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| Number | Title | Issue Date |
| 8328076 | Apparatus and method for ensuring concentric weld deposition of material on a pipe interior A welding jig for ensuring concentricity of an interior surface of a pipe with a circular outer periphery of a bolting flange thereon, comprising (i) a frame member; (ii) two spaced-apart rollers positioned at one end of said frame member, each adapted to remain in ... | 12/11/2012 |
| 7392925 | Handheld fluid cooled electric solder tweezers A handheld fluid cooled electric solder tweezers. A pair of soldering heads extend from a pair of tweezer members, respectively, and are operatively connected to a cooling apparatus. The cooling apparatus of each tweezer member includes a pair of heat dissipating tu... | 07/01/2008 |
| 7265315 | Method of joining terminals by soldering A method of joining terminals by soldering is provided which allows control of increasing gas supply even in soldering performed in a gas atmosphere within a gas chamber. Utilizing a springback phenomenon occurring at a flat portion of a terminal, a solder joint of ... | 09/04/2007 |
| 7259351 | Heat treating assembly and method The subject invention provides a heat treating assembly. The heat treating assembly comprises a laser, a substrate, and a tool. The laser emits laser energy directed toward the substrate and the tool. The substrate absorbs the laser energy and produces heat energy w... | 08/21/2007 |
| 7185420 | Apparatus for thermally coupling a heat dissipation device to a microelectronic device An apparatus is provided for thermally coupling a heat dissipation device to a microelectronic device. A thermal compression bonding apparatus is provided comprising a bonding head adapted to apply heat and pressure to the heat dissipation device to provide the desi... | 03/06/2007 |
| 7156279 | System and method for mounting electronic components onto flexible substrates A system and method for reflowing solder to interconnect a plurality of electronic components (24) to a substrate (12) is disclosed. The system includes an oven for preheating the substrate (12) and the plurality of electronic components (24 | 01/02/2007 |
| 7124931 | Via heat sink material The invention provides thermally conductive material so that less heat traveling from one side of a layer will reach connection material on another side of a layer. Rather, some of the heat will be conducted away by the thermally conductive material and dissipated. | 10/24/2006 |
| 7032809 | Seam-welded metal pipe and method of making the same without seam anneal An apparatus and method for making a seam-welded steel pipe free of untempered martensite without seam anneal. The method includes selecting a steel containing a carbon concentration below a predetermined level, for example, 0.14% or 0.12% by weight. The method also... | 04/25/2006 |
| 6979025 | Joining of lined pipes A metal pipeline section that has a metal flange at one end is lined with a plastic liner such that some of the liner extends beyond the flange end of the pipeline section. An annular plastic member is electrofusion joined onto the outside of the portion of plastic ... | 12/27/2005 |
| 6959855 | Carbon-based weld blanket, methods of making and methods of use A non-woven weld blanket for protecting automobile exteriors and interiors and industrial equipment from weld spatter, comprising a needle punched webbing of pre-oxidized, polyacrylonitrile (PAN) fibers. The fabric is assembled using these carbon precursor fibers th... | 11/01/2005 |
| 6827253 | Method and means for rapid heat-sink soldering A method and system for rapid heat-sink soldering, having a workpiece gripper, an intense heat source, and an optional air-jet cooling system, is provided for soldering workpieces to substrates of dissimilar material composition. The workpiece gripper selectively po... | 12/07/2004 |
| 6793125 | Solder shaping process and apparatus A process and apparatus for forming fusible solder material mounted on a substrate with the use of a tool having a treatment surface with selected shape. The solder material is heated sufficiently to cause fusing after which the tool is moved such that the treatment... | 09/21/2004 |
| 6593549 | Cooling device/heater assembly including a supporting bracket for a reflow oven A heater is secured to a cooling device in a reflow oven by a bracket comprising a first portion attached to a supporting structure, such as the cooling device itself, and a second portion extending over the heater. A member, preferably a screw, extends t... | 07/15/2003 |
