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| Number | Title | Issue Date |
| 7694871 | Self-encapsulated silver alloys for interconnects Alloys of silver and an alloying element that diffuses to the surface of the high conductivity metal and is oxidizable to form an alloying element oxide such as beryllium are provided along with electronic structures employing the alloys and methods of fabrication. | 04/13/2010 |
| 7083759 | Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions A material for a semiconductor-mounting heat dissipation substrate comprises a copper-molybdenum rolled composite obtained by impregnating melted copper into a void between powder particles of a molybdenum powder compact to obtain a composite of molybdenum and coppe... | 08/01/2006 |
| 6997371 | Thermal spray application of brazing material for manufacture of heat transfer devices The invention relates to a method of manufacturing and coating heat transfer parts for a heat exchanger such as tubes in an automobile radiator. The tubes are coated with brazing material by thermal spraying, such as plasma deposition or wire-arc deposition. The coa... | 02/14/2006 |
| 6994920 | Fusion welding method and welded article A fusion welding method is provided for fusion welding at juxtaposed interface surfaces a first member, for example made of a first metal based on at least one of Ru, Rh, Pd, and Pt, with a second member made of a second metal, for example a high temperature alloy b... | 02/07/2006 |
| 6992397 | Electroless nickel immersion gold semiconductor flip chip package A flip chip package, apparatus and technique in which a ball grid array composed of a doped eutectic Pb/Sn solder composition is used. The dopant in the Pb/Sn solder forms a compound or complex with the phosphorous residue from the electroless nickel plating process... | 01/31/2006 |
| 6866730 | Metallic-based adhesion materials A material and method for adhering at least two materials that includes the step of interposing at least one intermediate layer between the two materials and associated adhesion material. The materials to be adhered exhibit at least one characteristic dissimilarity ... | 03/15/2005 |
| 6789723 | Welding process for Ti material and Cu material, and a backing plate for a sputtering target A welding process for welding a Cu material to a Ti material includes interposing a tertiary component between the Ti material and the Cu material. The tertiary component is of a type of metal that, with Cu, forms a compound which is liquified at a temperature below... | 09/14/2004 |
| 6773956 | Method for contact-connecting a semiconductor component A solder metal made of a eutectic or stoichiometric composition including at least two metallic or semiconducting elements is applied to a contact (of the semiconductor component, brought into contact with the metal layer of a metallized film and alloyed by heating ... | 08/10/2004 |
| 6761306 | Phosphorus-copper brazing material, brazing sheet, methods of manufacturing the material and the sheet, and flow path structure for heat exchangers A phosphorus-copper brazing material formed of a phosphorus-copper brazing alloy which can easily be cold-worked into a thin sheet, a brazing sheet having a brazing layer of the phosphorus-copper brazing alloy, and a flow path structure for heat exchangers construct... | 07/13/2004 |
| 6760396 | Coated metal articles and method of making The method of protectively coating metallic uranium which comprises dipping the metallic uranium in a molten alloy comprising about 20-75% of copper and about 80-25% of tin, dipping the coated uranium promptly into molten tin, withdrawing it from the molten tin and ... | 07/06/2004 |
| 6725517 | Method for plugging a hole and a cooling element manufactured by said method A method for plugging a hole, particularly a hole provided in a cooling element, in which method a hole formed in a piece essentially made of mainly copper, for instance in the housing element of a cooling element, there is arranged a plug mainly made of copper. Bet... | 04/27/2004 |
| 6342106 | Flux-free brazing paste The invention relates t a flux-free brazing paste for the brazing of copper and copper alloys. The paste includes a binder consisting of a mixture of polyisobutene with a relative molar mass from 50,000 to 500,000 and paraffin within a melting-range from ... | 01/29/2002 |
| 6307160 | High-strength solder interconnect for copper/electroless nickel/immersion gold metallization solder pad and method A high-strength solder interconnect formed on a copper/electroless nickel/immersion gold metallization solder pad and method. The invention provides a low cost, high-strength solder interconnect on a copper/electroless nickel/immersion gold metallization ... | 10/23/2001 |
