Did You Know...
...that two musicians were responsible for the invention of color print film? Fascinated by photography, Leopold Godowsky and Leopold Mannes worked together to produce an easy-to-use, practical color film. They worked full time as music teachers and gave concerts while experimenting during their off hours in Mannes' kitchen. Their success earned them full-time, well-paying jobs at Kodak and their efforts resulted in Kodachrome film, which was introduced in 1935.
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| Number | Title | Issue Date |
| 8162202 | Method of manufacturing an article by diffusion bonding and superplastic forming In a method of manufacturing an article (28) by diffusion bonding and superplastic forming stop off material (122) is applied to prevent diffusion bonding in a predetermined pattern on a first surface (106) of a first metal workpiece (100... | 04/24/2012 |
| 8042727 | Heater, reflow apparatus, and solder bump forming method and apparatus An apparatus characterized by a feature that in a stage on which a substrate or a jig holding a substrate is mounted, an opening closed when the substrate or the jig is mounted is provided and the substrate or the jig is heated by blowing hot air against the lower p... | 10/25/2011 |
| 7967185 | Method of forming bonded body and bonded body A method of forming a bonded body comprised of a first base member, a second base member, and a first bonding film and a second bonding film provided between the first base member and the second base member is provided. The first bonding film and the second bonding ... | 06/28/2011 |
| 7861914 | Self-assembly of components A method is provided for the production of a bond between a first element having at least one first metal coating and at least one further element having a second metal coating, the at least one further element being freely moveable in a medium and the at least one ... | 01/04/2011 |
| 7621437 | Brazed structural assembly and associated system and method for manufacture A structural assembly and an associated system and method for manufacture are provided. The structural assembly includes an elongate member and a first connector member that is connected to an end of the elongate member by a braze joint. A second connector member ca... | 11/24/2009 |
| 7441688 | Methods and device for controlling pressure in reactive multilayer joining and resulting product The invention includes a method of joining two components. The method includes providing at least two components to be joined, a reactive multilayer foil, and a compliant element, placing the reactive multilayer foil between the at least two components, applying pre... | 10/28/2008 |
| 7414226 | Movable heating method and system having fixed heating source for brazing stator bars A method to heat a stator bar and clip assembly in a brazing chamber including: placing the stator bar and clip assembly in the brazing chamber, wherein the assembly is seated in a heating coil; positioning a conductive mass between a press and the stator bar and cl... | 08/19/2008 |
| 7410091 | Method of integrated circuit assembly A method of integrated circuit assembly before encapsulation including at least one step of soldering, under mechanical pressure, a first element on a second element, including temporarily maintaining a predetermined spacing, at least partially without solder paste,... | 08/12/2008 |
| 7367486 | System and method for forming solder joints Disclosed herein are methods and devices for stimulating soldering of a substrate with a component during a reflow process. In an exemplified embodiment, the method involves placing a substrate/component combination into a reflow oven; directing the substrate/compon... | 05/06/2008 |
| 7364063 | Thermally coupling an integrated heat spreader to a heat sink base The base of a heat sink may be selectively plated with a solder wetting material and soldered to an integral heat spreader also selectively plated with gold. In another embodiment, the solder may be applied in the form of an insert made up of an electrical heating w... | 04/29/2008 |
| 7353979 | Method of fabricating substrate placing stage A method of fabricating a substrate placing stage includes the step of providing a plate-shaped ceramic base having a substrate placing surface on a side of the ceramic base. The method includes the step of providing a plate-shaped ceramic base formed of a composite... | 04/08/2008 |
| 7353982 | Diffusion bonding for metallic membrane joining with metallic module This invention relates to a method of bonding a metallic membrane with metallic part involving pressing a smooth surface of the metallic membrane against the smooth surface of the metallic part, and heating the metallic membrane and metallic part to a temperature ab... | 04/08/2008 |
