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| Number | Title | Issue Date |
| 7845539 | Bump printing apparatus There is provided a bump printing apparatus that can improve the printability of solder bumps printed on a board. The bump printing apparatus may include a printing table onto which a board is mounted; a mask making close contact with the board and printing solder b... | 12/07/2010 |
| 7837083 | Forming solder balls on substrates A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverte... | 11/23/2010 |
| 7654432 | Forming solder balls on substrates A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverte... | 02/02/2010 |
| 7359207 | Laminated printed circuit board fixture assembly and method A fixture assembly for holding printed circuit boards (PCBAs) during processing such as wave soldering. The fixture assembly consists of multiple plates which are assembled to define protective cavities and recesses for masking components such as surface mounted dev... | 04/15/2008 |
| 7293354 | Apparatus for mounting columns for grid array electronic packages A vacuum controlled fixture is provided for positioning columns on sites of an electronic substrate. The fixture includes an internal chamber having spaced apart first and second surfaces extending beneath its principal face. A regular array of column receiving hole... | 11/13/2007 |
| 7288471 | Bumping electronic components using transfer substrates A method for forming solder bumps on an electronic component. Providing a transfer substrate having a plurality of solder balls, disposing the transfer substrate on the surface of the electronic component, heating to reflow the solder balls onto the electronic compo... | 10/30/2007 |
| 7243834 | Metal mask and method of printing lead-free solder paste using same A lead-free solder paste printing method is practiced with use of a metal mask of the invention by placing the metal mask 1 on a circuit board 2 having an electrode 21 formed in a predetermined pattern to join an end portion of a lead member ... | 07/17/2007 |
| 7213331 | Method for forming stencil A method of forming a stencil for the manufacture of semiconductor devices includes defining a plurality of slightly spaced segmental annular openings in a stencil plate. The spacing between the segmental annular openings define spokes extending from a central porti... | 05/08/2007 |
| 7134592 | Method and protection apparatus for installation of a temperature-sensitive electronic component Temperature-sensitive electrical and electronic components which are connected to a board by soldering during the installation process are protected from the heat during the soldering process in order to prevent permanent damage to the components. The solder connect... | 11/14/2006 |
| 7093746 | Coated stencil with reduced surface tension A stencil used for printing solder paste on a contact pad of a printed wiring board has interior surfaces that define one or more apertures through the stencil. Those interior surfaces are coated with a material, such as parylene, having a lower surface tension than... | 08/22/2006 |
| 7088590 | Soldermask opening to prevent delamination A multilayer circuit board includes a base layer, a conductive layer and a soldermask. The soldermask layer has two sets of openings. One of the openings are vent openings, that expose the base layer to provide ventilation so that gases may escape during processing.... | 08/08/2006 |
| 7084353 | Techniques for mounting a circuit board component to a circuit board A circuit board has a layer of non-conductive material, and a set of soldering pads disposed on the layer of non-conductive material. The set of soldering pads defines a common axis that extends substantially through a midline of each soldering pad. Each soldering p... | 08/01/2006 |
| 7084451 | Circuits with a trench capacitor having micro-roughened semiconductor surfaces A method for forming a trench capacitor. The method includes forming a trench in a semiconductor substrate. A conformal layer of semiconductor material is deposited in the trench. The surface of the conformal layer of semiconductor material is roughened. An insulato... | 08/01/2006 |
| 7070087 | Method and apparatus for transferring solder bumps The present invention relates to improvements in forming and transferring solder bumps for use in mounting integrated circuit substrates on chip carrier packages. A mold having cavities for the solder bumps is held in contact with a substrate and a compressible devi... | 07/04/2006 |
| 7057223 | Circuit and method for a folded bit line memory cell with vertical transistor and trench capacitor A memory cell for a memory array in a folded bit line configuration. The memory cell includes an access transistor formed in a pillar of single crystal semiconductor material. The access transistor has first and second source/drain regions and a body region that are... | 06/06/2006 |
| 7049196 | Vertical gain cell and array for a dynamic random access memory and method for forming the same A vertical gain memory cell including an n-channel metal-oxide semiconductor field-effect transistor (MOSFET) and p-channel junction field-effect transistor (JFET) transistors formed in a vertical pillar of semiconductor material is provided. The body portion of the... | 05/23/2006 |
| 7036712 | Methods to couple integrated circuit packages to bonding pads having vias The electrical contacts of an integrated circuit package are coupled to printed circuit board bonding pads that include vias having via channels. In one embodiment, a method for fabricating an electronic assembly utilizes a mask having at least one aperture that ove... | 05/02/2006 |
| 7007833 | Forming solder balls on substrates A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverte... | 03/07/2006 |
| 6988652 | Solder printing using a stencil having a reverse-tapered aperture A stencil used for printing solder paste on a contact pad of a printed wiring board has one or more reverse-tapered apertures passing there through, wherein the apertures have a variable cross-section that is larger at the fill side of the stencil (i.e., where solde... | 01/24/2006 |
| 6964093 | System for mounting electronic device An electronics packaging system (1) including a printer (3), a placing unit (4) and a reflow unit (5), wherein a printed wiring board (2) is carried while being kept in an upright position. The printed wiring board (2) has s... | 11/15/2005 |
| 6955285 | Apparatus for aligning and dispensing solder columns in an array An apparatus for aligning and dispensing a plurality of solder columns in an array. The apparatus includes a vibrator and an elongated alignment plate supported on the vibrator. The alignment plate includes a plurality of longitudinal guide grooves. A transparent co... | 10/18/2005 |