| 6234378 | Solid liquid inter-diffusion bonding for ring laser gyroscopes A method for bonding a gyroscope component to a gyroscope body using the solid liquid Inter Diffusion (SLID) process. The resulting bond structure has a larger operating range than the bonding-materials used to create to bond. Mating material layers may b... | 05/22/2001 |
| 6206269 | Soldering of a semiconductor chip to a substrate The present invention relates to a method of soldering a semiconductor chip to a substrate, such as to a capsule in an RF-power transistor, for instance. The semiconductor chip is provided with an adhesion layer consisting of a first material composition.... | 03/27/2001 |
| 6089444 | Process of bonding copper and tungsten Process for bonding a copper substrate to a tungsten substrate by providing a thin metallic adhesion promoting film bonded to a tungsten substrate and a functionally graded material (FGM) interlayer bonding the thin metallic adhesion promoting film to the... | 07/18/2000 |
| 5988488 | Process of bonding copper and tungsten Process for bonding a copper substrate to a tungsten substrate by providing a thin metallic adhesion promoting film bonded to a tungsten substrate and a functionally graded material (FGM) interlayer bonding the thin metallic adhesion promoting film to the... | 11/23/1999 |
| 5948549 | Sinter joining method and sintered composite member produced by same A sinter-joining method for forming a sinter of high quality at low cost and a sintered composite member produced by the sinter-joining method. A tubular copper-base material is forced into a tubular iron-base material and these materials are sintered at tempe... | 09/07/1999 |
| 5836506 | Sputter target/backing plate assembly and method of making same This invention is directed to an improved method for making a bonded sputter target/backing plate assembly as well as assemblies produced therefrom. The assembly includes a sputter target having a bonding surface which is bonded to the bonding surface of ... | 11/17/1998 |
| 5803342 | Method of making high purity copper sputtering targets Described is a method of making high purity copper sputtering target. The method avoids melting and casting and involves stacking segments of high purity copper plates, and heating, forging and annealing to produce a diffusion bonded unitary structure.... | 09/08/1998 |
| 5538177 | Method for welding metallic alloy parts Metallic alloy parts which contain easily oxidizable metallic elements, are welded without solder by applying a non-deliquescent flux thereto at a negligible amount and subjecting them to a high temperature under an inert and non-explosive atmosphere.... | 07/23/1996 |
| 5531371 | Process of preparing clad contact material A process of preparing clad contact material comprises forming a contact belt-like member by bonding an Au or Au alloy tape to the surface of an Ag or Ag alloy tape, thermally treating that contact member for forming an Au diffusion layer, and cladding th... | 07/02/1996 |
| 5490627 | Direct bonding of copper composites to ceramics A ceramic member (52) is direct-bonded to a copper composite substrate (58) by heating to diffuse copper to the surface (56) of the copper composite substrate, oxidizing the surface of the copper composite substrate following heating, placing a ceramic me... | 02/13/1996 |
| 5385791 | Gold-nickel-vanadium-molybdenum brazing materials A ductile brazing material containing, by weight, 75-98% gold, 0.5-20% nickel, 0.5-6% vanadium, 0.25-5.9% molybdenum and, optionally chromium is disclosed for directly bonding ceramic/ceramic, ceramic/metal or metal/metal systems over an optimum temperatu... | 01/31/1995 |
| 5366135 | Method of making composite electrical contact A method for making a bimetallic or trimetallic electrical contact. Features that only its shank portion, made of copper or copper alloy, is covered by a thin layer of silver or silver alloy for protecting the shank portion from environmental erosion. Thi... | 11/22/1994 |
| 5361971 | Intermediate-temperature diffusion welding Two pieces (42, 46) are Joined together by providing a gold bonding layer (44) overlying a nickel layer (40) on a first piece (42) to be bonded and providing a gold bonding layer (50) on a second piece (46) to be bonded. The gold layer (50) on the second ... | 11/08/1994 |
| 5257733 | Process for thermodynamically treating a region joining two members and product thereof This invention relates to a composition of a region joining two members treated thermodynamically by a process set forth by the present invention. In accordance with one aspect of the present invention, there is provided a region comprising a solidified b... | 11/02/1993 |
