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| Number | Title | Issue Date |
| 8413877 | Layered structures with integral brazing materials A layered structure comprising a base structure having a major surface, and a brazing layer secured to the major surface of the base structure, where the brazing layer is applied to the major surface prior to positioning the layered structure in contact with a turbi... | 04/09/2013 |
| 8152048 | Method and structure for adapting solder column to warped substrate A multiple substrate system, a method, and structure for adapting solder volume to a warped module. An illustrative embodiment comprises a method for joining a first substrate to a second substrate. A deviation from a nominal gap between the first substrate and the ... | 04/10/2012 |
| 8038050 | Solder ball printing apparatus The present invention provides a solder ball printing apparatus in which solder balls are uniformly dispersed on a mask surface and are loaded into an opening area of the mask. A solder ball shaking and discharging unit includes a solder ball reception unit which re... | 10/18/2011 |
| 7926699 | Method and device for transferring a solder deposit configuration Method and device for transferring a solder deposit configuration having multiple solder deposits onto a terminal surface configuration of a contact surface of a substrate (36) using a removal of multiple solder deposits from a solder deposit reservoir (25... | 04/19/2011 |
| 7896223 | Solder ball printing apparatus Solder bumps formed on an electrode portion of a semiconductor chip are recently miniaturized, and when printing by using solder balls, the solder balls are also miniaturized. Therefore, it is required to print solder balls for printing with accuracy. Instead... | 03/01/2011 |
| 7837087 | Method for applying braze end isolation layer for generator armature winding bar A method of forming a brazed joint between an armature bar and a hydraulic header clip including the steps of: locating ends of a plurality of hollow strands and a plurality of solid strands within a cavity in an end fitting such that free ends of said hollow strand... | 11/23/2010 |
| 7819304 | Solid brazed laminate structures An example method of manufacturing a solid brazed laminate structure includes stacking a first lamina on a second lamina with an interfacial spacing between them, aligning mating portions of the first lamina and the second lamina, and introducing a braze material at... | 10/26/2010 |
| 7748601 | Brazed articles, braze assemblies and methods therefor utilizing gold/copper/nickel brazing alloys A brazing assembly includes a tungsten/carbide/cobalt substrate (e.g., wear pad), a second substrate including titanium or titanium alloy (e.g., a midspan shroud of a fan or compressor blade) and a brazing material including gold, nickel, and copper present in respe... | 07/06/2010 |
| 7731079 | Cooling apparatus and method of fabrication thereof with a cold plate formed in situ on a surface to be cooled A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: obtaining a solder material; disposing the solder material on a surface to be cooled; and reflow... | 06/08/2010 |
| 7721939 | Sputter target and backing plate assembly A method for aligning the sputter target onto a backing plate having a peripheral arcuate-shaped flange on its bonding surface to provide an aligned and uniform solder bonded interface; and the sputter target/backing plate assembly so produced. ... | 05/25/2010 |
| 7651023 | Nickel-based braze alloy compositions and related processes and articles A nickel-based braze composition is described, containing nickel, palladium, and restricted amounts of boron and silicon. The composition can also contain tantalum, titanium, and zirconium, as well as aluminum, chromium, and cobalt. A method for joining two metal co... | 01/26/2010 |
| 7635079 | System for locating conductive sphere utilizing screen and hopper of solder balls System for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop throug... | 12/22/2009 |
| 7540403 | Controlled thermal expansion of welds to enhance toughness A method is provided for forming a metallic overlay having enhanced toughness. The metallic overlay may be a weld, a metallic coating, or similar application. The method includes applying a glass forming metallic alloy to a substrate while the alloy is in a molten o... | 06/02/2009 |
| 7461772 | Silver/aluminum/copper/titanium/nickel brazing alloys for brazing WC-Co to titanium alloys A brazing material including about 20 to about 60 percent by weight silver, about 1 to about 4 percent by weight aluminum, about 20 to about 65 percent by weight copper, about 3 to about 18 percent by weight titanium and about 1 to about 4 percent by weight nickel. | 12/09/2008 |
