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| Number | Title | Issue Date |
| 8011556 | Device for the connecting of strips The invention relates to a device (100) for the connecting of strips to an endless strip with a clamping arrangement (110, 120) with a clamping device (110-r, 120-r) on the inlet side and a clamping device (110-l, ... | 09/06/2011 |
| 7926693 | Centering pin with a wear-resistant sintered body and metal tip A receiving element which can be introduced into a borehole of at least one component includes a bolt presenting an outer surface that is approximately parallel and advantageously coaxial to a longitudinal axis of the bolt. The receiving element requires few materia... | 04/19/2011 |
| 7735706 | Apparatus for the connection of strips The invention relates to an apparatus and a method for clamping, cutting, and joining strips to a continuous strip. Said device comprises a clamping device (125), a cutting device (155), and a joining device (195). The clamping device, cutting d... | 06/15/2010 |
| 7686203 | Direct application of pressure for bonding porous coatings to substrate materials used in orthopaedic implants A method for constantly controlling a direct application of pressure for bonding porous coatings to substrate materials used in orthopaedic implants. The direct pressure is applied to an interface between the porous coating and the substrate material via a pressure ... | 03/30/2010 |
| 7677428 | Motor vehicle body framing apparatus A motor vehicle body framing apparatus located at a welding station of a motor vehicle assembly line for use in precisely positioning body panels arriving at the welding station for welding. The apparatus includes a base structure positioned at the welding station a... | 03/16/2010 |
| 7464850 | Method and apparatus for flip-chip bonding Provided are a laser flip-chip bonding method having high productivity and excellent bonding reliability and a flip-chip bonder employing the same. The flip-chip bonder includes: a bonding stage on which a substrate rests; a bonding head picking up a semiconductor c... | 12/16/2008 |
| 7389905 | Flip chip bonding tool tip A flip chip bonding tool tip comprising a dissipative material with a resistance low enough to prevent a discharge of a charge to a device being bonded and high enough to avoid current flow large enough to damage the device being bonded is disclosed. Methods for man... | 06/24/2008 |
| 7331439 | Manufacturing plant for parts, particularly vehicle body parts A manufacturing plant (1) is provided for vehicle body parts (2, 3). The manufacturing plant includes a number of processing stations (4, 5, 6, 7, 8, 9, 10), which are situated one behind the other along a transfer line (22), and of a num... | 02/19/2008 |
| 7322510 | Machining system A machining system and unit, especially a welding cell, is provided for use for the machining of workpieces (2), especially body parts of vehicles. The machining system has one or more machining stations (15, 16) with robots (18, 19, 20) and at ... | 01/29/2008 |
| 7308999 | Die bonding apparatus A die bonding apparatus for die bonding at least two members, which are heated in a heat treatment furnace, comprising a first member having a surface to be die bonded on which solder is disposed and a second member disposed to face the first member in a state in wh... | 12/18/2007 |
| 7303113 | Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers A method (and structure) of making an electronic interconnection, includes, for a signal line to be interconnected, using a plurality of bonding wires configured to provide a controlled impedance effect. ... | 12/04/2007 |
| 7303111 | Lightweight bondhead assembly A bondhead assembly having a bond body for mounting a bonding tool, a support structure that is configured to be drivable for moving the bondhead assembly to different locations and flexural elements arranged substantially along at least one plane which couple the b... | 12/04/2007 |
| 7303640 | Orientation equipment with multiple PCBS An orientation equipment with multiple PCBs adapted for a SMT line has a rack module including a casing mounting a front of the SMT line; a visual orientation module having a visual orientation camera used for recognizing the PCB; a movable arm module capable of lat... | 12/04/2007 |
| 7303943 | Method of manufacturing electric device In a method of manufacturing an electric device, moisture in a film substrate is reduced by heating the film substrate at a temperature in the range of 80° C. to 100° C. Thereafter, an IC is mounted on the film substrate. ... | 12/04/2007 |
| 7271367 | Single retainer mounted riser A motor vehicle car body framing apparatus for use at a welding station, the apparatus including a gate having a frame structure and a plurality of tooling members carried by the frame structure for use in positioning components of the vehicle body at the welding st... | 09/18/2007 |
| 7249702 | Multi-part capillary A bonding tool for bonding a wire to a substrate. The bonding tool has a cylindrical body portion formed from a first material and a conical tip portion separately formed from a second material. The conical tip portion is coupled to one end of the body portion. ... | 07/31/2007 |
| 7238919 | Heating element movement bonding method for semiconductor components According to an aspect of the present invention, there is provided a bonding method, comprising disposing on a first body a second body with a bump interposed therebetween; and electrically and mechanically bonding the first body and the second body with the bump by... | 07/03/2007 |
| 7108144 | Portable work stations Portable work stations which permit a one-step, touch-free finishing of all surfaces of doors, shutters, window sashes, cabinet doors, garage doors, spindles, and other workpieces. There are also provided trim measuring and cutting, and hinge mortising and prep rack... | 09/19/2006 |
| 7108167 | Wire bonder with a device for determining the vectorial distance between the capillary and the image recognition system and method A Wire Bonder comprises a bondhead that can be moved in a horizontal plane that has a capillary clamped to a horn and parts of an image recognition system. The tip of the capillary and the optical axis of the image recognition system are separated by a vectorial dis... | 09/19/2006 |
| 7100271 | Automotive vehicle framing system A vehicle framing system for framing an automotive vehicle body from a plurality of separate body components wherein the body components each include a reference surface. The system includes an assembly station having spaced-apart frame members positioned so that, w... | 09/05/2006 |
