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Class 228/224 - Flux affixed to or incorporated with filler


Subclass of Class 228 - Metal fusion bonding
Definition: Process in which the fluxing substance is incorporated with
No. of patents: 88
Last issue date: 09/21/2010


1      
NumberTitleIssue Date
7798389Flux for soldering, soldering method, and printed circuit board
A flux for soldering used when soldering is performed to a board subjected to electroless nickel plating, the flux containing resin having film forming ability, activator, and solvent, and further containing metallic salt in an amount of 0.1 to 20% by weight of the ...
09/21/2010
7428979Process for soldering an electronic component on an electronic card, process for repairing the card and installation for using the process
A process for soldering an electronic component onto a support which includes at least one heat drain for the component. The method uses a solder paste which incorporates a stripping flux activated at a first temperature, and a solder alloy melted at a second temper...
09/30/2008
7368035Method for brazing and adhesive bonding
An improved method for joining together the edge portions of first and second panels includes applying a heat curable adhesive along the edge portion of the first panel and then abutting the edge portion of the second panel with the edge portion of the first panel s...
05/06/2008
7344061Multi-functional solder and articles made therewith, such as microelectronic components
Aspects of the invention provide solder compositions which include two different fluxing agents. One of the fluxing agents promotes melting of a metal of the solder at a first activation temperature and the other fluxing agent promotes melting of the metal at a seco...
03/18/2008
7337941Flux coated brazing sheet
A brazing flux mixture comprised of brazing flux, a polyvinyl butyral resin binder, and an organic solvent which can be applied over an entire aluminum alloy brazing sheet, or can be applied on the brazing sheet only where metallurgical bonds or joints are required,...
03/04/2008
7316506Dual temperature indicator stick holder
An apparatus to combine temperature indicator sticks used in the welding, metal fabrication, and heat treatment industries and capable of identifying at least two given temperatures is disclosed. The apparatus includes a first temperature indicator stick aligned alo...
01/08/2008
7241348Flux for solder paste and solder paste
A flux for solder paste contains a dicarboxylic acid of carbon number 3 to 5 and a dicarboxylic acid of carbon number 15 to 20 as an activator, which prevents skinning or changes by aging of viscosity. In actual use, the solder paste of the present invention can mai...
07/10/2007
7201304Multi-functional solder and articles made therewith, such as microelectronic components
Aspects of the invention provide solder compositions which include two different fluxing agents. One of the fluxing agents promotes melting of a metal of the solder at a first activation temperature and the other fluxing agent promotes melting of the metal at a seco...
04/10/2007
7182241Multi-functional solder and articles made therewith, such as microelectronic components
Aspects of the invention provide solder compositions which include two different fluxing agents. One of the fluxing agents promotes melting of a metal of the solder at a first activation temperature and the other fluxing agent promotes melting of the metal at a seco...
02/27/2007
7070088Method of semiconductor device assembly including fatigue-resistant ternary solder alloy
Method for assembling a semiconductor device having fatigue-resistant interconnection fillet provides a semiconductor chip with at least one solder bump comprising an alloy of tin and lead with a melting temperature higher than the solder paste used. Further, a sold...
07/04/2006
6998572Light energy processing device and method
A machining apparatus includes a light source (1) for generating light energy, an optical system (2, 3) for guiding the generated light energy to a joint position of a workpiece, a table (5a) on which the workpiece is mounted, and a heati...
02/14/2006
6915942Method of manufacturing mount structure without introducing degraded bonding strength of electronic parts due to segregation of low-strength/low-melting point alloy
A method of manufacturing a mount structure according to the present invention which forcedly cools down a melted solder paste on a printed circuit board at a cooling speed of 1.5° C./second or higher to solidify the solder paste when an electronic part is mounted ...
07/12/2005
6915944Soldering flux, solder paste and method of soldering
The present invention relates to a soldering flux, a soldering paste and a soldering method that achieve a sufficient degree of bonding strength even when components are mounted at a higher density, components are further miniaturized or components are mounted with ...
07/12/2005
6902097Electrically conductive wire
A method of soldering comprises disposing first and second balls of solder adjacent one another on a wire; disposing flux on the wire between and in contact with both of the first and second balls and so as to substantially fill a space between the first and second ...
06/07/2005
6902102Soldering method and solder joint member
In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated ...
06/07/2005
6854633System with polymer masking flux for fabricating external contacts on semiconductor components
A polymer masking flux for fabricating external contacts on semiconductor components includes a polymer resin, a fluxing agent and a curing agent. The flux is configured to clean contact pads for the external contacts, and to hold the external contacts on the contac...
02/15/2005
6805280Z interconnect structure and method
The current invention provides a method of attaching a plurality of cores wherein a core has a via with a conductive surface to be electrically connected to a conductive surface on another core. The method provides for applying a metallurgical paste to a conductive ...
10/19/2004
6796482Phase separated system for fluxing
A solder flux composition (19) is provided which comprises active ingredients and a carrier. The solder flux composition undergoes a phase separation during solder reflow to form at least a first phase (21) and a second phase (23), such that the...
09/28/2004
6656290Soldering paste for hard-soldering and coating aluminum and aluminum alloys
A soldering paste for hard-soldering and coating working parts made of aluminum or aluminum alloys, which contains 25 to 35 percent in weight of a water-miscible organic binding agent on the basis of aliphatic glycols, 25 to 45 percent in weight of an alu...
12/02/2003
6648212Components coated with an aluminum-silicon alloy
Components composed of aluminum or an aluminum alloy with a coating comprising an aluminum-silicon alloy deposited thereon by applying an alkali metal fluorosilicate and heating the resulting treated material. The alloy layer is effectively protected agai...
