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| Number | Title | Issue Date |
| 7131200 | Method for making a radiating appliance A radiating appliance consisting of a plurality of heat-transfer tubes, radiators, and a heat-transfer plate is processed in a method including the following steps: position the heat-transfer tubes in grooves formed in a recess on one radiator; position the heat-tra... | 11/07/2006 |
| 7077867 | Prosthetic knee joint having at least one diamond articulation surface Prosthetic joints, components for prosthetic joints, superhard bearing and articulation surfaces, diamond bearing and articulation surfaces, substrate surface topographical features, materials for making joints, bearing and articulation surfaces, and methods for man... | 07/18/2006 |
| 6783867 | Member for semiconductor device using an aluminum nitride substrate material, and method of manufacturing the same A highly reliable member for a semiconductor device, in which a high melting point metallizing layer, which consists mainly of a high melting point metal such as W and/or Mo, and an intervening metal layer, which has a melting point of not greater than 1,000° C. an... | 08/31/2004 |
| 6635358 | Composite member comprising bonded different members and method for making the composite member A composite member includes a ceramic base and a metallic member which are bonded to each other. An active metal foil is disposed on the surface of the ceramic base and a solder material including Au or a solder material including an Au--Ag alloy is dispo... | 10/21/2003 |
| 5904993 | Joint body of aluminum and silicon nitride and method of preparing the same A joint body in which aluminum and silicon nitride are strongly joined with each other is provided at a low cost, thereby providing a lightweight part which is excellent in sliding property as a mechanical part of an internal combustion engine of an autom... | 05/18/1999 |
| 5857611 | Sputter target/backing plate assembly and method of making same A method of forming a sputter target/backing plate assembly comprises the steps of: providing a target fabricated from a first material having a coefficient of thermal expansion; providing a backing plate fabricated from a second material having a coeffic... | 01/12/1999 |
| 5624068 | Diamond tools for rock drilling, metal cutting and wear part applications The present invention relates to buttons, inserts and bodies for rock drilling, rock cutting, metal cutting and wear part applications. The buttons, inserts and bodies comprise cemented carbide provided with bodies and/or layers of CVD- or PVD-fabricated ... | 04/29/1997 |
| 5573173 | Vacuum tube comprising a ceramic element and a method of interconnecting a ceramic element and a conductive element Vacuum tube comprises a ceramic element and method of interconnecting a ceramic element and a conductive element. A conductive connection consisting of a first layer containing silver and a filler and a second layer containing silver, gold or copper is fo... | 11/12/1996 |
| 5562716 | Package and method of construction A package for use in implanted devices, particularly where power and/or data are supplied by an inductive link, is disclosed. A ceramic envelope is bonded to a platinum or similar flange, so that the package may be sealed by simply welding the flange to a... | 10/08/1996 |
| 5513793 | Brazeless ceramic-to-metal bond for use in implantable devices In a method and apparatus for forming a hermetically sealed bond for use in implantable medical devices, a first structure, made from a first material, is positioned against a second structure, made from a second material. A compressive force directed at ... | 05/07/1996 |
| 5358929 | Method of joining superconducting wire using oxide high-temperature superconductor Disclosed herein is a method which enables permanent current junction of a tape-type oxide superconducting wire and suppresses reduction of its critical current. An end portion of a tape-type wire (10) to be joined is removed to expose oxide superconducto... | 10/25/1994 |
| 5334344 | Ternary active brazing based on a zirconium-nickel alloy This active brazing preferably serves to braze (join) ((aluminum-)oxide-)ceramic parts or single crystals or metal parts or to braze (join) ((aluminum-)oxide-)ceramic parts to single crystals or ((aluminum-)oxide-)ceramic parts or single crystals to metal... | 08/02/1994 |
| 5141148 | Method of anodic bonding a semiconductor wafer to an insulator An anodic bonding method in which a semiconductor wafer and an inorganic insulating material are bonded together includes the steps of forming a first metallic thin film having a strong contact with the inorganic insulating material on one surface of the ... | 08/25/1992 |
| 5102747 | High temperature-resistant composite The invention relates to a high temperature-resistant composite which consists of at least one part of molybdenum or a molybdenum alloy, and at least one part of graphite, which parts are joined together by means of a zirconium solder. A two-ply interlaye... | 04/07/1992 |
| 5037778 | Die attach using gold ribbon with gold/silicon eutectic alloy cladding An improved method for eutectically bonding a silicon wafer into a cavity of a packaging body. A gold/silicon eutectic alloy cladding is formed on a ribbon made of gold. A strip is cut from the ribbon and placed into the package cavity with the cladding s... | 08/06/1991 |
| 4978054 | Diffusion bonding process for aluminum and aluminum alloys A method of forming diffusion bonds between aluminum and aluminum alloy saces by coating the surfaces with molten AgNO3 and then decomposing the AgNO3 to form a thin uniform layer of silver on the surfaces before forming the diffusi... | 12/18/1990 |