| 7350684 | Apparatus and method for forming bump A preheat device (160) is provided to execute, before forming bumps (16) to electrode parts (15), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal... | 04/01/2008 |
| 7331500 | Solder bumps formation using solder paste with shape retaining attribute Method of forming solder bumps of an integrated circuit package is described. A solder paste is formed from a material having a characteristic that the deposited instances thereof substantially retain their geometric shape upon exposure to electromagnetic radiation.... | 02/19/2008 |
| 7331499 | Manufacturing method for a ceramic to metal seal A method of bonding a ceramic part to a metal part by heating a component assembly including the metal part, the ceramic part, and a thin essentially pure interlayer material placed between the two parts heated at a temperature that is greater than the temperature o... | 02/19/2008 |
| 7320426 | Cover for ball-grid array connector A presently-preferred embodiment of a cover for a ball-grid array connector comprises a top member and a first and a second side member adjoining opposing ends of the top member. The first and the second side members each have a mating feature formed thereon for eng... | 01/22/2008 |
| 7299965 | Method and apparatus for mounting and removing an electronic component A method and an apparatus are provided for mounting and removing electronic components using solder bumps while constraining thermal stresses to a substrate. The method and apparatus for mounting and removing an electronic component (bear chip 32) to be solde... | 11/27/2007 |
| 7275781 | Fluid forming of oriented thermoplastics The invention provides a method of forming structural components for automotive vehicles from elongated tubular blanks. A longitudinally oriented tubular blank comprised of a thermoplastic material is provided. The tubular blank is fluidformed in a fluid forming cav... | 10/02/2007 |
| 7270258 | Method of fabrication of semiconductor integrated circuit device Productivity is to be improved in assembling a semiconductor integrated circuit device. A matrix substrate is provided and semiconductor chips are disposed on a first heating stage, and then the matrix substrate is disposed above the semiconductor chips on the first... | 09/18/2007 |
| 7234627 | Method of joining coiled sucker rod in the field A method of joining coiled sucker rod in the field. In its most basic form, the method includes a first step of placing abutting ends of sucker rod in face to face relation. A second step involves positioning a gas burner in proximity to the abutting ends of sucker ... | 06/26/2007 |
| 7223617 | Semiconductor laser device and a method of mounting a semiconductor laser component on a submount A method of mounting a semiconductor laser component capable of preventing deterioration of laser characteristics and destruction of the semiconductor laser component due to a rise in temperature and a residual stress of the semiconductor laser component. The semico... | 05/29/2007 |
| 7201304 | Multi-functional solder and articles made therewith, such as microelectronic components Aspects of the invention provide solder compositions which include two different fluxing agents. One of the fluxing agents promotes melting of a metal of the solder at a first activation temperature and the other fluxing agent promotes melting of the metal at a seco... | 04/10/2007 |
| 7199342 | Self-aligned mechanical joint between die and substrate exposed to mixed microwave energy The present invention includes a mechanical joint between a die and a substrate that is reflowed by microwave energy and a method of forming such a mechanical joint by printing a solder over a substrate, placing the solder in contact with a bump over a die, reflowin... | 04/03/2007 |
| 7159757 | Metal/ceramic bonding article and method for producing same After a metal member of an alloy containing copper and nickel is arranged on at least one side of a ceramic substrate, the metal member and the ceramic substrate are heated in an atmosphere of an inert gas or in vacuo at a temperature between solidus and liquidus li... | 01/09/2007 |
| 7156285 | Compression bonding method and apparatus using light Provided are a method and apparatus for bonding an element, which has a transparency with respect to UV light, to a substrate. The method includes forming an aluminum layer on a surface of the substrate, disposing the element on the aluminum layer, and bonding the e... | 01/02/2007 |
| 7140530 | Method for joining axle components A method of joining two vehicle axle housing components made from the same or dissimilar materials includes providing a first axle housing component, and providing a second axle housing component, where one of the first and second axle housing components is a metall... | 11/28/2006 |
