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| Number | Title | Issue Date |
| 7370408 | Hold down device in a terminal applicator A terminal applicator (50) for attaching electrical terminals (52) to a wire includes a terminal hold down device (90) for limiting movement of the terminal during the crimping process. The hold down device (90) includes a hold down arm (... | 05/13/2008 |
| 7270258 | Method of fabrication of semiconductor integrated circuit device Productivity is to be improved in assembling a semiconductor integrated circuit device. A matrix substrate is provided and semiconductor chips are disposed on a first heating stage, and then the matrix substrate is disposed above the semiconductor chips on the first... | 09/18/2007 |
| 7241328 | Method for preparing ultra-fine, submicron grain titanium and titanium-alloy articles and articles prepared thereby A method for preparing ultra-fine, submicron grain titanium or titanium-alloy articles (78) used for joining or assembling of detail components. Coarse-grained titanium or titanium-alloy materials (52) are severely mechanically deformed using cryogenic... | 07/10/2007 |
| 7175919 | Multilayered metal laminate and process for producing the same An adhesive-free multilayered metal laminate having a given thickness which is obtained by bonding a metal sheet having a thin metal film on a surface thereof to a metal foil without using an adhesive; and a process for continuously producing the laminate. The proce... | 02/13/2007 |
| 7156285 | Compression bonding method and apparatus using light Provided are a method and apparatus for bonding an element, which has a transparency with respect to UV light, to a substrate. The method includes forming an aluminum layer on a surface of the substrate, disposing the element on the aluminum layer, and bonding the e... | 01/02/2007 |
| 7153590 | Composite copper foil and manufacturing method thereof A composite copper foil (10) comprises a carrier foil (12) formed by electrodeposition onto a cathode, the carrier foil (12) having a cathode side formed in contact with the cathode and an opposite electrolyte side. A very thin release layer ( | 12/26/2006 |
| 7148444 | Method and system for resistance seam welding of a foil and at least one foil support of a fuel cell system A method and a system for resistance seam welding of a foil and at least one foil support of a fuel cell system. During welding, the thin foil, together with the thicker foil support, is moved relative to the roller electrode while resting on a flat support element.... | 12/12/2006 |
| 7140530 | Method for joining axle components A method of joining two vehicle axle housing components made from the same or dissimilar materials includes providing a first axle housing component, and providing a second axle housing component, where one of the first and second axle housing components is a metall... | 11/28/2006 |
| 7141206 | Method of manufacturing closed section structure filled with foam and closed section structure manufactured by the same An aluminum plate (13) is first plastic-deformed (FIG. 3D) in such a way as to envelop a foaming-agent compact (14), which is not foamed yet. Then, terminals of the aluminum plate (13) are integrally seam-welded (FIG. 3E) to thereb... | 11/28/2006 |
| 7135141 | Method of manufacturing a sintered body A method of manufacturing a sintered body, in which a material powder composed of metallic powder or alloy powder, a getter material having a higher oxidation potential than that of the material powder, and a hydride, which constitutes a hydrogen source, are sealed ... | 11/14/2006 |
| 7098136 | Structure having flush circuit features and method of making Embedded flush circuitry features are provided by providing a carrier foil having an electrically conductive layer therein and coating the electrically conductive layer with a dielectric material. Circuitry features are formed in the dielectric material and conducti... | 08/29/2006 |
| 6837417 | Method of sealing a hollow cast member A method of sealing an opening in a cast member that employs a green seal cap formed from the consolidation of a mixture of powdered metal and a binder under sufficient pressure to impart enough strength to the cap to maintain its shape during the blade manufacturin... | 01/04/2005 |
| 6817511 | Method for joining axle components A method of joining two vehicle axle housing components made from the same or dissimilar materials includes providing a first axle housing component, and providing a second axle housing component made from a material which is same/dissimilar to the material used to ... | 11/16/2004 |
| 6704988 | Method of making a continuous laminate coil A method and an apparatus incorporating the method for making a long, continuous laminate. A plurality of layers of materials are simultaneously wound around a metal hub. Strips of refractory material, perforated metal, metal foil, metal mesh, and random fiber media... | 03/16/2004 |
| 6689482 | Method of manufacturing metal foil/ceramics joining material and metal foil laminated ceramic substrate A method of manufacturing a high-quality metal foil/ceramics joining material (19) and a metal foil laminated ceramic substrate (20) which can prevent a damage to a ceramic material and enhance the productivity of the metal foil/ceramics joining material ... | 02/10/2004 |
| 6616031 | Apparatus and method for bond force control An apparatus and method are disclosed for providing bond force in a die bonding operation. The apparatus comprises means such as a compression spring for generating a primary bond force, and additionally means such as a voice coil for generating a compens... | 09/09/2003 |
| 6557747 | Highly gas tight chamber and method of manufacturing same A method of manufacturing a hermetically sealed chamber, including preparing two aluminum or aluminum alloy material members which face each other, forming a first extending convex portion on a surface to be metal-bonded of one of the two aluminum or alum... | 05/06/2003 |
| 6450396 | Method for making weldless magnesium/aluminum bonded components A method of joining at least a portion of a first substrate with at least a portion of a second substrate. The first substrate includes at least 90 weight percent aluminum and a first set of additives wherein magnesium is the dominant constituent in the a... | 09/17/2002 |
| 6419149 | Method for producing wiring layer transfer composite A wiring layer transfer composite constituted by a laminate composed of a carrier layer, a barrier layer and a wiring-forming layer, the barrier layer being a continuous layer substantially free from defects, can be produced by (a) preparing a first Cu-ba... | 07/16/2002 |
| 6331214 | Monolithically bonded construct of rare-earth magnet and metal material and method for bonding same Its basic means is a monolithically bonded construct prepared by monolithically bonding together a rare-earth magnet 2 and a an alloy material that is a high melting point metal or a high specific-tenacity material through the solid phase diffusion bondin... | 12/18/2001 |
