Bizarre Patents
An aircraft having vertical takeoff and landing capability provided with at least first and second laterally extending paddle wheels rotatable on a central axis perpendicular to the longitudinal axis of the aircraft fuselage and between its nose and tail.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8162200 | Micro-fluidic injection molded solder (IMS) A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end... | 04/24/2012 |
| 8146792 | Solder return for wave solder nozzle A solder return apparatus for a wave solder machine that collects solder exiting a nozzle and returns the solder to a solder reservoir while limiting the degree to which the solder can splash onto electronic substrates (e.g., printed circuit boards), components of t... | 04/03/2012 |
| 8136714 | Micro-fluidic injection molded solder (IMS) A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end... | 03/20/2012 |
| 8104661 | Heating device, reflow device, heating method, and bump forming method A solder bump is formed on a substrate by using a heating device where a lid structure blocks hot air from directly blowing against a solder composition. The heating device can reduce high-temperature oxygen molecules that come into contact with the solder compositi... | 01/31/2012 |
| 8104662 | Inert environment enclosure A novel inert environment enclosure includes an object inlet where production objects enter the enclosure and an object outlet where the production objects exit. At least one of the object inlet and the object outlet includes both a top-side flow obstructer and a bo... | 01/31/2012 |
| 8091758 | Wave soldering bath In a conventional wave soldering bath, molten solder spouted from a second discharge nozzle did not have a uniform height, oxides were spouted from the nozzle opening and adhered to printed circuit boards, and constituent parts of the wave soldering bath were eroded... | 01/10/2012 |
| 8056795 | Fluxometer with a cover having protrusions A fluxometer system and method is provided. The fluxometer comprises a frame, a simulated circuit board disposed in the frame and having a plurality of holes formed therein extending generally transverse to a plane of the board and a cover. The cover is received on ... | 11/15/2011 |
| 8002164 | Step-down transition of a solder head in the injection molding soldering process A mold plate to parking location interface includes: a mold plate for holding solder; a fill head with an o-ring for dispensing solder bumps on the mold plate; a parking location for locating the fill head; and a platform between the mold plate and the parking locat... | 08/23/2011 |
| 7980446 | Micro-fluidic injection molded solder (IMS) A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end... | 07/19/2011 |
| 7980445 | Fill head for full-field solder coverage with a rotatable member A system, apparatus, and method, are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an e... | 07/19/2011 |
| 7819301 | Bumping electronic components using transfer substrates A method for forming solder bumps on an electronic component. Providing a transfer substrate having a plurality of solder balls, disposing the transfer substrate on the surface of the electronic component, heating to reflow the solder balls onto the electronic compo... | 10/26/2010 |
| 7784664 | Fill head for injection molding of solder A system, method, and apparatus for injection molding conductive bonding material into a plurality of cavities in a surface are disclosed. The method comprises aligning a fill head with a surface. The mold includes a plurality of cavities. The method further include... | 08/31/2010 |
| 7703658 | Apparatus and method for semiconductor wafer bumping via injection molded solder An improved apparatus for filling patterned mold cavities formed on a surface of a mold structure with solder includes an injector head assembly comprising a solder reservoir having a bottom surface with an elongated slot for injecting solder into the mold cavities ... | 04/27/2010 |
| 7669748 | Conductive bonding material fill techniques A system provides solder into cavities in a circuit supporting substrate. The system places a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or a rotational motion ... | 03/02/2010 |
| 7405379 | System for applying an isolation layer to a brazed end of a generator armature winding bar A method of forming a brazed joint between an armature bar and a hydraulic header clip including: assembling an end of the armature bar, hydraulic header clip and a substantially phosphorus-free braze material; positioning the assembly of the armature bar, hydraulic... | 07/29/2008 |
| 7401637 | Pressure-only molten metal valving apparatus and method A new pressure-only molten metal valving apparatus and method is provided. This novel approach to controlling the flow of liquids eliminates the need for active, moving valve components. Using the natural surface tension properties of liquids, the gas pressure eithe... | 07/22/2008 |
| 7389903 | Device and method for soldering contacts on semiconductor chips A device for soldering contacts on semiconductor chips. A chip is held on a chip mount by a chuck and is heated from a side facing away from the wafer by means of a radiation source, so that a solder applied to a side facing the wafer is melted. A flushing device, h... | 06/24/2008 |
| 7380699 | Method and apparatus for vapour phase soldering The present invention concerns a method and an apparatus for performing soldering of items that are applied a soldering agent, where the soldering apparatus includes at least one soldering zone, where the soldering zone include means for generating vapor, the appara... | 06/03/2008 |
| 7372056 | LPP EUV plasma source material target delivery system An EUV light generation system and method is disclosed that may comprise a droplet generator producing plasma source material target droplets traveling toward the vicinity of a plasma source material target irradiation site; a drive laser; a drive laser focusing opt... | 05/13/2008 |
| 7360679 | Method for the production of a soldered connection A method for the production of a soldered joint between at least two contact partners (22, 23) of a bonding arrangement (21), with a formed piece of solder material (27) being arranged at a distance to the bonding arrangement. The formed piece o... | 04/22/2008 |
| 7357295 | Solder ball supplying method and supplying device After introducing a solder ball from a hopper into a receiving hole of a ball separator, the ball separator is slid between blocks, and the solder ball is sent out to a portion outside of the blocks. By suctioning the solder ball from within a projected region on a ... | 04/15/2008 |