| 7434720 | Gold/nickel/copper/titanium brazing alloys for brazing WC-Co to titanium alloys A brazing material including about 20 to about 60 percent by weight gold, about 6 to about 16 percent by weight nickel, about 16 to about 60 percent by weight copper and about 6 to about 16 percent by weight titanium. ... | 10/14/2008 |
| 7431792 | Method and apparatus for placing conductive balls Improved placing method and apparatus are provided for placing conductive balls in a predetermined pattern onto one surface of a base unit. An arrangement member is provided to have one surface, another surface opposite to the one surface of the arrangement member a... | 10/07/2008 |
| 7431195 | Method for centering a sputter target onto a backing plate and the assembly thereof A method for aligning the sputter target onto a backing plate having a peripheral arcuate-shaped flange on its bonding surface to provide an aligned and uniform solder bonded interface; and the sputter target/backing plate assembly so produced. ... | 10/07/2008 |
| 7422141 | Microparticle loaded solder preform allowing bond site control of device spacing at micron, submicron, and nanostructure scale In one embodiment, a solder preform includes a solder matrix having microparticles secured with the solder matrix. The microparticles are constructed so as to be capable of arranging during a solder bonding process so as to provide a uniform separation between oppos... | 09/09/2008 |
| 7423232 | Method for resistance welding/brazing a tube to a member A method for welding/brazing a tube to a member. The tube has an axially-extending first portion and has a tube form which extends transversely from the first portion. A filler material is obtained. The tube, the member and the filler material are positioned such th... | 09/09/2008 |
| 7419083 | Method for metal ornamentation A method for metal ornamentation, particularly for making granulated metal ornaments, is used to arrange single and single line granulated arrangements or patterns and to set gemstones within a workpiece. The method places pre-formed spherical granules in seats defi... | 09/02/2008 |
| 7407083 | Bonded silicon, components and a method of fabricating the same A heat pipe housing assembly (22) includes a pair of silicon housing pieces (24, 26) and a bond joint (42) between the housings (24, 26), with the bond joint (42) preferably including a eutectic layer (43). ... | 08/05/2008 |
| 7392930 | Iron-based braze filler metal for high-temperature applications Brazing filler metal compositions have excellent wettability to nickel/cobalt/iron-based base metals and produce braze joints with high strength and heat/corrosion resistance. The iron-based braze filler metal includes chromium in amounts between about 20 to 35 perc... | 07/01/2008 |
| 7389903 | Device and method for soldering contacts on semiconductor chips A device for soldering contacts on semiconductor chips. A chip is held on a chip mount by a chuck and is heated from a side facing away from the wafer by means of a radiation source, so that a solder applied to a side facing the wafer is melted. A flushing device, h... | 06/24/2008 |
| 7387230 | Brazing filter metal sheet and method for production thereof In order to provide a brazing sheet having excellent workability, a powder of a brazing filler metal composition is obtained from a single type of powder or by mixing two or more powders to form the brazing filler metal composition. By powder roll compaction of the ... | 06/17/2008 |
| 7367486 | System and method for forming solder joints Disclosed herein are methods and devices for stimulating soldering of a substrate with a component during a reflow process. In an exemplified embodiment, the method involves placing a substrate/component combination into a reflow oven; directing the substrate/compon... | 05/06/2008 |
| 7360679 | Method for the production of a soldered connection A method for the production of a soldered joint between at least two contact partners (22, 23) of a bonding arrangement (21), with a formed piece of solder material (27) being arranged at a distance to the bonding arrangement. The formed piece o... | 04/22/2008 |
| 7361412 | Nanostructured soldered or brazed joints made with reactive multilayer foils Self-propagating formation reactions in nanostructured multilayer foils provide rapid bursts of heat at room temperature and therefore can act as local heat sources to melt solder or braze layers and join materials. This reactive joining method provides very localiz... | 04/22/2008 |