| 5217158 | Process for thermodynamically treating a region joining two members This invention relates to a process for thermodynamically treating a region joining two members. In accordance with one aspect of the present invention, are the steps of heating the region to a first temperature generally within a range of 750° F. and 85... | 06/08/1993 |
| 5173340 | Method of coating a base of a gold alloy of at least 22 carat purity with a coating which is also of at least 22 carat purity A method of producing durable, structurally strong, investment quality gold articles of high troy weight, excellent color and revealing properties and the method of their production are described, including the formation of a structural base from an alloy... | 12/22/1992 |
| 4993622 | Semiconductor integrated circuit chip interconnections and methods The disclosure relates to an electrical connection between a bonding pad on a semiconductor chip and a wire wherein the bonding pad is formed of copper doped aluminum and the wire is formed of copper doped gold. The wire has from about 100 to about 10,000... | 02/19/1991 |
| 4946090 | Seals between ceramic articles or between ceramic articles and metal articles A seal between two ceramic articles, or between a ceramic article and a metal article, is formed by providing a sealing member comprising an aluminum body, and a film of zinc or tin being deposited threon, with the inevitable aluminum oxide surface film r... | 08/07/1990 |
| 4895290 | Method for bonding materials An ultrasonic transducer and its method of fabrication wherein bonding between an impedance matching layer on one side of a piezoelectric layer and a support layer on the other side of the piezoelectric material is made by providing onto each material a s... | 01/23/1990 |
| 4875617 | Gold-tin eutectic lead bonding method and structure A bonding structure of gold-tin (80:20) eutectic bonding of two gold layers on an integrated circuit chip and a substrate carrier, such as a tape in a tape automated bonding (TAB) process, is provided. A method provides gold-tin eutectic bumps on an integ... | 10/24/1989 |
| 4848643 | Process of bonding plates A process of bonding crystalline quartz plates in a plate assembly of a quartz crystal resonator is provided. The plate assembly includes a base plate, a resonator plate, a cover plate, a first silver and indium alloy layer between the base plate and the ... | 07/18/1989 |
| 4811893 | Method for bonding copper plate to alumina substrate and process for producing copper/alumina bonded assembly A novel method for directly bonding a copper plate to an alumina substrate is disclosed. Also disclosed is a process by which bonded assembles of copper plate and alumina substrate can be produced in large volumes on an industrial scale in high yield and ... | 03/14/1989 |
| 4810671 | Process for bonding die to substrate using a gold/silicon seed An improved method for eutectically bonding a silicon wafer onto a gold preform is described. A gold/silicon seed is placed on a pure gold preform. Then a die is placed onto the pure gold preform and the gold/silicon seed, wherein the seed acts as a catal... | 03/07/1989 |
| 4808246 | Composite material in rod, tube, strip, sheet or plate shape with reversible thermomechanical properties and process for its production A composite material in rod, tube, strip, sheet or plate shape with reversible thermomechanical properties is produced by joining of at least two parts consisting of a total of at least one shape memory alloy having a two-way effect, whereby each part has... | 02/28/1989 |
| 4581102 | Copper-base alloy cleaning solution The present invention relates to a cleaning solution for removing surface oxides from copper base alloys without significantly etching the copper-base alloy material. The cleaning solution comprises from about 1 v/o to about 50 v/o hydrofluoric acid and f... | 04/08/1986 |
| 4540462 | Substrate for semiconductor modules and method of manufacture A method for manufacturing a semiconductor substrate. A copper sheet is placed on a surface of a ceramic plate and bonded thereto. A circuit pattern is then formed on the copper sheet by an etching process.... | 09/10/1985 |
| 4523711 | Method for bonding silver-based contact The method of bonding silver-based contact is disclosed. A silver-based contact is brought into contact with a support, at least the surface of which is made of a cupreous material, with a pressure of less than 1 kgf/cm2 exerted therebetween. T... | 06/18/1985 |