| 6585149 | Packaging method using lead-free solder A packaging method using lead-free solder, characterized by including a reflow-soldering step in which a surface mount device is soldered to a circuit board with a lead-free solder paste; an inserting step in which the lead or terminal of a insertion moun... | 07/01/2003 |
| 6550668 | Method and means for rapid heat-sink soldering A method and system for instantaneous heat-sink soldering comprising a gripper device, an intense heat source, and an air-jet cooling system is provided for soldering terminals to structures of dissimilar material composition. The gripper device is adapte... | 04/22/2003 |
| 6516992 | Friction stir welding with simultaneous cooling A method and apparatus for friction stir welding that produces a weld of significantly reduced surface roughness at significantly higher welding rates, in materials that are difficult to weld, such as non-extrudable aluminum alloys. The method includes co... | 02/11/2003 |
| 6443355 | Soldering method and apparatus A soldering method and apparatus in which there is provided a tight contact cover tightly contacting a portion (unused portion) of a re-flow panel other than its portion facing a substrate to be soldered in such a manner as to suppress a hot wind tending ... | 09/03/2002 |
| 6382502 | Method of manufacturing a heat sink made of aluminum A heat sink made of aluminum having both high strength and heat dissipation performance together is manufactured. In a method of manufacturing a heat sink made of aluminum by brazing a plurality of fins 13 on a heat dissipating substrate 11, the fin 13 co... | 05/07/2002 |
| 6230962 | Process for cooling soldered objects A process for cooling soldered objects, according to which a liquid is applied onto the soldered object and is evaporated in an accelerated manner. According to a preferred embodiment the soldered object is cooled in a vapor phase soldering apparatus dire... | 05/15/2001 |
| 6202916 | Method of wave soldering thin laminate circuit boards A method and assembly for preserving solder connections of components mounted on a thin laminate circuit board during wave soldering of leaded components to the circuit board. The method generally entails supporting the circuit board on a pallet with pede... | 03/20/2001 |
| 6173883 | Method and apparatus for increasing heat transfer that is restricted in thermally isolated pockets of a medium A thermal mass (18) is reflow soldered atop of a multi-layered medium (10) in order to yield minimum thermal resistance between a heat source (22) located on the multi-layered medium (10) and the thermal mass (18) for greater heat dissipation efficiency. ... | 01/16/2001 |
| 6152352 | Continuous hot rolling method of metal blocks, as well as a metal block joining apparatus, a table roller for conveying the metal blocks, a poor joined portion removing apparatus and a metal block cooling apparatus which are used to carry out said method The invention comprises a continuous hot rolling method in which a rear end portion of a preceding metal block and a fore end portion of a succeeding metal block are cut and the metal blocks are joined to each other by heng and pressing followed by a f... | 11/28/2000 |
| 6119927 | Method and apparatus for placing and attaching solder balls to substrates A method and apparatus for placing and attaching solder balls to a substrate having conductive pads in a predetermined pattern is disclosed. The substrate is placed on a carrier plate. An alignment plate having holes corresponding to the predetermined pat... | 09/19/2000 |
| 6095405 | Method for soldering integrated circuits Any one of at least two holding blocks loaded in a holding block storing portion is picked up and moved to cover an IC on a PCB of a PCB array. A light beam is applied to the whole surface of the PCB. The holding block is moved from the PCB to the holding... | 08/01/2000 |
| 6089442 | Electrode connection method A method of connecting first electrodes formed on a first substrate to second electrodes formed on a second substrate and partially coated with a resist pattern so as to substantially expose an opening thereof at a surface of the second electrodes include... | 07/18/2000 |
| 6079613 | Heat suppressing wrap A heat suppressing wrap is provided for suppressing the transfer of thermal energy along a pipe during a thermal joining operation, such as a high temperature, open flame welding, brazing or soldering operation. The heat suppressing wrap is a blended fabr... | 06/27/2000 |