11/18/2003
6601754Method of connecting circuit boards
The invention provides metal connecting composition for connecting metal to metal with removing oxide film on the mother metal surface. The metal connecting composition contains metal particles and hydrocarbon compound having C--H bonding dissociation ene...
08/05/2003
6592020Lead-free solder paste
The invention relates to a lead-free solder paste comprising a solder paste flux and solder alloy particles that are substantially lead-free wherein the solder paste flux comprises resin dissolved in a solvent and also includes undissolved resin particles...
07/15/2003
6554180Lead-free solder paste
A lead-free solder paste suitable for soldering chip parts includes a powder of a twin-peak Sn-based solder alloy containing 0.2-1.0 mass % of Ag and a flux. The solder alloy has a first peak of heat absorption in a differential scanning calorimeter curve...
04/29/2003
6476487Solder circuit
A method of forming a solder film on a metallic surface such as a pad of a metallic circuit of a printed circuit board and a lead frame of electronic parts, which is capable of forming a precise and fine pattern and which comprises selectively imparting t...
11/05/2002
6460755Bump forming method and apparatus therefor
There are disclosed a solder bump forming method and an apparatus therefor, which achieve a high reliability, and an electronic part, produced by this method and this apparatus, is also disclosed. For each of the step of arraying solder balls, the step of...
10/08/2002
6422451Interconnection of aluminum components
A method of interconnecting components (10, 16) of aluminium having a purity of at least 95%, the method comprising brazing the components (10, 16) together and then surface treating the assembled componetns (10, 16) by subjecting them to a Bohmitting pro...
07/23/2002
6409074Flux compositions for brazing aluminum, their films and brazing method
A flux composition for brazing aluminum, comprising a fluoride flux, at least one selected from a butyl rubber and a petroleum resin, and a solvent. The novel flux composition has excellent processing properties and provides brazed areas (fillets) with go...
06/25/2002
6402013Thermosetting soldering flux and soldering process
A soldering flux suitable for soldering of small electronic components comprises 0.1-50 mass percent of an organic acid, 5-40 mass percent of a solvent, and 10-95 mass percent of a thermosetting resin (including a curing agent), which is preferably a bisp...
06/11/2002
6386431Vacuum insulated coffee server manufacturing process
A process for manufacturing a vacuum insulated stainless steel coffee server, which includes the steps of welding an outer shell (32) to an inner liner (34) then placing a ceramic ring (38) in a vacuum base (40) and slipping the vacuum base on the shell w...
05/14/2002
6355101Flux transfer apparatus
A flux transfer apparatus has a frame having an aperture portion in its lower central portion, and a mesh is stretched across the frame with a high tension and with a mesh pitch at least smaller than the diameter of projections to be formed therein is use...
03/12/2002
6333494Method of induction brazing transformer strands to base plate
A method of brazing a plurality of copper strands to a buss bar includes: a) cleaning the buss bar and the copper strands; b) positioning a filler shim on the surface of the buss bar; c) placing a copper strand on the filler shim, the filler shim and the ...
12/25/2001
6244497Method for soldering aluminum and soldering rod therefor
A method for repairing and joining aluminum alloy articles and structures, such as heat exchangers for use in automotive applications. The method utilizes a flux-coated soldering rod (10) that is used to deliver a solder alloy (12) and a flux compound to ...
06/12/2001
6221506Bushing base with mounted nozzles
The invention relates to a method of manufacturing a bushing baseplate, and to a bushing baseplate. The bushing baseplate is characterized in that it comprises tips (18) constituted by hollow tubular elements of outside diameter slightly smaller than the ...
04/24/2001
6184475Lead-free solder composition with Bi, In and Sn
A lead-free solder alloy composition contains Sn, Bi and In, with respective contents such that the solder alloy composition provides a liquidus temperature below the heat resistant temperature of a work to be soldered. The alloy contains not more than ab...
02/06/2001
6170735Soldering method using a flux containing borneol
A soldering flux containing borneol, which is also referred to as bornyl alcohol. A method soldering using such a flux is also disclosed. Even minor proportions of borneol in the flux help reduce ionic residue from the flux after soldering. Larger proport...
01/09/2001
6142363Soldering method using soldering flux and soldering paste
Provided are a soldering flux or paste containing an organic substance which has at least two hydroxyl (--OH) groups in a molecule and of which the temperature at which the mass % becomes approximately 0% is not lower than approximately 170° C. and not l...
11/07/2000
6120848Method of making a braze sheet
A method is disclosed of making a braze sheet for a brazed assembly. The method includes the steps of providing a sheet of a core material and a composition cladding and mechanically embedding a flux into the sheet....
09/19/2000
6070789Method for soldering aluminum and soldering rod therefor
A method for repairing and joining aluminum alloy articles and structures, such as heat exchangers for use in automotive applications. The method utilizes a flux-coated soldering rod (10) that is used to deliver a solder alloy (12) and a flux compound to ...
06/06/2000
6068177Continuous hot rolling method
A continuous hot rolling method including the steps of: cutting the tail portion of a preceding material in a steel product and the front portion of a succeeding material in the steel product to form butt faces; previously determining the thickness of sca...
05/30/2000
5984161Flux-encased resilient solder preforms and process for the preparation thereof
Relatively resilient flux encasings for solder preforms are obtained when a mixture of 5 to 30 wt. % potassium silicate having a molar ratio of K2 O:SiO2 ranging from 1:2.5 to 1:4.5, 0.5 to 10 wt. % concentrated phosphoric acid, 0.1 ...
11/16/1999
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