Did You Know...
...that several people are credited with the invention of the flush toilet? Most people have heard of Thomas Crapper (1837-1910), the sanitary engineer who invented the valve-and-siphon arrangement that made the modern toilet possible. Another claimant to "the throne" was British inventor Alexander Cumming who patented a toilet in 1775. Then there's a nameless Minoan (a native of ancient Crete) who lived 4,000 years ago who supposedly was ahead of his time and created the first flush toilet!
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| Number | Title | Issue Date |
| 7631798 | Method for enhancing the solderability of a surface A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with a silver plate prior to soldering, which immersion silver plate is treated with an additive comprising a mercapto substituted or thio substituted si... | 12/15/2009 |
| 7261784 | Method of making a coating on a metal substrate and/or an article, such a coating, such a metal substrate and/or an article, and a cam forming such an article The method of the invention enables a coating to be made on at least one face to be protected of a metal substrate and/or article in order to improve its performance in terms of resistance to wear by friction, in particular at high temperature. The method comprises ... | 08/28/2007 |
| 7032808 | Thermal spray application of brazing material for manufacture of heat transfer devices The invention relates to a method of manufacturing and coating heat transfer parts for a heat exchanger such as tubes in an automobile radiator. The tubes are coated with brazing material by thermal spraying, such as plasma deposition or wire-arc deposition. The coa... | 04/25/2006 |
| 7018721 | Structure for interconnecting conductors and connecting method A first conductor having an Au layer formed on the surface is connected with a second conductor at least the surface of which has conductivity through a solder containing Zn. The first conductor is, for example, a terminal pad (11a, 11b, ... | 03/28/2006 |
| 6997371 | Thermal spray application of brazing material for manufacture of heat transfer devices The invention relates to a method of manufacturing and coating heat transfer parts for a heat exchanger such as tubes in an automobile radiator. The tubes are coated with brazing material by thermal spraying, such as plasma deposition or wire-arc deposition. The coa... | 02/14/2006 |
| 6921583 | Al-Cu bonded structure and method for making the same With an Al—Cu bonded structure, an Ag layer can be remained at the Al—Cu bonding interlayer providing ductile deformation behavior and a tensile strength at the bonded interlayer similar to that of the Al base material. This results in superior bonding character... | 07/26/2005 |
| 6863995 | Method for brazing components using a Ni-Au-P ternary brazing alloy, the assembly so produced and the ternary alloy A method for using a novel ternary nickel-gold-phosphorus brazing alloy for joining nickel-based components together and the assembly so formed. ... | 03/08/2005 |
| 6814276 | Process for soldering and connecting structure A barrier metal layer is provided on at least one electrodes, wherein one electrode is formed on a substrate and another is connected to an electronic component, so as to coat a base material of the electrode. The base material is made of a material containing Cu. S... | 11/09/2004 |
| 6773956 | Method for contact-connecting a semiconductor component A solder metal made of a eutectic or stoichiometric composition including at least two metallic or semiconducting elements is applied to a contact (of the semiconductor component, brought into contact with the metal layer of a metallized film and alloyed by heating ... | 08/10/2004 |
| 6761306 | Phosphorus-copper brazing material, brazing sheet, methods of manufacturing the material and the sheet, and flow path structure for heat exchangers A phosphorus-copper brazing material formed of a phosphorus-copper brazing alloy which can easily be cold-worked into a thin sheet, a brazing sheet having a brazing layer of the phosphorus-copper brazing alloy, and a flow path structure for heat exchangers construct... | 07/13/2004 |
| 6725517 | Method for plugging a hole and a cooling element manufactured by said method A method for plugging a hole, particularly a hole provided in a cooling element, in which method a hole formed in a piece essentially made of mainly copper, for instance in the housing element of a cooling element, there is arranged a plug mainly made of copper. Bet... | 04/27/2004 |
