Quotables
"To place a man in a multi-stage rocket and project him into the controlling gravitational field of the moon where the passengers can make scientific observations, perhaps land alive, and then return to earth--all that constitutes a wild dream worthy of Jules Verne. I am bold enough to say that such a man-made voyage will never occur regardless of all future advances."
Lee deForest, American radio pioneer ; 1957
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| Number | Title | Issue Date |
| 7918383 | Methods for placing substrates in contact with molten solder Methods and devices for placing a semiconductor wafer or other substrate in contact with solder are described. A wave soldering apparatus includes a solder bath, a nozzle for producing a solder wave, and a jig for orienting a substrate in a substantially vertical or... | 04/05/2011 |
| 7861915 | Soldering process A process by which molten solder is purified in-situ, making the soldering process more efficient and yielding better results, particularly for lead-free soldering. Lead-free solder becomes practical for use since the temperature for reliable soldering is reduced. A... | 01/04/2011 |
| 7815096 | Laminar flow well It has been observed that turbulent solder flow, particularly at the opening of a conventional flow well, correlates to a greater degree of Cu dissolution of the PTH barrels of a PCB, especially those that are aligned with the opening. A more laminar solder flow is ... | 10/19/2010 |
| 7810705 | Apparatus and method for supplying electrically conductive material In a conductive material supply apparatus that can connect a small slider electrode and a wiring electrode on a flexure in a miniaturized magnetic head, electrically conductive material is supplied, with the aid of flow of nitrogen gas that is pressurized to a first... | 10/12/2010 |
| 7637415 | Methods and apparatus for assembling a printed circuit board A method for manufacturing a printed circuit board includes providing a board including a plurality of electrical traces, a first surface, and a second surface opposite the first surface. The method further includes providing at least one surface mount component hav... | 12/29/2009 |
| 7419084 | Mounting method for surface-mount components on a printed circuit board A method for surface mount solder of a comparatively large component is provided wherein a first intermediate component is soldered to a printed wring board and a larger second component is positioned and soldered to the printed wiring board using the intermediate c... | 09/02/2008 |
| 7410093 | Solder wave process for solder shunts for printed circuit board A method of making a printed circuit board having zero resistance connections. Pairs of shunt pads are formed on the board, spaced sufficiently far apart to avoid short circuiting but sufficiently close to permit a solder bridge to occur between them during a solder... | 08/12/2008 |
| 7372056 | LPP EUV plasma source material target delivery system An EUV light generation system and method is disclosed that may comprise a droplet generator producing plasma source material target droplets traveling toward the vicinity of a plasma source material target irradiation site; a drive laser; a drive laser focusing opt... | 05/13/2008 |
| 7360679 | Method for the production of a soldered connection A method for the production of a soldered joint between at least two contact partners (22, 23) of a bonding arrangement (21), with a formed piece of solder material (27) being arranged at a distance to the bonding arrangement. The formed piece o... | 04/22/2008 |
| 7311241 | Method of mounting terminal on printed board, terminal mounted printed board and electric connection box accommodating the terminal mounted printed board, which are formed by the method A printed board is arranged above solder blowing nozzles of a spot flow soldering apparatus with first terminal groups facing upward, second terminal groups projected toward the solder blowing nozzles are shielded by shield jigs, solder jetted from the solder blowin... | 12/25/2007 |
| 7291912 | Circuit board The present invention provides a circuit board which prevents an adverse effect to be caused on electronic components by flux or the like that is produced at the time of soldering. According to this invention, land patterns 6 and 7 for connecting a fla... | 11/06/2007 |
| 7193228 | EUV light source optical elements Apparatus and methods are disclosed for forming plasma generated EUV light source optical elements, e.g., reflectors comprising MLM stacks employing various binary layer materials and capping layer(s) including single and binary capping layers for utilization in pla... | 03/20/2007 |
| 7167375 | Populated printed wiring board and method of manufacture A populated printed wiring board (PWB) (100) and method of manufacturing the populated PWB are taught. The populated PWB is manufactured by fabricating a PWB (102, 402) with exposed copper pads (302), coating the copper pads with an organic sold... | 01/23/2007 |
| 7159752 | Continuous mode solder jet apparatus A solder jet apparatus is disclosed. The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems allows for a continuous stream of solder to be placed anywhere on th... | 01/09/2007 |
| 7134592 | Method and protection apparatus for installation of a temperature-sensitive electronic component Temperature-sensitive electrical and electronic components which are connected to a board by soldering during the installation process are protected from the heat during the soldering process in order to prevent permanent damage to the components. The solder connect... | 11/14/2006 |
| 7124931 | Via heat sink material The invention provides thermally conductive material so that less heat traveling from one side of a layer will reach connection material on another side of a layer. Rather, some of the heat will be conducted away by the thermally conductive material and dissipated. | 10/24/2006 |
| 7122816 | Method and apparatus for EUV light source target material handling An EUV light source plasma source material handling system and method is disclosed which may comprise a droplet generator having a droplet generator plasma source material reservoir in fluid communication with a droplet formation capillary and maintained within a se... | 10/17/2006 |
| 7097806 | Rapid surface cooling of solder droplets by flash evaporation A mist of liquid coolant is introduced into the path of atomized, molten, solder droplets. The mist and other conditions within the chamber are engineered to enable the liquid coolant droplets in the mist to contract the surfaces of molten solder droplets and be fla... | 08/29/2006 |
| 7070088 | Method of semiconductor device assembly including fatigue-resistant ternary solder alloy Method for assembling a semiconductor device having fatigue-resistant interconnection fillet provides a semiconductor chip with at least one solder bump comprising an alloy of tin and lead with a melting temperature higher than the solder paste used. Further, a sold... | 07/04/2006 |
