Bizarre Patents
A Receptacle for supporting, rotating and sculpting a portion of ice cream or similarly malleable food while it is being consumed.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8123110 | Method for soldering with a multistep temperature profile A method in which no voids occur during the soldering processes is provided. A component with a soldering material is heated using a first temperature plateau for a first time duration such that the solder material is completely melted. Each subsequent heating is at... | 02/28/2012 |
| 7832620 | Method for soldering with a multistep temperature profile In soldering processes according to prior art, there is often an insufficient tie-up to a substrate of a component. A method in which no voids occur during the soldering processes is provided. A temperature pattern is proposed according to the method in which the te... | 11/16/2010 |
| 7407084 | Method for mounting a semiconductor chip onto a substrate A method for mounting a semiconductor chip onto a substrate the side of which facing towards the substrate is coated with an adhesive layer is characterised by the following steps: (1) Lowering the semiconductor chip until the semiconductor chip touches... | 08/05/2008 |
| 7398912 | Different materials bonded member and production method thereof A different materials bonded member includes a ceramic base material and a metallic member which are bonded together through an Au solder material. The solder material is disposed on a bonding surface of the ceramic base through a given active metal layer or a given... | 07/15/2008 |
| 7377418 | Method of brazing aluminum products and furnace therefor When aluminium products are preheated in a preheating furnace up to about 500° C. before they are brazed with a flux in a heating furnace, a nitrogen atmosphere in the preheating furnace is made convectional by fans for improving heating efficiencies and also for h... | 05/27/2008 |
| 7367489 | Method and apparatus for flip chip attachment by post collapse re-melt and re-solidification of bumps A solder bump reflow process includes raising the temperature of an aligned die-substrate assembly to a temperature and for a time sufficient to cause a first reflow; allowing the temperature of the assembly to fall to a first cooling temperature and for a time suff... | 05/06/2008 |
| 7360676 | Welded aluminum alloy structure A method of welding age-hardenable aluminum alloys to improve strength properties in the heat affected zone and the weld zone, the method comprising the steps of providing precipitation hardenable aluminum alloy members to be welded and subjecting said members to a ... | 04/22/2008 |
| 7353980 | Process for producing aluminum-containing honeycomb bodies using radiant heaters A method for producing aluminum-containing honeycomb bodies includes providing at least partly structured aluminum-based metal foils. The at least partly structured metal foils are stacked and/or wound to form a honeycomb structure having passages. The metal foils a... | 04/08/2008 |
| 7299965 | Method and apparatus for mounting and removing an electronic component A method and an apparatus are provided for mounting and removing electronic components using solder bumps while constraining thermal stresses to a substrate. The method and apparatus for mounting and removing an electronic component (bear chip 32) to be solde... | 11/27/2007 |
| 7293692 | Solder joint structure, soldering method, and electronic-component manufacturing apparatus using the same structure and the method A structure of solder joint structure formed of zinc-based lead-free solder having excellent characteristics is disclosed. Between a first lead-free solder layer and a soldering pad, the following layers are formed: a tin-copper alloy layer formed on the pad; a firs... | 11/13/2007 |
| 7026582 | Vector transient reflow of lead free solder for controlling substrate warpage A system and method for reflowing lead-free solder to interconnect a plurality of electronic components to a substrate is disclosed. The system includes an oven for preheating the substrate and the plurality of electronic components disposed thereon, and a supplemen... | 04/11/2006 |
| 6971571 | Reflow soldering apparatus and reflow soldering method A bath apparatus 12 reserves a liquid 13 as a heating medium and includes an input partition bath 31, a first intermediate partition bath 32, a heat partition bath 33, a second intermediate partition bath 34 and a removing p... | 12/06/2005 |
