | 08/12/2008 |
| 7407080 | Wire bond capillary tip A capillary tip for a wire bonding tool has a chamfer provided with at least one annular groove. The annular groove is generally oriented in a plane perpendicular to the axis of the capillary. In a sectional view through the capillary axis, the groove profile may be... | 08/05/2008 |
