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| Number | Title | Issue Date |
| 7748600 | Process and device for soldering in the vapor phase The invention provides a process for soldering in the vapor phase in which after the solder has melted onto the item to be soldered a vacuum is generated around the item to be soldered in the vapor phase. Also provided is a device for soldering in the vapor phase co... | 07/06/2010 |
| 7398912 | Different materials bonded member and production method thereof A different materials bonded member includes a ceramic base material and a metallic member which are bonded together through an Au solder material. The solder material is disposed on a bonding surface of the ceramic base through a given active metal layer or a given... | 07/15/2008 |
| 7380699 | Method and apparatus for vapour phase soldering The present invention concerns a method and an apparatus for performing soldering of items that are applied a soldering agent, where the soldering apparatus includes at least one soldering zone, where the soldering zone include means for generating vapor, the appara... | 06/03/2008 |
| 7168609 | Method and apparatus for removing known good die A method and structure is disclosed for detaching a chip from a substrate that delays the delivery of shear force to the chip until the connectors attaching the chip to the substrate are soft enough that the delivery of shear force will not damage the chip's connect... | 01/30/2007 |
| 6863211 | Omega-hydrofluoroalkyl ethers, precursor carboxylic acids and derivatives thereof, and their preparation and application Normally liquid, omega-hydrofluoroalkyl ether compounds (and selected mixtures thereof) have a saturated perfluoroaliphatic chain of carbon atoms interrupted by one or more ether oxygen atoms. The compounds can be prepared, e.g., by decarboxylation of the correspond... | 03/08/2005 |
| 6830177 | Method and apparatus to compliantly interconnect commercial-off-the-shelf chip scale packages and printed wiring boards The present invention comprises cost-effectively manufactured, electrically conductive and mechanically compliant micro-leads and a method of utilizing these compliant micro-leads to interconnect area grid array chip scale packages (“CSPs”) to printed wiring boa... | 12/14/2004 |
| 6484926 | Vapor phase reflow system with superheated vapor The present invention relates to a vapor phase reflow system comprising at least one soldering zone and a process zone, a primary liquid reservoir containing a primary liquid, the vapor phase reflow system further comprising a heating means for converting... | 11/26/2002 |
| 6443356 | Method for controlling heat transfer to a work piece during condensation soldering The invention relates to a process for controlling the heat transfer to a workpiece during vapor phase soldering. According to said process, a workpiece placed in a vapor phase is first rapidly heated to a predetermined temperature, and then the temperatu... | 09/03/2002 |
| 6352195 | Method of forming an electronic package with a solder seal A method of attaching a lid with at least a metallic surface thereon to a substrate to enclose a surface acoustic wave electronic circuit using a fluxless solder preform having an undesired oxide surface and associated with the metallic surface on the lid... | 03/05/2002 |
| 6247639 | Fixed-gap solder reflow method A method is provided for forming a plurality of solder joints for electrically and mechanically coupling a printed circuit board (100) and a flexible circuit (101). Solder is applied to the connection surfaces of the printed circuit board (100), and the c... | 06/19/2001 |
| 6230962 | Process for cooling soldered objects A process for cooling soldered objects, according to which a liquid is applied onto the soldered object and is evaporated in an accelerated manner. According to a preferred embodiment the soldered object is cooled in a vapor phase soldering apparatus dire... | 05/15/2001 |
| 6116497 | Process and device for the wave or vapor-phase soldering of electronic units A method of and an apparatus for vapor phase/solder wave soldering contacts of electronic components including temperature sensitive portions in wh the components while moving through a soldering chamber are only partially immersed in a saturated vapor ... | 09/12/2000 |