| 6805282 | Flow soldering process and apparatus There is provided a flow soldering process for mounting an electronic component onto a board by a solder material, which process is appropriate for using a lead-free solder material as the solder material. In the flow soldering process, thermal efficiency of ... | 10/19/2004 |
| 6739497 | SMT passive device noflow underfill methodology and structure An electronic fabrication process and structure is provided for attaching discrete passive surface mount devices (SMD) to a substrate in a single step. A liquid noflow resin encapsulant containing flux material is dispensed between presoldered pads on a substrate. T... | 05/25/2004 |
| 6520401 | Diffusion bonding of gaps A process for diffusion bonding of cracks and other gaps in high-temperature nickel and cobalt alloy components is described. The gap is filled with alloy powder matching the substrate alloy, or with an alloy of superior properties, such as MAR-M 247, MAR... | 02/18/2003 |
| 6503349 | Repair of single crystal nickel based superalloy article The present invention relates to a method for repairing components formed from a single crystal nickel based superalloy. The method comprises the steps of applying a repair alloy to at least one portion of a component formed from the single crystal nickel... | 01/07/2003 |
| 6493928 | Electronic unit manufacturing apparatus An electronic unit manufacturing apparatus includes: a cream solder printer for printing cream solder on one side of a printed-circuit board; a chip placement machine for placing a plane-mounted part on the printed-circuit board on which the cream solder ... | 12/17/2002 |
| 6340113 | Soldering methods and compositions Soldering methods and compositions are disclosed to provide electrical connections between surfaces with reduced likelihood of short circuits or solder-starved joints. Two component solder compositions are employed to preferably form "metallic foam" joint... | 01/22/2002 |
| 6325279 | Solder alloy of electrode for joining electronic parts and soldering method A lead-free solder alloy of electrode for joining electronic parts fine in texture and excellent in thermal fatigue resistant characteristic is presented. This is a solder alloy of electrode for joining electronic parts comprising Sn, Ag and Cu as princip... | 12/04/2001 |
| 6257481 | Metal bonding A method of bonding two pieces of metal having a foil or layer of another metal, either of lower melting point or such that it forms a liquid layer at or near to the bonding temperature, disposed therebetween. The method comprises the steps of: bringing t... | 07/10/2001 |
| 6206265 | Temperature control method of solder bumps in reflow furnace, and reflow furnace A method for determining the condition of a reflow furnace so as to prevent the semiconductor element from tilting due to different collapsed amounts of solder bumps in the single semiconductor element of multiple chip modules mounted on the semiconductor... | 03/27/2001 |
| 6164904 | Assembly for brazing a stator component of a gas turbine engine and method brazing articles such as an abradable material to a stator of a gas turbine engine A method and assembly useful in metal joining processes is disclosed which blocks the deposition of molten metal in openings. The method and assembly employs mica material with a binder to block the flow of molten metal. In one detailed embodiment, the mi... | 12/26/2000 |
| 6156134 | Bonding method of dual phase stainless steel In a method of bonding ferric and austenitic dual stainless steels, an insert material made of a Ni base alloy having a melting point below 1290° C. is put between the bonding cross section faces of mother material steels comprising a dual phase stainles... | 12/05/2000 |
| 6131796 | Direct brazing of refractory metal features A brazing method for the direct bonding of a metallic item to a refractory metal without the need for an adhesion layer. The direct brazing process uses a Cu--Ag--Ni alloy which eliminates the need for the steps of plating a refractory metal to be bonded ... | 10/17/2000 |
| 6126061 | Element made of composite material including electrical continuity through the element The subject of the invention is an element made of composite material comprising an organic matrix which is reinforced with mineral or organic fibers, as well as at least one assembly with partial superposition of at least two electrically conductive elon... | 10/03/2000 |
| 6065664 | Method of installing heat pipes using internal vapor pressure The disclosure is for a method of installing a heat pipe within another structure. A completely processed heat pipe is coated with solder and inserted into a cylindrical hole within the structure with sliding clearance. The casing of the heat pipe is then... | 05/23/2000 |