| 7347349 | Apparatus and method for printing micro metal structures A method and device for printing liquid material such as liquid solder is provided. C4 structures as small as 10 microns in diameter can be produced using devices and methods described above. Further, devices and methods provided are able to operate at temperatures ... | 03/25/2008 |
| 7331503 | Solder printing process to reduce void formation in a microvia In one embodiment, a method is provided. The method comprises filling a microvia formed in a bond pad with solder paste comprising solder balls of the first size; and coating the bond pad with solder paste comprising solder balls of the second size, wherein the seco... | 02/19/2008 |
| 7331106 | Underfill method A process for selectively depositing a filled underfill material onto a die surface without covering solder bumps present on the die. The process entails microjetting a polymer matrix material, a filler material, and optionally a fluxing material onto the die surfac... | 02/19/2008 |
| 7322511 | Apparatus and method for printing micro metal structures A method and device for printing liquid material such as liquid solder is provided. C4 structures as small as 10 microns in diameter can be produced using devices and methods described above. Further, devices and methods provided are able to operate at temperatures ... | 01/29/2008 |
| 7259356 | Temperature self-regulating soldering iron with removable tip A soldering iron with a removable tip, including: a soldering iron, including: a shaft; a ferrite bobbin disposed on the shaft; a magnetic coil wrapped around the ferrite bobbin; and a removable tip with a heater element disposed thereon, wherein the heater element ... | 08/21/2007 |
| 7225965 | Multiple probe power systems and methods for ultrasonic welding An ultrasonic welding probe power supply for powering more than one ultrasonic welding probe with power is provided. The power supply is adapted to provide power only to one welding probe at a time. A ringdown period is monitored between termination of provision of ... | 06/05/2007 |
| 7222734 | Welding wire package with lifting strap A package for containing a coil of wire having an outer cylindrical surface extending about a coil axis, a top and an oppositely facing bottom has a base for supporting the bottom of a wire coil when the wire coil is in the package. At least one side wall extends up... | 05/29/2007 |
| 7191968 | System for handling welding wire and method of handling welding wire using the system A coiled supply of welding wire in combination with a container. The container has a main body defining an upwardly opening receptacle with bottom wall and a radially inwardly facing surface on a peripheral wall extending upwardly from the bottom wall. The container... | 03/20/2007 |
| 7191930 | Electrostatic methods and apparatus for mounting and demounting particles from a surface having an array of tacky and non-tacky areas Methods and associated apparatus are disclosed for use in mounting particles on and de-mounting particles from a substrate having an array of tacky and non-tacky areas. The particles can be either electrically conducting or electrically non-conducting. Selection of ... | 03/20/2007 |
| 7193228 | EUV light source optical elements Apparatus and methods are disclosed for forming plasma generated EUV light source optical elements, e.g., reflectors comprising MLM stacks employing various binary layer materials and capping layer(s) including single and binary capping layers for utilization in pla... | 03/20/2007 |
| 7187078 | Bump structure Solder bump structures for semiconductor device packaging is provided. In one embodiment, a solder bump structure comprises a semiconductor substrate, the substrate has at least one contact pad and an upper passivation layer having at least one opening formed therei... | 03/06/2007 |
| 7179682 | Packaged device and method of forming same A method of packaging an integrated circuit die includes the steps of loading an array of soft conductive balls into recesses formed in a platen and locating the platen in a first part of a mold cavity. A second part of the mold is pressed against the balls to flatt... | 02/20/2007 |
| 7169650 | Semi-solid metal injection methods for electronic assembly thermal interface To accommodate high power densities associated with high performance integrated circuits, an integrated circuit package includes a heat-dissipating structure in which heat is dissipated from a surface of a die to an integrated heat spreader (IHS) through a high capa... | 01/30/2007 |
| 7168608 | System and method for hermetic seal formation System and method for formation of a hermetic seal with an significantly greater melting temperature than the melting temperature of the solder employed. The hermetic seal is formed from a solder with a low melting point and a metal having a predetermined thickness ... | 01/30/2007 |
| 7164097 | Solder ball bonding method and bonding device Provided are a solder ball bonding method and a solder ball bonding device for performing bonding of a plurality of electrode portions formed on objects to be bonded by melting solder balls. The solder balls are suctioned by using a plurality of suction nozzles that... | 01/16/2007 |
| 7159752 | Continuous mode solder jet apparatus A solder jet apparatus is disclosed. The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems allows for a continuous stream of solder to be placed anywhere on th... | 01/09/2007 |
| 7152735 | Cover for a recyclable container A removable cover for a container and a container having the removable cover. The cover may be adapted with an opening to enable wire to pass through the cover with the cover disposed on the container. The container may be adapted to be lifted by inserting a fork, o... | 12/26/2006 |
| 7121449 | Method and device for applying material to a workpiece In order to apply solder material (20) to a workpiece (1), compressed gas is guided through a bore hole (5) of a capillary (3). A pressure sensor (13) situated in the bore hole (5) measures the dynamic pressure of the compre... | 10/17/2006 |
| 7122816 | Method and apparatus for EUV light source target material handling An EUV light source plasma source material handling system and method is disclosed which may comprise a droplet generator having a droplet generator plasma source material reservoir in fluid communication with a droplet formation capillary and maintained within a se... | 10/17/2006 |