| 6596131 | Carbon fiber and copper support for physical vapor deposition target assembly and method of forming The invention includes a method of forming an assembly of a physical vapor deposition target and support. A physical vapor deposition target is provided. The physical vapor deposition target has a coefficient of thermal expansion of less than 10×10-... | 07/22/2003 |
| 6416883 | Lead-free solder A lead-free solder composition comprising: 20 to 30 wt. % bismuth, 1.0 to 3.0 wt. % silver, 0.01 to 2.0 wt. % copper, 0.01 to 4.0 wt. % antimony and incidental impurities, the balance being tin.... | 07/09/2002 |
| 6415182 | Hermetic ground pin assembly and method of making A hermetic ground pin assembly for making an electrical connection between a hermetically sealed enclosure and an external circuit. A case has an aperture and a plug located within the aperture. A low temperature braze alloy is located between the plug an... | 07/02/2002 |
| 6223976 | Process for the assembly or refacing of titanium aluminide articles by diffusion brazing A process for assembling titanium aluminide articles by diffusion brazing comprises the following steps: (a) Preparation of a homogenous mixture of a titanium aluminide powder A of 40 to 90 weight % and a powder B chemically wetting A and having an apprec... | 05/01/2001 |
| 6164517 | Seamless, ring-shaped brazing material and method for producing same The seamless, ring-shaped brazing material comprises a brazing metal and a flux uniformly dispersed in the brazing metal for brazing nonferrous metal members and has a relative density of 0.90 or more. The seamless, ring-shaped brazing material is produce... | 12/26/2000 |
| 6116495 | Circuit-board overlaid with a copper material on both sides or in multiple layers and a method of fabricating same A circuit-board overlaid with a copper material on both sides with a lead-tin layer on the copper material and a plate-shaped heat sink (6). To achieve desirable dissipation of heat generated by electronic components on such circuit-board, the heat sink (... | 09/12/2000 |
| 5960251 | Organic-metallic composite coating for copper surface protection Copper-containing surfaces of substrates such as laminated electronic circuit boards are protected by organometallic coatings comprising organic compounds selected from the group consisting of benzimidazoles, alkylimidazoles, benzotriazozles and alkyltria... | 09/28/1999 |
| 5955686 | Brazing materials for producing metal-ceramics composite substrates A brazing material having 0.25-0.9 wt % of titanium oxide added to a basic formula consisting of 60-94.25 wt % Ag, 5-30 wt % Cu and 0.5-4.5 wt % of an active metal is processed to form a paste, which is applied to an AlN substrate and overlaid with a copp... | 09/21/1999 |
| 5881635 | Enamelled cookware and method of manufacturing it The enamelled cookware has a deep drawn shell of steel plate, placed beneath the base of which is a copper sheet. The latter is covered with a base plate comprising steel plate. The copper sheet is alloyed with the adjacent steel plates by high temperatur... | 03/16/1999 |
| 5794327 | Method for making copper electrical connections A method for making electrical connections between a lead and a conductor on a substrate, the method including the steps of disposing a copper conductor on a ceramic substrate; positioning a lead in contact with the conductor; applying a copper film to th... | 08/18/1998 |
| 5429794 | Alloys for brazing Alloys for brazing used in heat exchangers, particularly in radiators. The alloys contain 14-31% by weight zinc, 0.1-15% by weight iron, 0.001-0.05% by weight phosphorus and 0-0.09% by weight arsenic, the balance being copper and incidental impurities.... | 07/04/1995 |
| 5417363 | Process for bonding contacts to a contact base by hard soldering and semifinished product which can be obtained by this process Particularly in the case of contacts consisting of a silver-metal oxide-(AgMeO)-based material which are provided on their the back side with solder, it is noted, upon hard soldering, on a contact base that solder can ascend in undesired manner up to the ... | 05/23/1995 |
| 5416971 | Method of assembling a monolithic gallium arsenide phased array using integrated gold post interconnects A monolithic gallium arsenide (GaAs) phased array using integrated gold (Au) posts for interconnecting multiple substrate layers. The phased array includes a GaAs substrate having transmit/receive modules fabricated on one side and radiating elements etch... | 05/23/1995 |
| 5407121 | Fluxless soldering of copper A method of soldering a copper layer without the use of fluxing agents by exposing the copper layer to a fluorine-containing plasma. Solder is then placed onto the surface of the copper layer and reflowed. Reflow can take place at low temperatures, atmosp... | 04/18/1995 |
