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| Number | Title | Issue Date |
| 7372056 | LPP EUV plasma source material target delivery system An EUV light generation system and method is disclosed that may comprise a droplet generator producing plasma source material target droplets traveling toward the vicinity of a plasma source material target irradiation site; a drive laser; a drive laser focusing opt... | 05/13/2008 |
| 7353976 | Wire bonder A Wire Bonder contains a bondhead and a rocker arranged on the bondhead that is rotatable on a horizontal axis. A horn with a flange is attached to the rocker in which a capillary is clamped. At least one sensor is attached to the bondhead that detects vibrations of... | 04/08/2008 |
| 7193228 | EUV light source optical elements Apparatus and methods are disclosed for forming plasma generated EUV light source optical elements, e.g., reflectors comprising MLM stacks employing various binary layer materials and capping layer(s) including single and binary capping layers for utilization in pla... | 03/20/2007 |
| 7191930 | Electrostatic methods and apparatus for mounting and demounting particles from a surface having an array of tacky and non-tacky areas Methods and associated apparatus are disclosed for use in mounting particles on and de-mounting particles from a substrate having an array of tacky and non-tacky areas. The particles can be either electrically conducting or electrically non-conducting. Selection of ... | 03/20/2007 |
| 7159752 | Continuous mode solder jet apparatus A solder jet apparatus is disclosed. The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems allows for a continuous stream of solder to be placed anywhere on th... | 01/09/2007 |
| 7122816 | Method and apparatus for EUV light source target material handling An EUV light source plasma source material handling system and method is disclosed which may comprise a droplet generator having a droplet generator plasma source material reservoir in fluid communication with a droplet formation capillary and maintained within a se... | 10/17/2006 |
| 7073700 | Process and apparatus for applying brazing material to a metallic structure through the use of vibration A process and an apparatus for applying a brazing material to a metallic structure, especially a honeycomb body, include bringing the metallic structure into contact with a pulverulent brazing material in such a way that the brazing material at least partially adher... | 07/11/2006 |
| 7029624 | High-speed fabrication of highly uniform metallic microspheres In a high-speed fabrication process for producing highly uniform metallic microspheres, a molten metal is passed through a small orifice, producing a stream of molten metal therefrom. A series of molten metal droplets forms from the break up of the capillary stream.... | 04/18/2006 |
| 6954021 | Matching circuit for megasonic transducer device A method and apparatus for matching impedance magnitude and impedance phase for an acoustic- wave transducer load and an RF power source. The acoustic-wave transducer load has a load impedance magnitude and phase. The RF power source has a source impedance magnitude... | 10/11/2005 |
| 6902101 | Bump bonding method apparatus In a bump bonding technique for forming a bump on an IC, including forming a ball at the tip of a gold wire protruding from a capillary, and providing a metal-to-metal joint by applying ultrasonic vibration from a ultrasonic head through the capillary while pressing... | 06/07/2005 |
| 6676890 | Device for producing spherical balls Spherical balls, notably microballs of welding alloys, are produced by passing a melted material through vibrating orifices of a granulation pot, in order to form droplets which solidify when falling, by gravity, into a cooling tower filled with an inert ... | 01/13/2004 |
| 6588645 | Continuous mode solder jet apparatus A solder jet apparatus is disclosed. The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems allows for a continuous stream of solder to be placed any... | 07/08/2003 |
| 6585152 | Method of making a multi-electrode double layer capacitor having single electrolyte seal and aluminum-impregnated carbon cloth electrodes A method of making a double layer capacitor consists of the steps of: impregnating each of a plurality of carbon preforms with a metal; forming a plurality of current collector foils, each of the plurality of current collector foils having a tab portion a... | 07/01/2003 |
| 6569378 | Apparatus for manufacturing solder balls An apparatus for manufacturing solder balls including a tundish, a vibrator, a cooling liquid tank an inactive atmospheric chamber, a molten metal receiving tray, a ball collecting barrel, and a cooling liquid reservoir. The tundish has orifices at its bo... | 05/27/2003 |
| 6540129 | Apparatus and method for manufacturing solder balls An apparatus and method for manufacturing solder balls used for an electrical and/or mechanical connection between a semiconductor chip and a substrate are provided. The apparatus includes a melting furnace having a nozzle through which a molten solder pa... | 04/01/2003 |
| 6520402 | High-speed direct writing with metallic microspheres Ultra-small satellite droplets of molten metal, generated from capillary stream break-up, are selectively directed to predetermined locations on a substrate. The satellite droplets are produced at a high rate and are highly uniform because of the nature o... | 02/18/2003 |
| 6474538 | Bonding apparatus and bonding method A higher speed moving device moves a capillary at high speed. A low inertial moving and pressing device moves and presses the capillary with low inertia. The high speed motion, and the moving and pressing motion with the low inertia are carried out indepe... | 11/05/2002 |
| 6454154 | Filling device A delivery system a soldering paste to an electronics package includes a pressurized supply of via fill paste and a pressure head attached to the pressurized supply of via fill paste. The pressure head includes a main body and a wear portion. Attached to ... | 09/24/2002 |
| 6443350 | Continuous mode solder jet apparatus A solder jet apparatus is disclosed. The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems allows for a continuous stream of solder to be placed any... | 09/03/2002 |