| 6049060 | Method for welding an article and terminating the weldment within the perimeter of the article An article is welded, as in weld repair of a defect, by positioning a weld lift-off block at a location on the surface of the article adjacent to the intended location of the end of the weldment on the surface of the article. The weld lift-off block has a... | 04/11/2000 |
| 6045032 | Method of preventing solder reflow of electrical components during wave soldering A method of preventing solder reflow of a SMT component (14) attached with solder (22) to a circuit board (10) that subsequently undergoes a wave soldering operation. The method generally entails the use of a thermal shield (18, 28) that is either part of... | 04/04/2000 |
| 6039236 | Reflow soldering apparatus with improved cooling A reflow soldering apparatus includes a plurality of heating compartments connected in series for heating objects for soldering; transporting means for successively carrying the objects through the compartments; and at least first and second cooling compa... | 03/21/2000 |
| 5975406 | Method to repair voids in aluminum alloys The present invention provides a method to repair a void in an aluminum alloy, particularly a void resulting from an exit hole left from friction stir welding (FSW). The method includes machining the void to provide a tapered bore (34) through a parent me... | 11/02/1999 |
| 5942289 | Hardfacing a surface utilizing a method and apparatus having a chill block A hardfacing apparatus includes a deposition head including a heat source, a hardfacing material source, and a chill block having a chill block surface. The deposition head is positioned at a location so as to deposit a mass of the hardfacing material ont... | 08/24/1999 |
| 5857611 | Sputter target/backing plate assembly and method of making same A method of forming a sputter target/backing plate assembly comprises the steps of: providing a target fabricated from a first material having a coefficient of thermal expansion; providing a backing plate fabricated from a second material having a coeffic... | 01/12/1999 |
| 5816479 | Method for joining driven pipe Improved welding method and padeye processing speeds up the connection of individual joints by peripheral fusion welding while the joint to be added stands vertically atop an existing pipe string also standing vertical in the rig floor. A plurality of wel... | 10/06/1998 |
| 5660318 | Apparatus for inner lead bonding (ILB) comprising a heat dissipation pin and method of ILB using such an apparatus An inner lead bonding apparatus having a heat dissipation plate attached to inner leads and to a support for upholding a lead frame of a tape automated bonding package. The heat dissipation plate is, during performance of an inner lead bonding process, lo... | 08/26/1997 |
| 5651495 | Thermoelectric cooler assisted soldering An improved method for soldering a thermoelectric cooler between an electronic device and a heatsink. Thermoelectric coolers are assembled by soldering parts together using a first solder. The bottom surface of the thermoelectric cooler is first soldered ... | 07/29/1997 |
| 5647529 | Method of controlling the temperature of a portion of an electronic part during solder reflow A method for controlling the temperature of a predetermined portion of an electronic part during the solder reflow process. The method includes the steps of applying (107) an absorbent material containing a fugitive material (109) to a predetermined porti... | 07/15/1997 |
| 5641114 | Controlled temperature bonding In a bonding station the parts of the apparatus to be bonded are retained at a thermal bias temperature at a permitted level and a thermal check valve interface is provided between the bonding location and the part of the station that would serve as a con... | 06/24/1997 |
| 5639012 | Process and device for the posttreatment of welded compound panels In a compound panel welding line, the compound panels discharged from a welding machine are cooled by means of a cooling unit. In the cooling unit, the welded seam is treated with a cooling fluid, in particular a rust-preventative oil. This allows the pan... | 06/17/1997 |
| 5622304 | Tape bonding apparatus A cooling system for cooling the upper and lower clampers of a wire bonding apparatus which hold a tab tape in between including a fluid passage formed inside the upper clamper so that air or water which is supplied and flowing inside the fluid passage co... | 04/22/1997 |
| 5577658 | Gas knife cooling system A gas knife cooling system for reflow soldering cools soldered articles by impinging a gas flow directly on the articles and as a result uses less cooling gas. A heater is associated with the cooling system to remove flux deposits. The cooling system is i... | 11/26/1996 |
