Bizarre Patents
Method and apparatus for making a drink hop along a bar or counter
A method for generating a drink which appears to hop from a remote spot on the bar or counter and take one or more leaps, before landing in a patron's glass.
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| Number | Title | Issue Date |
| 8132710 | Deconstructable assembly and method An assembly (10) that can be both joined and parted by temperature processing. A parting member (20) captured between two members of the assembly exhibits a state change as a function of temperature such that the two members can be joined with a meltab... | 03/13/2012 |
| 8070050 | Heat conducting apparatus and solder melting method therefor A heat conducting apparatus includes an air guide hood and a heat conducting device. The air guide hood is connected to a hot air supply source for delivering hot air, and includes an air outlet for exit of the hot air. The heat conducting device is disposed at the ... | 12/06/2011 |
| 7806312 | Method and apparatus for removing known good die A method and structure is disclosed for detaching a chip from a substrate that delays the delivery of shear force to the chip until the connectors attaching the chip to the substrate are soft enough that the delivery of shear force will not damage the chip's connect... | 10/05/2010 |
| 7441687 | Desoldering sheath The present invention provides a desoldering sheath and a method for making the same. The desoldering sheath is comprised of multiple metal ropes that are each made from two or more fine-gauge wire threads. The metal ropes are woven together to form a metal fabric t... | 10/28/2008 |
| 7353983 | Vertical removal of excess solder from a circuit substrate A method for vertical removal of excess solder from a circuit substrate includes the use of a sacrificial circuit substrate with a plurality of pads and vias that are solder-wettable. The pads and vias of the sacrificial circuit substrate are placed in vertical prox... | 04/08/2008 |
| 7340305 | Implantable medical device feedthrough assembly having a coated conductor An electrical feedthrough for an implantable medical device (IMD) is provided that employs a feedthrough conductor having a non-platinum based inner core and one or more layers of a conductive coating to control oxide growth on the surface of the conductor. The coat... | 03/04/2008 |
| 7308999 | Die bonding apparatus A die bonding apparatus for die bonding at least two members, which are heated in a heat treatment furnace, comprising a first member having a surface to be die bonded on which solder is disposed and a second member disposed to face the first member in a state in wh... | 12/18/2007 |
| 7303109 | Stud bumping apparatus The invention provides an apparatus and a method for forming conductive bumps on a plurality of semiconductor devices with an oxidizable material. The apparatus comprises a bump forming device, a chamber system adapted to house the semiconductor devices and a gas su... | 12/04/2007 |
| 7303427 | Electrical connector with air-circulation features A preferred embodiment of an electrical connector includes an electrical conductor for transmitting electrical power, and a housing. The electrical conductor is mounted in the housing so that the housing and the electrical conductor define a channel for circulating ... | 12/04/2007 |
| 7299965 | Method and apparatus for mounting and removing an electronic component A method and an apparatus are provided for mounting and removing electronic components using solder bumps while constraining thermal stresses to a substrate. The method and apparatus for mounting and removing an electronic component (bear chip 32) to be solde... | 11/27/2007 |
| 7290695 | Friction stir welding apparatus The apparatus includes a base 23 fixed at a predetermine position, a tool holding jig 29, to which a welding tool 21 is mounted, installed on the base 23 rotatably about a preset reference axis L1 and movably along the reference ax... | 11/06/2007 |
| 7238919 | Heating element movement bonding method for semiconductor components According to an aspect of the present invention, there is provided a bonding method, comprising disposing on a first body a second body with a bump interposed therebetween; and electrically and mechanically bonding the first body and the second body with the bump by... | 07/03/2007 |
| 7238543 | Methods for marking a bare semiconductor die including applying a tape having energy-markable properties A method used for marking a semiconductor wafer or device. The method and apparatus have particular application to wafers or devices which have been subjected to a thinning process, including backgrinding in particular. The present method comprises reducing the cros... | 07/03/2007 |
| 7234218 | Method for separating electronic component from organic board A method and electrical structure for separating electronic components from one another joined by solder interconnections. An electronic module is joined to a substrate via a solder interconnection, whereby the electronic module has an electrical heating component r... | 06/26/2007 |
| 7222772 | Flip chip bonder A flip chip bonder including a substrate holding mechanism and a chip die bonder for bonding a semiconductor chip having a plurality of electrodes projecting from its front surface to a substrate held on the substrate holding means. The flip chip bonder includes a c... | 05/29/2007 |
| 7168609 | Method and apparatus for removing known good die A method and structure is disclosed for detaching a chip from a substrate that delays the delivery of shear force to the chip until the connectors attaching the chip to the substrate are soft enough that the delivery of shear force will not damage the chip's connect... | 01/30/2007 |
| 7134590 | Desoldering sheath A desoldering sheath that comprises at least one hollow metal wire molded to conform to the tip of a desoldering tool. In one implementation, the desoldering sheath is formed using a hollow metal wire that is coiled around a male cone-shaped mold. The coiled, hollow... | 11/14/2006 |
| 7100815 | Diebond strip A titanium alloy strip has a reduced cross section in the central region of the strip. By concentrating heat in this central region the process of bonding laser devices to a substrate is greatly improved. Furthermore, the present invention allows for the possibility... | 09/05/2006 |
| 7094618 | Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tape The present invention provides a method and apparatus for marking a semiconductor wafer or device. The method and apparatus have particular application to wafers or devices which have been subjected to a thinning process, including backgrinding in particular. The pr... | 08/22/2006 |
| 7047635 | Connecting material and connecting method A connecting material can form a detachable connecting structure. According to the connecting material, a connecting portion between a certain object and another object can be more readily formed, and the certain object can be more readily detached from the another ... | 05/23/2006 |