| 6974071 | Inclined solder wave methodology for wave soldering double sided pin-in-hole electronic components An apparatus for applying solder to an electronic circuit board substrate includes a solder wave device for generating a molten wave of solder and, above that, a movable substrate holder. The substrate holder includes a support for an electronic circuit board substr... | 12/13/2005 |
| 6948650 | Dross removal and solder reclamation improvements When dross is removed from a molten-solder reservoir, a substantial amount of molten solder is often removed with the dross. This molten solder can be separated from the dross and returned to reservoir via a conduit for reuse. Additionally, a skimmer for removing th... | 09/27/2005 |
| 6915941 | Method for local application of solder to preselected areas on a printed circuit board A method for locally applying solder to a set of preselected conductor areas on a printed circuit board without causing thermal damage to adjacent sensitive surface mounted devices and connectors. Before solder is applied, molten solder within a solder reservoir is ... | 07/12/2005 |
| 6913183 | Selective gas knife for wave soldering Selective gas knives for wave soldering provide for targeted gas flow at a particular location on a substrate, such as a printed circuit board. Both the temperature and flow rate of gas through a segment of a gas knife can be independently controlled. ... | 07/05/2005 |
| 6902102 | Soldering method and solder joint member In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated ... | 06/07/2005 |
| 6902097 | Electrically conductive wire A method of soldering comprises disposing first and second balls of solder adjacent one another on a wire; disposing flux on the wire between and in contact with both of the first and second balls and so as to substantially fill a space between the first and second ... | 06/07/2005 |
| 6851596 | Wave soldering apparatus A wave soldering apparatus includes a solder reservoir within which a pool of molten solder is held at a suitable temperature by heaters. Each heater has an electric heating element and a cover mounted to the solder reservoir to protect the heating element from the ... | 02/08/2005 |
| 6840432 | Solder application technique A method of joining an end face of a first electric component to an end face of a second electric component includes applying a first metal layer to the end face of the first electric component to form a first metallized layer and applying a second metal layer to th... | 01/11/2005 |
| 6817510 | Apparatus for increasing wave height of molten solder in solder bath The present invention discloses an apparatus applied to the wave former of the wave soldering system to increase the wave height of molten solder. The apparatus comprises a block board and a gland, wherein the block board is mounted on the enclosing walls of the wav... | 11/16/2004 |
| 6811073 | Method for connecting conductive members A method for connecting conductive members includes a step of providing a first conductive member, a step of providing a second conductive member, and a step of jetting droplets of molten metal so as to form a connecting portion which electrically connects the first... | 11/02/2004 |
| 6805282 | Flow soldering process and apparatus There is provided a flow soldering process for mounting an electronic component onto a board by a solder material, which process is appropriate for using a lead-free solder material as the solder material. In the flow soldering process, thermal efficiency of ... | 10/19/2004 |
| 6779710 | Mounting parts peel suppressing soldering method, electronic circuit baseboard, and electronic instrument A method for soldering parts mounted on a print circuit baseboard with Pb-free material. A reflow soldering process is performed to parts mounted on one side surface of the print circuit baseboard. A flow soldering process is then performed to parts mounted on the o... | 08/24/2004 |
| 6752310 | Electrically conductive wire The invention relates to an electrically conductive wire (1) comprising two spaced solder balls (2) thereon and flux (4) in the space (3) between the solder balls for making a circuit connection between electrically conductive members on ... | 06/22/2004 |
| 6742693 | Solder bath with rotatable nozzle A new solder bath apparatus applied to the soldering furnace is disclosed herein. The solder bath is used for containing molten solder. And a nozzle base is located in the solder bath to flow molten solder upwards. An enclosing frame with axial horizontal pillars mo... | 06/01/2004 |
| 6732903 | Adjustable nozzle of stannic furnace An adjustable nozzle of a stannic furnace comprises a nozzle tank which is mounted at the upper portion of a stannic tank of the stannic furnace, a front backflow stopper and a rear backflow stopper which are respectively mounted at the forward area and the backward... | 05/11/2004 |
| 6732907 | Soldering method, soldering device, and method and device of fabricating electronic circuit module A soldering method including: bonding a first electronic component having electrodes plated with a material containing lead to one surface of an interconnect substrate through solder containing no lead; and flow-soldering to bond a second electronic component to the... | 05/11/2004 |
| 6722554 | Soldering apparatus Soldering apparatus designed to apply soldering, by means of jetting out streams of molten solder, which is gathered in a solder bath, to a piece to be soldered carried in a predetermined direction. While jetting out molten solder from the solder bath, a drive means... | 04/20/2004 |
| 6708873 | Apparatus and method for filling high aspect ratio via holes in electronic substrates An apparatus and a method for filling high aspect ratio holes in electronic substrates that can be advantageously used for filling holes having aspect ratios larger than 5:1 are disclosed. In the apparatus, a filler plate and a vacuum plate are used in conjunction w... | 03/23/2004 |
| 6688511 | Wave solder apparatus and method A method of soldering a circuit board comprises moving a circuit board through various stations including a preheater station and a solder station.... | 02/10/2004 |
| 6676890 | Device for producing spherical balls Spherical balls, notably microballs of welding alloys, are produced by passing a melted material through vibrating orifices of a granulation pot, in order to form droplets which solidify when falling, by gravity, into a cooling tower filled with an inert ... | 01/13/2004 |
| 6655574 | Apparatus for selective soldering The invention relates to a soldering apparatus, including a vessel for containing and heating molten solder, transporting means for transporting objects for soldering to the vessel and removing said objects, at least one tube extending substantially verti... | 12/02/2003 |