| 6168072 | Expansion agent assisted diffusion bonding The present invention provides a method of diffusion bonding a first article containing a thermally activated expansion agent to a second article. The first article and the second article are placed adjacent to each other at a bonding area. The first arti... | 01/02/2001 |
| 6102276 | Pressure welding apparatus and pressure welding method Electric wires of a double-sided solderless connector are pressure-welded. The method of the pressure-welding includes the steps of: locating a pressure welding blade and support blade on both sides of a double-sided solderless connector, in a face to fac... | 08/15/2000 |
| 6085965 | Pressure bonding and densification process for manufacturing low density core metal parts A novel method of forming low density core metal parts by pressure bonding face sheets to a porous foam metal core and simultaneously densifying the core is disclosed. In particular, low density core aluminum and aluminum alloy parts can be formed accordi... | 07/11/2000 |
| 6082611 | Method of making multi-ply bottom of clad metal cookware A method of making a multi-ply bottom of clad metal cookware is disclosed. In the method, both an aluminum plate and a stainless steel cladding plate, externally laid on a base bottom of the clad metal cookware held on a friction press, is pressed down us... | 07/04/2000 |
| 6027009 | Connection structure of wire and terminal, connecting method therefor and a terminal A soldering material (28) is joined to a surface (13a) of a terminal (13). The terminal (13) is incorporated in a groove (18) of a connector housing (11) so that a covered wire (19) is made into contact with the terminal (13). A cover (12) is mounted so a... | 02/22/2000 |
| 6019274 | Semiconductor device and mounting method therefor A reflow mounting method and a semiconductor device for efficient manufacture of TCPs superior in reliability by preventing the deformation of leads and ensuring a dependable contact between the bonding pads on a circuit board and the leads, wherein metal... | 02/01/2000 |
| 6015081 | Electrical connections using deforming compression A method for the electrical connection between electrical joints of electric circuit components includes disposing said electric circuit components so that said joints for the electrical connection are opposed to each other, and making the electrical conn... | 01/18/2000 |
| 6012627 | Composite section having a supporting base of light-weight metal and at least one metallically-joined, profiled strip and process for manufacturing a composite section A composite section features a base of light-weight metallic material as section component and at least one further profiled section component, in particular a profiled strip of another metallic material which is joined metallically as a surface layer to ... | 01/11/2000 |
| 5996879 | Pressure welding apparatus and pressure welding method Electric wires of a double-sided solderless connector are pressure-welded. The method of the pressure-welding includes the steps of: locating a pressure welding blade and support blade on both sides of a double-sided solderless connector, in a face to fac... | 12/07/1999 |
| 5985064 | Chip compression-bonding apparatus and method A chip compression-bonding apparatus includes a vertically-movable block which is vertically moved by a descending device, and has a load measurement device and a load applying device mounted thereon. A compression-bonding tool for holding a chip is provi... | 11/16/1999 |
| 5938103 | Method and apparatus for minimizing the distortion in cold pressure welding A method and apparatus are disclosed for minimizing the distortion in cold pressure welding and producing a spot lap weld with a controlled thickness. A distortion control device is utilized which includes a cavity of predetermined depth and area adequate... | 08/17/1999 |
| 5857611 | Sputter target/backing plate assembly and method of making same A method of forming a sputter target/backing plate assembly comprises the steps of: providing a target fabricated from a first material having a coefficient of thermal expansion; providing a backing plate fabricated from a second material having a coeffic... | 01/12/1999 |
| 5812925 | Low temperature bonding of materials A method for joining a first metal surface to a second metal surface that includes providing powder metal particles substantially all of which have hardnesses lower than the hardnesses of the first and second metal surfaces, at normal temperatures; locati... | 09/22/1998 |
| 5642851 | Method of producing a circular fibre-reinforced metal article, and apparatus for use in said method An apparatus for producing a circular metal article reinforced by fibres in selected parts of its cross-section is described in which a metal blank of the article is formed and provided with at least one annular groove opening in the axial direction, pref... | 07/01/1997 |
| 5632435 | Process for the production of a soldered joint Process for the production of a soldered joint. The invention pertains to a soldering process in which thin walled carbon parts are soldered, on a flat side, to silicon carbide parts, for the connection of mechanically and thermally highly stressed parts ... | 05/27/1997 |
| 5632434 | Pressure activated diaphragm bonder A device is available for bonding one component to another, particularly for bonding electronic components of integrated circuits, such as chips, to a substrate. The bonder device in one embodiment includes a bottom metal block having a machined opening w... | 05/27/1997 |
| 5588582 | Method for manufacturing a cooling drum for a continuous casting system A cooling drum can continuously cast a favorable band-shaped cast piece having little thermal deformation. The cooling drum comprises a three-layer structure including a rigid member, a cooling member metallurgically bonded to the outside of the rigid mem... | 12/31/1996 |
| 5529238 | Gold to gold substrate bonding system utilizing interferometric planarization feedback A bonding system with interferometric inspection for real time planarity feedback and control is used to bond two substrates at atmospheric pressure. The interferometric vision system includes a crt monitor display to display the relative planarity betwee... | 06/25/1996 |
| 5503532 | Diffusion bonded airfoil and method An airfoil includes preformed first and second sides joinable together at a bond line extending between first and second opposite edges thereof. The first side includes a first extension having a proximal end forming a first end of the bond line, an inter... | 04/02/1996 |
| 5470014 | Brazing of aluminum-beryllium alloy Ion vapor deposition of aluminum is used to coat aluminum-beryllium alloy parts prior to fluxless vacuum brazing.... | 11/28/1995 |
