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Class 228/37 - Flowing flux or filler (e.g., wave former, etc.)


Subclass of Class 228 - Metal fusion bonding
Definition: Device including means to create or support a stream of
No. of patents: 268
Last issue date: 05/29/2012


1              
NumberTitleIssue Date
8186563Automatic soldering device and carrier device
To enable the circuit board to be fixed on a predetermined position and to be conveyed to the solder processing portion. Conveying hooks 10 that hold the printed circuit board W1 therebetween, conveying chains 15a, 15b
05/29/2012
8091759Soldering machine comprising a soldering module and at least one soldering station that is mobile and exchangeable insertable into the soldering module
A soldering machine for soldering components which are mounted on a circuit board contains a soldering module and comprises at least one soldering station which is mobile and exchangeably insertable in the soldering module. The soldering station and the soldering mo...
01/10/2012
8047418Soldering apparatus and method
A soldering apparatus including a vessel containing a molten solder, a casing defining therewithin a soldering chamber in which a flat overflowing wave of the molten solder is formed, a conveyor physically integrated with the casing for movement therewith and operab...
11/01/2011
7988030Wave soldering bath
In a conventional wave soldering bath, the bottom surface of a bath body in a position which is below the inlet of a duct underwent erosion by molten solder and had a hole formed therein, causing molten solder to be spilled out from the hole. The cause of erosion of...
08/02/2011
7959055Wave soldering tank
In a wave soldering tank using a conventional screw pump, pulsation sometimes occurred in which molten solder spouting from the discharge nozzle moved up and down. The cause of the occurrence of the pulsation in a screw pump was that the gap between the screw pump a...
06/14/2011
7905382Wave soldering tank
A wave soldering tank is provided on which it is easy to perform maintenance, which does not have fluctuation of the height of spouted solder, which does not damage the rotating shaft of a discharge pump, and which can be stably used for long periods. The wav...
03/15/2011
7780057Soldering apparatus and soldering method
A soldering apparatus has a conveyor which conveys an electronic circuit board, a fluxer which applies a flux having water as a solvent to a surface of the electronic circuit board to be soldered, a first heating device which heats the electronic circuit board, a wa...
08/24/2010
7416103Flow soldering apparatus
A compact soldering apparatus capable of increasing reliability of products by reducing occurrence of dross and using lead-free solder, wherein a primary jet nozzle 1, a secondary jet nozzle 2, and a pump (not shown) forming jet waves 24, 25 are...
08/26/2008
7410093Solder wave process for solder shunts for printed circuit board
A method of making a printed circuit board having zero resistance connections. Pairs of shunt pads are formed on the board, spaced sufficiently far apart to avoid short circuiting but sufficiently close to permit a solder bridge to occur between them during a solder...
08/12/2008
7289337Electronic card with braced structure
The field of the invention is that of electronic computers that have to operate in a harsh mechanical environment. One of the main fields of application relates to computers for on-board fixed-wing and rotary-wing aircraft avionics systems operating in a highly vibr...
10/30/2007
7229000Adjustable frame fixture
An adjustable frame fixture aims to hold a printed-circuit board (PCB) to pass over a tin oven to process wave soldering. The fixture includes at least two side frames and at least two fasteners. The two side frames are coupled to form a holding dock. The positions ...
06/12/2007
7213738Selective wave solder system
The present invention relates to a selective wave solder machine. In particular, it relates to a system for calibrating and adjusting process points to account for variations in machines and circuit boards. Vision systems are used to locate fiducials on the processi...
05/08/2007
7213737Graphite braze bar inserts
Disclosed is a braze bar carrier system for utilization in holding and maintaining the alignment of a plurality of components in an apparatus during a brazing process. The braze bar carrier system includes a graphite insert that prevents the brazing flux from wettin...
05/08/2007
7211773Conveyance and forming apparatus
A conveyance apparatus comprises a transformer having a core, a primary coil connected to an alternate power source and a secondary coil connected to an output coil, a holding section including a conductive member for heating fluid by high frequency induction heatin...
05/01/2007
7169650Semi-solid metal injection methods for electronic assembly thermal interface
To accommodate high power densities associated with high performance integrated circuits, an integrated circuit package includes a heat-dissipating structure in which heat is dissipated from a surface of a die to an integrated heat spreader (IHS) through a high capa...
01/30/2007
7150387Process and apparatus for flow soldering
An apparatus for mounting an electric component onto a board by means of a lead-free solder material. The apparatus of the present invention has a solder material supplying chamber in which a melt of the solder material is supplied to the board by a solder material ...
12/19/2006
7134592Method and protection apparatus for installation of a temperature-sensitive electronic component
Temperature-sensitive electrical and electronic components which are connected to a board by soldering during the installation process are protected from the heat during the soldering process in order to prevent permanent damage to the components. The solder connect...
11/14/2006
7131566Packaging method using lead-free solder
This invention relates to a packaging method using lead-free solder, characterized by including a reflow-soldering step in which a surface mount device is soldered to a circuit board with a lead-free solder paste; an inserting step in which the lead or terminal of a...
11/07/2006
7048173Wave soldering method using lead-free solder, apparatus therefor, and wave-soldered assembly
The present invention relates to a wave soldering method and a wave soldering apparatus using lead-free solder comprising a wave soldering step in which the lower side of a substrate with leads of component parts inserted in through-holes formed in the substrate fro...