| 7357294 | Method for mounting a semiconductor package onto PCB A method for mounting a semiconductor package onto PCB includes a semiconductor package comprising a plurality of outer terminals exposed out of an encapsulant. A PCB having a surface with a plurality of contact pads is provided. Each contact pad has a first exposed... | 04/15/2008 |
| 7357414 | Closure for a gas supply system A seal for a gas supply system of metal, in particular for sealing an airbag conduit, wherein, during operation, the gas supply system has a gas-conducting cross-section and a wall of metal, wherein in the area which seals the cross-section of the gas supply system,... | 04/15/2008 |
| 7357291 | Solder metal, soldering flux and solder paste Solder metal consists essentially of 8.8 to 5.0 mass % of Zn, 0.05 to 0 mass % of Bi and the balance of Sn and unavoidable impurities. ... | 04/15/2008 |
| 7358176 | Screen printing method of forming conductive bumps A screen printing method of conductive material is applied to a wafer with a conductive surface thereon. A dielectric layer on the wafer exposes the conductive surface to a first opening. A mask formed on the dielectric layer has a plurality of second openings corre... | 04/15/2008 |
| 7357295 | Solder ball supplying method and supplying device After introducing a solder ball from a hopper into a receiving hole of a ball separator, the ball separator is slid between blocks, and the solder ball is sent out to a portion outside of the blocks. By suctioning the solder ball from within a projected region on a ... | 04/15/2008 |
| 7353979 | Method of fabricating substrate placing stage A method of fabricating a substrate placing stage includes the step of providing a plate-shaped ceramic base having a substrate placing surface on a side of the ceramic base. The method includes the step of providing a plate-shaped ceramic base formed of a composite... | 04/08/2008 |
| 7347354 | Metallic solder thermal interface material layer and application of the same A method of bonding a thermal interface layer to a heat dissipating member and the resulting device are described. The method may involve plating a bonding surface of the heat dissipating member, and bonding a metallic solder onto the plating under vacuum or inert c... | 03/25/2008 |
| 7344061 | Multi-functional solder and articles made therewith, such as microelectronic components Aspects of the invention provide solder compositions which include two different fluxing agents. One of the fluxing agents promotes melting of a metal of the solder at a first activation temperature and the other fluxing agent promotes melting of the metal at a seco... | 03/18/2008 |
| 7341176 | Method of tying two or more components together Method of tying two or more components together using a fastener. Each component is provided with a hole and the components are placed so that the holes overlap one another in order to receive the fastener in the holes. The fastener is placed in the holes and mechan... | 03/11/2008 |
| 7340828 | Method for producing metal/ceramic bonding circuit board There is provided a method for producing a metal/ceramic bonding circuit board, which can form a fine pattern even if a circuit forming metal plate is thick and which can shorten the time required to carry out etching, when a molten metal is caused to contact to a c... | 03/11/2008 |
| 7341175 | Bonding of light emitting diodes having shaped substrates Bonding of flip-chip mounted light emitting devices having an irregular configuration is provided. Light emitting diodes having a shaped substrate are bonded to a submount by applying forces to the substrate an a manner such that shear forces within the substrate do... | 03/11/2008 |
| 7331502 | Method of manufacturing electronic part and electronic part obtained by the method In a process for producing an electronic part which comprises soldering (A) an electronic member having conductor portions I for electric connection having a solder layer or a solder bump (a solder portion) on a surface of a tip and (B) an electronic member to be co... | 02/19/2008 |
| 7331503 | Solder printing process to reduce void formation in a microvia In one embodiment, a method is provided. The method comprises filling a microvia formed in a bond pad with solder paste comprising solder balls of the first size; and coating the bond pad with solder paste comprising solder balls of the second size, wherein the seco... | 02/19/2008 |