| 6422452 | Method and apparatus for lining up micro-balls An apparatus for lining up micro-balls in accordance with the present invention includes: ball carrying pallets having a plurality of pits for holding the micro-balls, respectively, on its surface, a pallet holder for holding the ball carrying pallets, a ... | 07/23/2002 |
| 6325271 | Continuous mode solder jet apparatus A solder jet apparatus is disclosed. The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems allows for a continuous stream of solder to be placed any... | 12/04/2001 |
| 6276589 | Jet soldering system and method An apparatus for depositing a selected pattern of solder onto a substrate comprising a substrate support, a solder ejector, and an orifice defining structure. The substrate support has structure for bearing a substrate on which one or more electronic comp... | 08/21/2001 |
| 6269999 | Semiconductor chip mounting method utilizing ultrasonic vibrations A semiconductor chip mounting method to prevent the occurrence of particles created while mounting the semiconductor chip onto a substrate using ultrasonic thermocompression bonding. The mounting method of the present invention utilizing ultrasonic vibrat... | 08/07/2001 |
| 6264090 | High speed jet soldering system Depositing a selected pattern of solder droplets onto a substrate on which one or more electronic components are to be mounted, the substrate being mounted on a substrate support and moved relative to a solder ejector along a scan axis, the droplets being... | 07/24/2001 |
| 6123248 | Soldering method and soldering apparatus Disclosed is a method and an apparatus for soldering a base material. A binary solder essentially consisting of tin and a metal which can form an eutectic alloy with tin and which is exclusive of lead is prepared. The content of other metallic components ... | 09/26/2000 |
| 6082605 | Continuous mode solder jet apparatus A solder jet apparatus is disclosed. The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems allows for a continuous stream of solder to be placed any... | 07/04/2000 |
| 6073832 | Soldering method and apparatus Method and apparatus, by which the relative displacement between molten solder and a terminal pin is caused and further, a coating formed on an end portion of a coil is removed by molten solder and thus the terminal portion is firmly soldered to the termi... | 06/13/2000 |
| 6070779 | Liquid dosing device A liquid dosing device, comprising an open-ended vitreous capillary tube which is connected to a reservoir for liquid, heating means for heating the liquid in the reservoir to a given temperature T1, and a ceramic actuator element which is in i... | 06/06/2000 |
| 6047876 | Process of using an active solder alloy A process for joining workpieces by active soldering. The process includes cleaning the surfaces of the workpieces to be joined; heating the workpieces to be joined; placing an active, low-temperature solder material on at least one of the surfaces of the... | 04/11/2000 |
| 5988480 | Continuous mode solder jet apparatus A solder jet apparatus is disclosed The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems allows for a continuous stream of solder to be placed anyw... | 11/23/1999 |
| 5938102 | High speed jet soldering system Depositing a selected pattern of solder droplets onto a substrate on which one or more electronic components are to be mounted, the substrate being mounted on a substrate support and moved relative to a solder ejector along a scan axis, the droplets being... | 08/17/1999 |
| 5894985 | Jet soldering system and method An apparatus for depositing a selected pattern of solder onto a substrate on which electronic components are to be mounted. The apparatus includes a substrate support, a replaceable solder cartridge, and a solder ejector. The replaceable solder cartridge ... | 04/20/1999 |
| 5894980 | Jet soldering system and method An apparatus for depositing a selected pattern of solder onto a substrate comprising: a substrate support having structure for bearing a substrate on which one or more electronic components are to be mounted; a solder ejector that defines a cavity for con... | 04/20/1999 |
| 5884833 | Ultrasonic vibration soldering apparatus and resonator used therein A support portion for attaching a horn main body to a solder tank is provided on the horn main body at a nodal point f2 and ultrasonic vibration from an external transducer is transmitted to solder in the solder tank through the horn main body.... | 03/23/1999 |
| 5851344 | Ultrasonic wave assisted contact hole filling A method of eliminating or substantially eliminating voids formed in the bottom of high aspect ratio holes following the physical vapor deposition of a material over the surface of a substrate. The method includes placing the substrate in an ultrasonic pr... | 12/22/1998 |
| 5762257 | Device for flux-free soldering The present invention pertains to a device for the flux-free soldering of printed circuit boards guided over the soldering wave of a wave soldering nozzle, wherein the solder is vibrated by means of at least one ultrasonic electrode (sonotrode), the surfa... | 06/09/1998 |
| 5409155 | Vibrational self aligning parts in a solder reflow process A method and apparatus for soldering areas of two parts together such as solder leads of an electronic component to the solder pads on a printed circuit board which includes the step of raising the temperature of the abutting areas to a value greater than... | 04/25/1995 |
| 5322205 | Joining method of aluminum member to dissimilar metal member A joining method of an aluminum member to a dissimilar metal member excluding copper by brazing or soldering through the use of a brazing filler metal or a solder for aluminum member; in which a plating composed of a metal voluntarily selected from copper... | 06/21/1994 |
| 5229016 | Method and apparatus for dispensing spherical-shaped quantities of liquid solder A method and apparatus for producing solidified solder balls and for ejecting generally spherical-shaped drops of liquid solder through a controlled atmosphere to impact on a surface to be wetted is disclosed. The apparatus comprises a preload reservoir t... | 07/20/1993 |
| 5121874 | Shield gas wave soldering A wave soldering apparatus and process occurs in an atomsphere which substantially excludes oxygen. By providing a gas blanket over the solder, reduction in dross occurs and improved soldering results avoiding the necessity of removing flux residues. Gas ... | 06/16/1992 |