05/23/2006
7032803Jet nozzle structure for soldering apparatus
A jet nozzle structure for a soldering apparatus for soldering a local area of a substrate on which electric components are placed improves the soldering performance. The soldering apparatus includes a tubular body formed on a soldering bath filled with molten solde...
04/25/2006
6974071Inclined solder wave methodology for wave soldering double sided pin-in-hole electronic components
An apparatus for applying solder to an electronic circuit board substrate includes a solder wave device for generating a molten wave of solder and, above that, a movable substrate holder. The substrate holder includes a support for an electronic circuit board substr...
12/13/2005
6945445Supporting tray for wave soldering
A supporting tray for moving a PCB (10) in a wave solder machine includes a frame (30) and a circular plate (20). The frame includes a circular opening (33) defined thereof and a graduated scale (31) marked thereon around the circu...
09/20/2005
6942791Apparatus and method for recycling of dross in a soldering apparatus
An apparatus and method for eliminating dross in a solder pot of a soldering machine by converting the dross into usable solder. The conversion apparatus is comprised of an impeller, a shroud, an electric motor for driving the impeller, a vacuum source operatively c...
09/13/2005
6919229Method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid
A method and apparatus for achieving a consistent depth of immersion of a semiconductor element into an exposed surface of an adhesive material pool when applying the adhesive material, conductive or non-conductive, to the semiconductor element or portion thereof. T...
07/19/2005
6915941Method for local application of solder to preselected areas on a printed circuit board
A method for locally applying solder to a set of preselected conductor areas on a printed circuit board without causing thermal damage to adjacent sensitive surface mounted devices and connectors. Before solder is applied, molten solder within a solder reservoir is ...
07/12/2005
6913182Method and apparatus for controlled application of flux
Apparatus and methods for applying atomized pulsed streams of flux to a surface such as a printed circuit board. The flux is applied discretely in selected locations and at selected thickness based upon pulse rate, fluid pressure, air pressure and traverse speed. Th...
07/05/2005
6913183Selective gas knife for wave soldering
Selective gas knives for wave soldering provide for targeted gas flow at a particular location on a substrate, such as a printed circuit board. Both the temperature and flow rate of gas through a segment of a gas knife can be independently controlled. ...
07/05/2005
6851596Wave soldering apparatus
A wave soldering apparatus includes a solder reservoir within which a pool of molten solder is held at a suitable temperature by heaters. Each heater has an electric heating element and a cover mounted to the solder reservoir to protect the heating element from the ...
02/08/2005
6817510Apparatus for increasing wave height of molten solder in solder bath
The present invention discloses an apparatus applied to the wave former of the wave soldering system to increase the wave height of molten solder. The apparatus comprises a block board and a gland, wherein the block board is mounted on the enclosing walls of the wav...
11/16/2004
6805282Flow soldering process and apparatus
There is provided a flow soldering process for mounting an electronic component onto a board by a solder material, which process is appropriate for using a lead-free solder material as the solder material. In the flow soldering process, thermal efficiency of ...
10/19/2004
6785960Wave solder application for ball grid array modules
A method for fabricating a printed circuit board assembly comprising a via, wherein the method inhibits the flow of molten solder into the via during a wave soldering step, thereby preventing heat transfer that might otherwise degrade a solder joint at a top pad tha...
09/07/2004
6742693Solder bath with rotatable nozzle
A new solder bath apparatus applied to the soldering furnace is disclosed herein. The solder bath is used for containing molten solder. And a nozzle base is located in the solder bath to flow molten solder upwards. An enclosing frame with axial horizontal pillars mo...
06/01/2004
6732903Adjustable nozzle of stannic furnace
An adjustable nozzle of a stannic furnace comprises a nozzle tank which is mounted at the upper portion of a stannic tank of the stannic furnace, a front backflow stopper and a rear backflow stopper which are respectively mounted at the forward area and the backward...
05/11/2004
6732907Soldering method, soldering device, and method and device of fabricating electronic circuit module
A soldering method including: bonding a first electronic component having electrodes plated with a material containing lead to one surface of an interconnect substrate through solder containing no lead; and flow-soldering to bond a second electronic component to the...
05/11/2004
6726082Soldering apparatus
A soldering apparatus for soldering a printed wiring board includes a solder vessel for containing molten solder, a nozzle disposed in the vessel and having opposing first and second opening, and an electromagnetic pump secured in the vessel and including a tubular ...
04/27/2004
6722554Soldering apparatus
Soldering apparatus designed to apply soldering, by means of jetting out streams of molten solder, which is gathered in a solder bath, to a piece to be soldered carried in a predetermined direction. While jetting out molten solder from the solder bath, a drive means...
04/20/2004
6688511Wave solder apparatus and method
A method of soldering a circuit board comprises moving a circuit board through various stations including a preheater station and a solder station....
02/10/2004
6655574Apparatus for selective soldering
The invention relates to a soldering apparatus, including a vessel for containing and heating molten solder, transporting means for transporting objects for soldering to the vessel and removing said objects, at least one tube extending substantially verti...
12/02/2003
6607116Method and apparatus for estimating quality of lead-free solder material and process and system for flow soldering
There is provided a method which can conveniently estimate a quality of a lead-free solder material used for a flow soldering process. In the present invention, a differential thermal analysis curve of a sample of the lead-free solder material is obtained...
08/19/2003
6588919Wave solderable pedestalled LED
A pedestalled LED 10 including a light emitting diode element 12 and a tower element 14 for use on the wave soldered side of a circuit board 16. The light emitting diode element 12 and the tower element 14 are capable of withstanding exposure to wave sold...
07/08/2003
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