| 6905059 | Solder ball attachment system A solder ball attachment system for manufacturing an integrated circuit or the like is disclosed. The solder ball attachment system includes a flux station to apply flux onto a substrate and a solder ball placement station to place solder balls onto the flux on the ... | 06/14/2005 |
| 6889886 | Transfer apparatus for arraying small conductive bumps on substrate and/ or chip Conductive balls are transferred from a pallet onto an array of conductive pads on a semiconductor chip by means of a transfer apparatus; the transfer apparatus includes a pallet formed with an array of recesses same in pattern as the array of conductive pads, a mov... | 05/10/2005 |
| 6854638 | Solder paste printing method and apparatus for printing solder paste on a board on which wiring patterns are formed The solder paste printing method of the present invention mounts a solder paste containing therein as a solder material a Sn—Zn system solder on a mask, and urges the solder paste to make rolling over the mask from one end thereof toward the opposite thereof by me... | 02/15/2005 |
| 6814804 | Apparatus and method for printing solder paste A filling squeegee and a scraping squeegee are provided in a printing apparatus. The filling squeegee is moved without contacting a surface of a mask in order to fill a solder paste into openings of the mask. Unnecessary solder paste on the surface of the mask is sc... | 11/09/2004 |
| 6805274 | Solder ball attracting mask and its manufacturing method A solder ball attracting mask which is mounted on a suction apparatus for sucking a plurality of solder balls under vacuum so as to place the solder balls on electrodes of an electronic component and formed with a plurality of through-holes for attracting the solder... | 10/19/2004 |
| 6739498 | Solder ball attachment system A solder ball attachment system for manufacturing an integrated circuit or the like is disclosed. The solder ball attachment system includes a flux station adapted to apply flux onto a substrate and a solder ball placement station adapted to place solder balls onto ... | 05/25/2004 |
| 6708871 | Method for forming solder connections on a circuitized substrate A method of forming solder connections on a circuitized substrate having connection pads is provided. A laser ablatable solder mask material, preferably an epoxy, is degassed and then dispensed as a liquid onto the substrate over the circuitization. The surface of t... | 03/23/2004 |
| 6708868 | Method for producing weld points on a substrate and guide for implementing said method A method for molding and soldering electrical connection pads to the electrical connection-receiving zones of electronic components or circuits includes an operation for the injection of conductive liquid alloy into a guide open at one end placed so as to face the c... | 03/23/2004 |
| 6705513 | Methods of bonding solder balls to bond pads on a substrate, and bonding frames In one embodiment, portions of a plurality of solder balls are placed within a frame and in registered alignment with individual bond pads over a substrate. While the ball portions are within the frame, the balls are bonded to their associated bond pads. In another ... | 03/16/2004 |
| 6702173 | Reflow apparatus in continuous printing and mounting apparatus for film-like printing body When a movement of a film-like printing body is stopped for a longer time than the normal time because of generation of trouble or the like, heat of hot plates for full heating is prevented from being transmitted to the film-like printing body. All of the... | 03/09/2004 |
| 6698648 | Method for producing solderable and functional surfaces on circuit carriers Process for the production of at least one solderable surface in selected solder regions and of at least one functional surface in function regions differing from the solder regions on circuit carriers provided as well as of corresponding circuit carriers... | 03/02/2004 |
| 6676006 | Flux supply device in which liquid flux is supplied through liquid holding portion, and liquid flux supply method A flux supply device comprises a liquid replenishing portion containing a liquid flux for replenishment, a liquid holding portion connected to the lower end of the liquid replenishing portion with a first electromagnetic valve provided therebetween, and a... | 01/13/2004 |
| 6659328 | Method and apparatus for deposition of solder paste for surface mount components on a printed wiring board A method and apparatus for depositing solder paste on a printed wiring board has a stencil with a pattern of multiple apertures. The pattern aligns with a through-hole in the printed wiring board when the stencil is in physical contact with the printed wi... | 12/09/2003 |
| 6641030 | Method and apparatus for placing solder balls on a substrate An apparatus for placing spheres at predetermined positions on a substrate. The apparatus includes a platform to support the substrate at a first sphere placement position in the apparatus, and a placement station disposed above the platform that places s... | 11/04/2003 |
| 6592943 | Stencil and method for depositing solder A method of depositing solder on a conductive region of a substrate comprising providing a substrate having a substrate aperture and a coefficient of thermal expansion. A polymeric stencil is also provided such as to have a stencil aperture and a coeffici... | 07/15/2003 |
| 6569248 | Apparatus for selectively applying solder mask A method and apparatus are disclosed for applying solder mask to an area respective of a plurality of receiving pads on a Printed Circuit Board. The solder mask can be at least partially removed during the component removal process exposing the conductor,... | 05/27/2003 |
| 6550662 | Chip rework solder tool A tool for applying solder paste to leadless chips has recesses adapted to receive the leadless chips. Apertures in each recess are arranged according to pads on the leadless chip. With the chips held in the recesses, solder paste is applied in the apertu... | 04/22/2003 |
| 6510977 | Method and apparatus using laminated foils for placing conductive preforms A method and apparatus are disclosed for placing solder balls 320 on electronic pads 910 or 1010 on a component 900 or substrate 1000, such as for a ball grid array (BGA) applicator 100. The solder balls 320 are held to openings 202 in a foil 130 against ... | 01/28/2003 |
| 6464130 | Method of manufacturing piezoelectric actuator and method of joining lead wire to piezoelectric element of piezoelectric actuator A method is provided for manufacturing a piezoelectric actuator having a piezoelectric element and a lead wire for supplying a drive signal to the piezoelectric element. A melt material is immersed into a fusing agent. A quantity of the material and the f... | 10/15/2002 |