| 5385791 | Gold-nickel-vanadium-molybdenum brazing materials A ductile brazing material containing, by weight, 75-98% gold, 0.5-20% nickel, 0.5-6% vanadium, 0.25-5.9% molybdenum and, optionally chromium is disclosed for directly bonding ceramic/ceramic, ceramic/metal or metal/metal systems over an optimum temperatu... | 01/31/1995 |
| 5320272 | Tin-bismuth solder connection having improved high temperature properties, and process for forming same In an electronic package, a solder connection for bonding faying surfaces is formed of tin-bismuth alloy comprising a tertiary metal, preferably gold or silver, in an amount effective to increase the melting temperature of the alloy and enhance mechanical... | 06/14/1994 |
| 5316205 | Method for forming gold bump connection using tin-bismuth solder A gold bump contact on an electronic component is solder bonded to a bond pad of a printed circuit board or the like utilizing a solder composed of tin-bismuth alloy. The solder is applied to the bond pad as an electroplate or a paste, after which the gol... | 05/31/1994 |
| 5314109 | Brazing alloy and method of brazing A method of joining orthodontic appliances or dental appliances by brazing with an alloy material containing at least about 50% by weight silver and at least about 20% by weight gold.... | 05/24/1994 |
| 5262347 | Palladium welding of a semiconductor body A method of bonding together two dissimilar planar bodies, one of which is a semiconductor. A film of palladium is deposited on one of the bodies. The two bodies are pressed together with moderate force with the palladium in between. The palladium chemica... | 11/16/1993 |
| 5256097 | Process for producing a directly heated cathode A process providing a cathode coil made of tungsten and fastening it to molybdenum straps by brazing with platinum by supplying thermal energy in a punctiform manner.... | 10/26/1993 |
| 5240172 | Solder alloy for dental and jewelry parts White solder alloys for dental and jewelry parts, with working temperatures around 1000° C., contain 38 to 70% by weight gold, 6 to 20% by weight palladium, 8 to 40% by weight silver, 1 to 6% by weight iron and/or cobalt, 0 to 10% by weight copper, 0-5% ... | 08/31/1993 |
| 5130090 | Copper alloys to be used as brazing filler metals The invention relates to low-nickel copper alloys to be used as brazing filler metals, which alloys also contain phosphor, tin and possibly small amounts of manganese. The alloys are produced by means of rapid solidification. Their advantages are low liqu... | 07/14/1992 |
| 5102621 | Ternary brazing alloy for carbon or graphite A ternary brazing alloy for carbon or graphite consisting essentially of 0.5-10 wt % titanium, 10 to 50 wt % tin, balance copper.... | 04/07/1992 |
| 5048744 | Palladium enhanced fluxless soldering and bonding of semiconductor device contacts The fluxless bonding in a reducing atmosphere of integrated circuit contacts containing copper is enhanced using a layer of 200 to 1500 Angstrom thick palladium which inhibits copper oxide formation before fusion and reduces all oxides to promote wetting ... | 09/17/1991 |
| 5043229 | Brazed ceramic-metal composite A composite consists of a ceramic brazed to another ceramic by means of a joint layer therebetween. The joint layer comprises a porous metal interlayer and an active brazing filler metal penetrating through the porous metal interlayer.... | 08/27/1991 |
| 5011658 | Copper doped low melt solder for component assembly and rework Low melting temperature copper-containing solders are disclosed for soldering and rework on copper surfaces. The amount of copper required in the solder in order to inhibit dissolution of the copper surface to be soldered has been found to be dopant level... | 04/30/1991 |
| 4978051 | X-ray tube target A composite target for an x-ray tube has a graphite substrate portion and a metal portion, the two portions being bonded together by a platinum braze. A tantalum wetting agent layer on the graphite acts to improve the bond by causing the platinum to bette... | 12/18/1990 |
| 4879096 | Lead- and antimony-free solder composition Lead-free and antimony-free solder compositions are described which comprise, as essential ingredients, about 0.05% to about 3% by weight of silver; about 0.5% to about 6% by weight of copper; about 0.1% to about 3% by weight of bismuth; and about 88% to ... | 11/07/1989 |
| 4854495 | Sealing structure, method of soldering and process for preparing sealing structure This invention discloses a method of soldering together at least two members selected form metals and ceramics, which comprises successively jointing a high-melting jointing material, a medium-melting jointing material, and a low-melting jointing material... | 08/08/1989 |