| 6059177 | Welding method and welding material A welding method for two members adapted to be welded and formed of a low-alloy steel for structural purposes causing the weld metal to develop martensite transformation during cooling after welding, so that the weld metal becomes expanded to a greater de... | 05/09/2000 |
| 6039236 | Reflow soldering apparatus with improved cooling A reflow soldering apparatus includes a plurality of heating compartments connected in series for heating objects for soldering; transporting means for successively carrying the objects through the compartments; and at least first and second cooling compa... | 03/21/2000 |
| 6036083 | Method for braze flux application The forming oil degreasing step and flux coating step are reversed as part of a basic fluxed heat exchanger brazing process. This allows the fluxed parts to be thermally degreased concurrently with the braze oven workpiece preheat process, eliminating a s... | 03/14/2000 |
| 6021939 | Method of producing a wear resistant mechanical component A method of producing a wear resistant mechanical component is disclosed which enables the crown value of a wear resistant tip to be controlled at one's desire. A component preform is provided by placing the wear resistant tip on a metal body with a brazi... | 02/08/2000 |
| 5873703 | Repair of gamma titanium aluminide articles A surface defect in a gamma titanium aluminide article is repaired by weld repairing the defect and thereafter sealing the surface-connected cracks in the weldment. The surface-connected cracks are repaired by applying to the region of the weldment a powd... | 02/23/1999 |
| 5806752 | Manufacture of aluminum assemblies by open-air flame brazing An open-air brazing method for manufacturing an assembly including at least one aluminum based tube having an internal surface and an external surface, applying an Aluminum Association 4XXX aluminum based filler material to at least a portion of the exter... | 09/15/1998 |
| 5803344 | Dual-solder process for enhancing reliability of thick-film hybrid circuits A high temperature thick-film hybrid circuit is characterized by a surface-mount circuit component that is electrically interconnected with a conductor. The surface-mount circuit component of the thick-film hybrid circuit is bonded to the conductor with a... | 09/08/1998 |
| 5758816 | Method for attaching small components to each other A method is provided to heat a plurality of components to a preselected temperature that creates a tackiness at the surface of a preformed solder component and permits the preformed solder component to adhere to a first metallic surface of a first compone... | 06/02/1998 |
| 5709338 | Soldering method A soldering is performed in such a manner that two solder portions having different melting points are put between a metallization on a substrate for joining and a part. The chip portion having a higher melting point is made thicker than a solder foil por... | 01/20/1998 |
| 5664723 | Brazing technology A method of braze joining a copper member to a substrate of metal or ceramic material is disclosed according to which a diffusion barrier coating as defined is applied to the substrate alone, and a selected brazing alloy is interposed between copper membe... | 09/09/1997 |
| 5657923 | Brazing of catalyzed converter bodies There is provided a process for brazing a first coated part to a second metal part which includes the steps of cleaning or masking, the surfaces of at least the first metal part, interposing a brazing metal foil between the metal parts, and induction heat... | 08/19/1997 |
| 5639010 | Simultaneous process for surface mount adhesive cure and solder paste reflow for surface mount technology devices A method for attaching a surface mount device to a circuit board includes applying a heat curable adhesive to the circuit board, applying solder paste with a predetermined melting temperature to the circuit board, placing the surface mount device on the a... | 06/17/1997 |
| 5632435 | Process for the production of a soldered joint Process for the production of a soldered joint. The invention pertains to a soldering process in which thin walled carbon parts are soldered, on a flat side, to silicon carbide parts, for the connection of mechanically and thermally highly stressed parts ... | 05/27/1997 |
| 5584428 | Process for manufacturing clad pipe Clad pipe having an inner pipe and an outer pipe metallurgically bonded to each other is manufactured by a process comprising the steps of: (a) preparing an inner pipe and an outer pipe made of different metallic materials, the outer pipe having an inner ... | 12/17/1996 |