| 6065664 | Method of installing heat pipes using internal vapor pressure The disclosure is for a method of installing a heat pipe within another structure. A completely processed heat pipe is coated with solder and inserted into a cylindrical hole within the structure with sliding clearance. The casing of the heat pipe is then... | 05/23/2000 |
| 5702051 | Device for moving an object by means of thermal change in shape or volume The invention provides a device for moving an object by means of thermal change in shape or volume, such that the object is moved when a predetermined process temperature has been reached. Preferably the device can be used in a soldering system on a print... | 12/30/1997 |
| 5542596 | Vapor phase soldering machine having a tertiary cooling vapor An improved vapor phase soldering machine includes a pair of separate vessels having an open fluid communication path in a wall separating the two vessels. The first vessel contains a liquid mixture of a primary vapor and a secondary vapor, while the seco... | 08/06/1996 |
| 5482201 | Transport device and process for a vapor-phase soldering installation The invention relates to a transport device and process for loading and removing the part to be soldered in a vapor-phase soldering equipment, in which a support for the part to be soldered is taken in its original direction into and out of a medium conta... | 01/09/1996 |
| 5333774 | Vapor reflow soldering apparatus A vapor reflow soldering apparatus includes a unit for delivering an article processed to a vapor generating tank for generating saturated vapor of thermal medium, for allowing the article to be to come in contact with the saturated vapor, and for heating... | 08/02/1994 |
| 5188282 | Vapor phase flash fusing of printed wiring boards An improved process for the fusing a tin-lead solder mixture deposited to form a finished circuit on a printed circuit or wiring board. The method comprises the rapid or flash fusing of the circuit board having the tin-lead solder mixture deposited thereo... | 02/23/1993 |
| 5181648 | Method and apparatus for vapor phase soldering and cleaning products The described cleaning of work pieces, in particular printed circuit boards or assemblies, after the soldering, is performed by washing with an inert cleansing fluid which is maintained at a temperature slightly below the melting point of the solder. As a... | 01/26/1993 |
| 5104034 | Perfluoro-N,N,N',N-tetrapropyldiaminopropane and use thereof in vapor phase heating N,N,N',N'-tetrapropyldiaminopropane is fluorinated to produce a liquid predominantly perfluoro-N,N,N',N'-tetrapropyldiaminopropane, having inert properties and a boiling point in the range of 212° C. to 216° C. The inert liquid product is useful as a he... | 04/14/1992 |
| 5029748 | Solder preforms in a cast array Cast solder preforms, rings or donuts suitable for use in a reflow solder process to interconnect through-hole pins in an electrical connector to plated through holes in a printed circuit board are disclosed. A plurality of solder donuts are cast into an ... | 07/09/1991 |
| 4996369 | Novel perfluorinated polyethers and process for their preparation Perfluorinated polyethers having the formula Rf O--(CF2 CF2 O)n --R'f wherein n is and integer of 1-11 and each of Rf and R'f is a perfluorinated C1 -C5 -alkyl radica... | 02/26/1991 |
| 4960951 | Novel perfluoropolyethers Novel perfluoropolyethers, such as perfluorodipentaerythritol hexaethyl ether, and their intermediates exhibit excellent chemical and thermal stability and are useful as vapor phase soldering fluids and convection cooling liquids.... | 10/02/1990 |
| 4956390 | Gas transport employing perfluorobutyldecalin Novel compositions of matter are disclosed having the formula: ##STR1## wherein the carbon rings are fully fluorinated to remove all hydrogens and olefinic character. The compositions have utility as heat transfer agents, hydraulic fluids, vapor phas... | 09/11/1990 |
| 4950814 | Liquid fluorocarbon and a method for producing the same Disclosed is a novel fluorocarbon comprising carbon atoms and fluorine atoms and having no double bond, the atomic ratio of fluorine to carbon atoms being 1.50 to 1.93, which exhibits a liquid state at room temperature. The liquid fluorocarbon has excelle... | 08/21/1990 |