| 7062893 | System and method for accommodating atypical customer requirements in a mass customization A build cell is utilized to manufacture computers and load data into the computers according to customer orders. The build cell may include a build station at which components are assembled into a computer and a first network connection that links the computer with ... | 06/20/2006 |
| 7054704 | Method, system and facility for controlling resource allocation within a manufacturing environment A method and system provide for the control of resource allocation within a build-to-order manufacturing environment. One example embodiment of a method according to the present disclosure includes an operation for monitoring a work-in-process (WIP) profile that rep... | 05/30/2006 |
| 7044182 | Bonding apparatus with position deviation correction A bonding apparatus that makes correction ΔX=(Xn−Xc) in positioning of bonding tool and substrate where the imaging center of first camera shows deviation +Xc with respect to the imaging center of second camera, and deviation +Xn occurs when bonding tool moves fr... | 05/16/2006 |
| 7035571 | Grid, scorotoron charger having the grid, process unit having the scorotoron charge, and image forming device installing the process unit A grid has a frame body in a U-shaped cross-section defining a main plate section and two side plate sections. A rectangular opening is formed at the main plate section, and a plurality of grid wires extend in a lengthwise direction of the main plate section and at ... | 04/25/2006 |
| 6997026 | Quick change metal stud to hemmed track roll forming system An apparatus and method for selectively forming metal stud and track members from sheet material, the apparatus including a stud forming assembly capable of transforming the sheet material into a stud member as the material exits the stud forming assembly, and a tra... | 02/14/2006 |
| 6954980 | Panel-securing system for various vehicle types A panel-securing system for various vehicle types is provided, in which various clamps and fingers for different panel shapes may be selected for operation by a single cylinder, the amount of space utilized to install the system is minimized, and parts used in the s... | 10/18/2005 |
| 6942137 | Die removal method and apparatus A method and apparatus for separating a semiconductor device from a substrate in a fixture with a shearing element, wherein the semiconductor device is attached to the substrate by solder connections to form an assembly, includes using the shearing element to apply ... | 09/13/2005 |
| 6932263 | Vehicle framing system for plurality of vehicle body styles An apparatus and method for randomly interchanging up to four pairs of side framing gates at a framing station of a vehicle assembly line while maintaining a predetermined build cycle time interval of the assembly line. The system employs first and second carousels ... | 08/23/2005 |
| 6921011 | Work piece holder having top mounted robot and method of use The invention relates to a work piece holder with top mounted robot which optimizes floor space for a work piece positioner and a robot. In general, the work piece positioner assembly and the top mounted robot is supported on a base frame. Attached to the base frame... | 07/26/2005 |
| 6918169 | Method of assembling a vehicle A method of vehicle assembly (10) comprises the step (A) of fabricating a vehicle body (12) having a floor (14) and door (16) openings and roof pillars (18) defining window openings (20), and a roof (17) supported on ... | 07/19/2005 |
| 6915827 | Offset measuring mechanism and offset measuring method in a bonding apparatus An offset measuring mechanism and method used in a bonding apparatus, in which the object plane of a position detection camera is set on a hypothetical bonding working plane, and the image of imaging elements within the imaging plane is projected onto a bonding work... | 07/12/2005 |
| 6880742 | Separating seam welding device Shown is a device and a process for the simultaneous separating and welding of foils or foil tubes (5) where the device comprises at least one welding terminal (2) and an opposing terminal (3), | 04/19/2005 |
| 6871771 | Automated header brazing machine A machine for determining the location of junction tubes along a header and automatically brazing them to the header. A chassis is employed to hold the junction tubes and header in the proper orientation. A carriage then travels along a line which is parallel to the... | 03/29/2005 |
| 6815120 | Battery electrode and manufacturing method and apparatus for the same A workpiece, in which a lead is laid on top of a three-dimensional porous metal body, is placed between an ultrasonic horn and an anvil with a lead portion facing the ultrasonic horn. A support is raised so that the lead portion of the workpiece is pressed between t... | 11/09/2004 |
| 6799709 | Method and apparatus for local application of solder to preselected conductor areas on a printed circuit board An apparatus for locally applying solder to a plurality of sets of preselected conductive areas on each printed circuit board to which component leads are joined. The apparatus includes a flux station with flux nozzles, a preheater station, and a wave solder station... | 10/05/2004 |
| 6742694 | Solder ball disposing apparatus, solder ball reflow apparatus, and solder ball bonding apparatus An apparatus joins bonding pads of a slider and lead pads of lead wires in a head gimbals assembly to improve efficiency, downsizing, and maintenance of solder-ball disposing devices, and solder-ball reflow devices for reflowing solder balls. The solder-ball disposi... | 06/01/2004 |
| 6742695 | Soldering machine for tape carrier package outer leads A soldering machine for tape carrier package. The soldering machine includes a cylinder, a linking rod, a cushioning pad, a floating connector and a press head assembly. The cylinder has a first end and a second end. The linking rod passes through the interior of th... | 06/01/2004 |
| 6691909 | Sonotrode for ultrasonic welding apparatus An apparatus and method for ultrasonically welding workpieces that reduces sonotrode adhesion during the ultrasonic welding process. The sonotrode includes a contact surface wherein a fluid is deposited on the contact surface prior to the welding process.... | 02/17/2004 |
| 6612479 | Apparatus and method for joining layers of materials A method and apparatus for joining multiple layers of materials using an ultrasonic welding apparatus. The ultrasonic welding apparatus utilizes a sonotrode to perform a weld between at least the top and intermediate layer of the multi-layer member. Then,... | 09/02/2003 |
| 6572003 | Seam welding apparatus and seam welding method To provide a seam welding apparatus and a seam welding method that may operate at a low pressure to obtain a suitable overlapped alignment amount. In the seam welding apparatus, a trailing plate clamp moving means is provided with link mechanisms for over... | 06/03/2003 |