| 7076867 | Pressurizing method A pressurizing method for pressurizing a second component arranged on a first component, against the first component by using a pressurizing apparatus having a stage on which the first component is mounted, a tool, and a protection sheet supplying section. The tool ... | 07/18/2006 |
| 7009157 | Procedure for soldering the constituent layers of a multilayer printed circuit and the machine used for same Procedure for soldering the constituent layers of a multilayer printed circuit and machine for performing it. The procedure is applicable to circuits made up of layers containing the circuit image (2, 3, 4, 5,) that have perimetral strips (9) in... | 03/07/2006 |
| 6994920 | Fusion welding method and welded article A fusion welding method is provided for fusion welding at juxtaposed interface surfaces a first member, for example made of a first metal based on at least one of Ru, Rh, Pd, and Pt, with a second member made of a second metal, for example a high temperature alloy b... | 02/07/2006 |
| 6986453 | Manufacturing method for a ceramic to metal seal The invention is a method of bonding a ceramic part to a metal part by heating a component assembly comprised of the metal part, the ceramic part, and a very thin essentially pure interlayer material of a compatible interlayer material placed between the two parts a... | 01/17/2006 |
| 6983539 | Method of forming an electrical connection between electrical leads of a tab circuit and electrical contact bumps In one form of the invention, a laser beam propagates directly through bulk material of a TAB tape or base, to heat and form a bond between electrical leads formed on the base and aligned contact bumps. In another form, a chromium seed-metal layer is formed on a TAB... | 01/10/2006 |
| 6908027 | Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process More complete bonding of wafers may be achieved out to the edge regions of the wafer by constrained bond strengthening of the wafers in a pressure bonding apparatus after direct wafer bonding. The pressure bonding process may be accompanied by the application of not... | 06/21/2005 |
| 6871776 | Manufacture of solid-solder-deposit PCB utilizing electrically heated wire mesh A process and apparatus for manufacturing Solid Solder Deposit-Printed Circuit Board (SSD-PCB) by melting dry solder powder previously deposited on a pocketed-PCB 20. The process and apparatus utilize as heat source an electrically heated conveyor wire mesh | 03/29/2005 |
| 6863209 | Low temperature methods of bonding components Methods of bonding two components may include positioning the components relative to one another to obtain a desired orientation. Once the desired orientation is obtained, the components can be bonded in the desired orientation with metal wherein a temperature of bo... | 03/08/2005 |
| 6857557 | Low temperature microelectronic die to substrate interconnects Methods are provided for interconnecting two electronic components having surface mount technology interconnects. In one embodiment, a reflowable electrically conductive first interconnect material is reflowed onto the land pads of a microelectronic die. A reflowabl... | 02/22/2005 |
| 6857559 | System and method of soldering electronic components to a heat sensitive flexible substrate with cooling for a vector transient reflow process A method of soldering electronic components to a heat sensitive flexible substrate with cooling for a vector transient reflow process is disclosed. The method comprises applying solder paste to the substrate and placing electronic components to the substrate to form... | 02/22/2005 |
| 6837417 | Method of sealing a hollow cast member A method of sealing an opening in a cast member that employs a green seal cap formed from the consolidation of a mixture of powdered metal and a binder under sufficient pressure to impart enough strength to the cap to maintain its shape during the blade manufacturin... | 01/04/2005 |
| 6820329 | Method of manufacturing multi-chip stacking package The present invention discloses a method of manufacturing a multi-chip stacking package. The characteristic of the invention is that after the alignment of the bumps of at least two chips, welded bumps will be generated in a high temperature welding to form a welded... | 11/23/2004 |
| 6786389 | Method of manufacturing a fibre reinforced metal component A method of manufacturing a fiber reinforced metal disc comprises forming an annular groove in an axial face of a first metallic ring. A plurality of metal coated fibers are arranged in spiral preforms and a plurality of metallic wires are arranged in spiral preform... | 09/07/2004 |
| 6772934 | Kinetic energy welding process A method of laminating a plurality of metal plates one to another, comprising steps of (a) arranging at least first and second generally planar metal plates having exposed surfaces into a spaced apart parallel relationship with one another, (b) anchoring the spaced ... | 08/10/2004 |