| 4949896 | Technique of assembling structures using vapor phase soldering A process for assembling parts of a lightweight structure of aluminum having a multitude of joints. The process includes the following steps: (1) cleaning surfaces of all the parts; (2) selectively depositing on the surfaces a layer of nickel and then tin; (3) sele... | 08/21/1990 |
| 4948032 | Fluxing agent Disclosed in a fluxing agent comprising 45% to 55% by weight of peanut oil and 45% to 55% by weight of water-white rosin.... | 08/14/1990 |
| 4937934 | Installation of surface mount components on printed wiring boards Movement of surface mount components during soldering onto TEFLON™ printed wiring boards is prevented by applying a strip of solder mask material to a solder pad to define a component lead area and applying solder to areas of the areas of the solder pad... | 07/03/1990 |
| 4925992 | Perfluorinated 2-ISO propyl derivative compounds A novel composition of the formula: ##STR1## wherein the carbon rings are fully fluorinated.... | 05/15/1990 |
| 4909425 | Guiding device for folded film A device for guiding a web of flexible film that has been folded back upon itself so as to maintain the edges of the web of film precisely positioned for subsequent sealing. The device includes a smooth support plate positioned so as to be received betwee... | 03/20/1990 |
| 4909430 | Reflow soldering method and the apparatus thereof A reflow soldering method and the apparatus thereof is disclosed, wherein an air flowing fan is provided at the bottom of the apparatus, that is, below a work transporting conveyor so as to produce a minus pressure to draw or pull air into the apparatus i... | 03/20/1990 |
| 4901910 | Perfluorinated propyl derivative compounds for vapor bath soldering A method of vapor bath soldering wherein vapor bath compositions include compounds of the formula: ##STR1## wherein the carbon rings are fully fluorinated and R is selected from the group consisting of fluorine, --CF3 or --CF(CF3 | 02/20/1990 |
| 4898991 | New perfluoropolyethers New perfluoropolyethers, such as perfluoro-4,7,10-trioxa-5-methyleicosane, are useful as vapor phase soldering fluids and convection cooling liquids.... | 02/06/1990 |
| 4896813 | Method and apparatus for cold rolling clad sheet Metals to be bonded are drawn from pay-off reels and passed around holding rollers which are grounded cathodes, each roller being partially exposed in an etching chamber having an anode area at least three times the exposed area of the cathode. Each chamb... | 01/30/1990 |
| 4894910 | Pin grid array removal tool A tool adapted to facilitate the removal of elements such as pin grid arrays, pin grid array sockets, chip carriers, and chip carrier sockets which have been soldered into plated through holes or similar elements of printed wiring cards. A platform is pro... | 01/23/1990 |
| 4895990 | Fluorinated polycyclic compounds A fully-fluorinated and fully saturated fluorocarbon, containing at least two condensed or non-condensed six-membered rings, seventeen carbon atoms and from 28 to 32 (inclusive) fluorine atoms in its molecule, and having a boiling point from 250° to 265... | 01/23/1990 |
| 4892245 | Controlled compression furnace bonding Disclosed is a system and method for controlled compression furnace bonding of a semiconductor chip to conductive elements of a leadframe. The system comprises a holding member having a chip support surface for supporting a semiconductor chip and a positi... | 01/09/1990 |
| 4885414 | Perfluorinated propyl derivative compounds Novel compositions include compounds of the formula: ##STR1## wherein the carbon rings are fully fluorinated.... | 12/05/1989 |
| 4884335 | Surface mount compatible connector system with solder strip and mounting connector to PCB An electrical component (21) for mechanical mounting and electrical connection with respect to plated through holes (34) of a printed circuit board (20) compatibly with a surface mount attaching process includes an electrically non-conducting body (30), p... | 12/05/1989 |
| 4881682 | Vapor phase soldering with perfluorinated butyl derivative compounds Novel compositions of matter are disclosed having the formula: ##STR1## wherein the carbon rings are fully fluorinated to remove all hydrogens and olefinic character. The compositions have utility as heat transfer agents, hydraulic fluids, vapor phas... | 11/21/1989 |