| 7007835 | Solder bonding technique for assembling a tilted chip or substrate A method for solder bonding a photodiode or an array of photodiodes to a substrate, the photodiode(s) tilted at a predetermined angle, uses a pair solder bumps placed on a photodiode chip opposite a corresponding pair of solder pads placed on the substrate. When the... | 03/07/2006 |
| 7006090 | Method and computer program product for lighting a computer graphics image and a computer The invention relates to a method to and a computer program product for lighting a computer graphics image to be rendered. It is assumed that a plurality of light sources illuminate one or more objects of the scene to be rendered thus causing a complex lighting situ... | 02/28/2006 |
| 7004371 | Gripper and method for detaching packaged chip from PCB A gripper for detaching a packaged chip from a PCB. The gripper comprises a plurality of hooks, elastic slices, and a heating device. These hooks are used for gripping and hooking the packaged chip. Each hook includes a chip-upholding part and a chip-gripping part, ... | 02/28/2006 |
| 6957686 | Heated blades for wax melting A knife for heating the wax on the surface of a wax runner. The knife as a surface which is recessed in the center of the surface to permit melted wax to flow up into the recessed area and not flow away from the knife. Alternately, conformal heating surface which me... | 10/25/2005 |
| 6946856 | Thermal testing method for integrated circuit chips and packages A method of thermally testing for whether an integrated circuit die is attached to a die pad, is provided. Heat is applied from an external heat source to a first side of the die pad. The die is attached to a second side of the die pad. The second side of the die pa... | 09/20/2005 |
| 6945447 | Thermal solder writing eutectic bonding process and apparatus A chip or die attachment process and related apparatus, in which a desired quantity of solder (7 or 17) is dispensed onto each, in turn, of a number of desired locations on a substrate (4 or 18), and then an integrated-circuit chip (10... | 09/20/2005 |
| 6942137 | Die removal method and apparatus A method and apparatus for separating a semiconductor device from a substrate in a fixture with a shearing element, wherein the semiconductor device is attached to the substrate by solder connections to form an assembly, includes using the shearing element to apply ... | 09/13/2005 |
| 6940537 | Inspecting apparatus of printed state or the like in flexible printed circuit board To provide an inspecting apparatus of a printed state or the like in a flexible printed circuit board which requires no skill, generates no error by oversight and further improves an operation efficiency, a substrate feeding out unit (2), a substrate invertin... | 09/06/2005 |
| 6908025 | Preparing MCM hat for removal A process and apparatus for preparing an MCM for hat removal where the hat includes a piston thermally coupled to a corresponding chip. The apparatus includes a heater positioned to reflow a joint between the piston and a base of the hat; and a retractor for biasing... | 06/21/2005 |
| 6860419 | Apparatus and method for controlling movement of a device after packaging An apparatus and method for controlling movement of packaged devices. Specifically, embodiments of the present invention discloses an apparatus a method of providing a controlling mechanism for effecting physical control over a device that is disposed on a structure... | 03/01/2005 |
| 6811072 | Known good die removal method and apparatus A method and apparatus for separating a chip from substrate where the chip is attached to the substrate by solder connections to form an assembly involve applying a loading force to drive a coil spring biased shearing element comprising a slide block with carrying a... | 11/02/2004 |
| 6761304 | Heating head for soldering and de-soldering of SMD components A heating head for soldering and de-soldering surface mount devices (SMD's) using hot inert gas or air is comprised of a handle in which there is placed a heater sub-assembly on which there is secured a quick connect mechanism for mounting a heating nozzle. The heat... | 07/13/2004 |
| 6745932 | Low strain chip removal apparatus A method and structure for a chip detach apparatus and method that limits the solder ball maximum shear rate and, more particularly, that delays the application of shear force until a minimum predefined temperature is reached. The chip detach apparatus and method ca... | 06/08/2004 |
| 6719188 | Rework methods for lead BGA/CGA A method and apparatus are provided for reworking electronic component assemblies where the components are joined by solder interconnections. A cutting device employing a heated wire, blade or other cutting element is forced against and through the solder interconne... | 04/13/2004 |
| 6705509 | Method of recovering lead-free solder from printed circuit boards Discarded printed circuit boards are sorted according to the alloying elements in solder used on the printed circuit boards. After sorting, the printed circuit boards are heated to melt the solder, and the molten solder is collected. ... | 03/16/2004 |
| 6698649 | Desolder apparatus Apparatus and methods for removing solder ball connections from electrical circuits are disclosed. The apparatus and methods comprise a solder ball removing tool 20 having a multiplicity of raised ribs 22 defining a contact surface 24 and made up of heat ... | 03/02/2004 |
| 6655576 | Process for disassembling a brazed structure Brazed structures comprising hollow components having a closure component bonded thereto by a metallic brazing alloy for closing off an end of the hollow component are disassembled by locating a wire transport material in the hollow component and covering... | 12/02/2003 |
| 6651872 | Method and apparatus for disassembling joined layers The present invention is a disassembly apparatus and method for disassembling a workpiece having at least two layers joined together by welding or other bonding processes at bonding points. The method includes the steps of securing the workpiece into a fi... | 11/25/2003 |
| 6634092 | Apparatus for replacing parts connected to circuit board A flash circuit board in a lens-fitted photo film unit includes a board part, and a battery contact part connected to the board part by solder. A part exchanging apparatus for the circuit board includes an eliminating unit, which melts the solder, and rem... | 10/21/2003 |
| 6629351 | Apparatus and method for separating cull in a package assembly process An apparatus and a method for separating a cull from a molded part including a chip mounted on a tape circuit board are provided. The apparatus includes a cull support block for supporting a cull and a cull holder for clamping the cull. The cull holder is... | 10/07/2003 |