| 4940180 | Thermally stable diamond abrasive compact body A method of producing a thermally stable diamond compact having a metal layer bonded to a surface thereof is provided. The thermally stable diamond compact comprises a mass of diamond particles containing diamond-to-diamond bonding and a second phase unif... | 07/10/1990 |
| 4939101 | Method of making direct bonded wafers having a void free interface Wafers which are direct bonded to each other in accordance with prior art processes suffer from voids at their bonded interface. Annealing such composite structures at high temperature and high pressure (for silicon wafers preferably about 1,100° C. and ... | 07/03/1990 |
| 4903886 | Method and apparatus for fastening semiconductor components to substrates A method and apparatus for fastening semiconductor components, such as power semiconductors, onto substrates is a diffusion welding method wherein the surfaces to be joined are provided with precious metal contact layers and are pressed together with at l... | 02/27/1990 |
| 4903885 | Method and apparatus for fastening electronic components to substrates A pressure sintering method and apparatus provides that surfaces to be joined are pressed together with a pressure of at least 900 N/cm2 at a sintering temperature upon the interposition of a metal powder paste which serves to fasten electronic... | 02/27/1990 |
| 4837928 | Method of producing a jumper chip for semiconductor devices In the manufacture of semiconductor device packages, a jumper chip, comprising a substrate and a gold alloy attached thereto, with improved bonding characteristics is provided. By applying a coating of gold on both sides of the gold alloy prior to attachi... | 06/13/1989 |
| 4749118 | Method for bonding ceramic to metal When a ceramic is bonded to a metal having a low thermal expansion, if a Cr layer of a Cr diffusion layer is formed on the surface of the metal and the ceramic is bonded to the metal through this Cr layer or Cr diffusion layer by an Al insert, a bonded st... | 06/07/1988 |
| 4700882 | Composite rotary anode for X-ray tube and process for preparing the composite A method for the diffusion bonding of a graphite member to a metallic surface as part of a composite rotary anode for an X-ray tube is set forth. In the completed structure a compound laminate separating and metallurgically bonded to the graphite member a... | 10/20/1987 |
| 4693409 | Method for directly bonding ceramic and metal members and laminated body of the same A laminated body comprising a ceramic member and a metal member, and a method of forming the laminated body are described. The laminated body is characterized in that the ceramic member contains in its surface portion a bonding agent and the metal member ... | 09/15/1987 |
| 4689276 | Diamond bonded electronic circuit Diamonds are good thermal conductors and also good insulators. They are thus exceptionally useful as heat-removing supports for small microwave circuit elements which must be electrically insulated from their ultimate heat sink. Bonding diamonds to metall... | 08/25/1987 |
| 4685607 | Nitride ceramic-metal complex material and method of producing the same A method of forming a nitride ceramic-metal complex material without using a special bonding material. This method comprises bringing a metallic material into contact with the surface of a nitride ceramic material, heating under vacuum the nitride ceramic... | 08/11/1987 |
| 4645121 | Composite rotary anode for X-ray tube and process for preparing the composite A method for the diffusion bonding of a graphite member to a metallic surface of molybdenum, molybdenum alloy, tungsten or tungsten alloy as part of a composite rotary anode for an X-ray tube is set forth. In the completed structure a crack-free compound ... | 02/24/1987 |
| 4636828 | Optical immersed type photovoltaic detector The invention relates to an immersed type photovoltaic detector comprising a substrate transparent to infrared radiations and a wafer in semiconducting material. A PN junction is formed in the wafer, on the side opposite the substrate, with a zone of cond... | 01/13/1987 |
| 4611745 | Method for preparing highly heat-conductive substrate and copper wiring sheet usable in the same A method for preparing a highly heat conductive substrate which comprises interposing an active layer with a thickness of 0.5 to 10 μm comprising silver (Ag) and an active metal selected from the group consisting of titanium, zirconium and hafnium, and a... | 09/16/1986 |
| 4582240 | Method for low temperature, low pressure metallic diffusion bonding of piezoelectric components A method for intermetallic diffusion bonding of piezoelectric components, wherein ceramic pieces with fired-on silver electrodes are stacked with a thin shim of solid indium alloy therebetween. The indium alloy preferably comprises 25% indium, 37.5% lead ... | 04/15/1986 |
| 4526624 | Enhanced adhesion of films to semiconductors or metals by high energy bombardment Films (12) of a metal such as gold or other non-insulator materials are firmly bonded to other non-insulators such as semiconductor substrates (10), suitably silicon or gallium arsenide by irradiating the interface with high energy ions. The process resul... | 07/02/1985 |
| 4459264 | Reactive metal-palladium-silver brazing alloys Reactive metal-palladium-silver are suitable for brazing ceramics, other non-metallic and metallic materials.... | 07/10/1984 |
| 4010884 | Method of fabricating a filament-reinforced composite article A filament-reinforced composite article is fabricated from monolayer boron fiber tapes and laminates of titanium. The tapes which have the boron fibers attached to an aluminum foil are positioned in a multi-ply layup with interleaved titanium laminates in... | 03/08/1977 |
