Class 228/22 - Including wiper

Subclass of Class 228 - Metal fusion bonding
Definition: Device where force applying means engages said material,
No. of patents: 24
Last issue date: 10/26/2010

Number	Title	Issue Date
7819300	Paste transfer device and electronic component mounting apparatus In a flux transfer unit to be used in an electronic component mounting apparatus for transferring flux to an electronic component picked up from a component feed unit and then mounting the electronic component onto a board, a blade holding head which has a first bla...	10/26/2010
7347348	Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece Stenciling machines and methods for forming solder balls on microelectronic workpieces are disclosed herein. In one embodiment, a method for depositing and reflowing solder paste on a microelectronic workpiece having a plurality of dies includes positioning a stenci...	03/25/2008
7243834	Metal mask and method of printing lead-free solder paste using same A lead-free solder paste printing method is practiced with use of a metal mask of the invention by placing the metal mask 1 on a circuit board 2 having an electrode 21 formed in a predetermined pattern to join an end portion of a lead member ...	07/17/2007
7213331	Method for forming stencil A method of forming a stencil for the manufacture of semiconductor devices includes defining a plurality of slightly spaced segmental annular openings in a stencil plate. The spacing between the segmental annular openings define spokes extending from a central porti...	05/08/2007
7112889	Semiconductor device having an alignment mark formed by the same material with a metal post A semiconductor device has an alignment mark which can be recognized by a conventional wafer prober. A redistribution layer connects electrodes of the semiconductor device to electrode pads located in predetermined positions of the redistribution layer. Metal posts ...	09/26/2006
7104434	Screen printing squeegee for applying solder paste Apparatus and methods for applying solder paste to circuits, such as integrated circuits, are disclosed. The apparatus and methods comprise a squeegee blade having a pair of elongated face sides spaced apart by a selected thickness and a corresponding pair of elonga...	09/12/2006
7059005	Polish cleaning apparatus and method in manufacture of HGA A method and apparatus for cleaning the slider air bearing surface of a head gimbal assembly is disclosed. A plurality of carriers may position and hold a plurality of head gimbal assemblies to be polished. A cloth strip may be rubbed against the slider air surface....	06/13/2006
7048172	Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and the leveling squeegee to approach the pan surface of a transfer unit on...	05/23/2006
7033842	Electronic component mounting apparatus and electronic component mounting method The present invention provides an electronic component mounting apparatus, wherein a high speed operation can be provided by simplifying the structure of a mounting head and wherein the working efficiency can be improved by eliminating the use of the mounting head f...	04/25/2006
6976616	Circuit board transferring apparatus and method and solder ball mounting method By photographing pad forming faces of CSPs 400 to recognize a pad arrangement through image processing so as to transfer and position the CSPs 400 in accordance with the recognition result of the pad arrangement, even if pads 401 are formed in a...	12/20/2005
6957759	Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and the leveling squeegee to approach the pan surface of a transfer unit on...	10/25/2005
6921505	Hole filling using an etched hole-fill stand-off An assembly is disclosed that includes an etched hole-fill standoff; a tooling plate contacting the etched hole-fill stand-off, the stand-off and tooling plate being aligned to each other; a device having holes to be filled removably contacting the stand-off, the st...	07/26/2005
6840425	Scavenging system A system comprising a scavenging blade, a printed wiring board receiving portion, and a movement mechanism adapted to move the scavenging blade and printed wiring board receiving portion relative to each other, and to a method of removing excess fill material compri...	01/11/2005
6789720	Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and the leveling squeegee to approach the pan surface of a transfer unit on...	09/14/2004
6705505	Paste providing method, soldering method and apparatus and system therefor A soldering system which reduces the numbers of steps for paste supply and soldering onto a printed circuit board. A printed circuit board has through holes through which a lead of each provided part is to be inserted. A printing mask is matched with the through hol...	03/16/2004
6659328	Method and apparatus for deposition of solder paste for surface mount components on a printed wiring board A method and apparatus for depositing solder paste on a printed wiring board has a stencil with a pattern of multiple apertures. The pattern aligns with a through-hole in the printed wiring board when the stencil is in physical contact with the printed wi...	12/09/2003
6638363	Method of cleaning solder paste A cleaning apparatus for cleaning solder paste off the bottom side of a printed circuit board stencil includes a container of cleaning solution therein and a blade holder that is movable between a wiping position and the container of cleaning solution. A ...	10/28/2003
6491204	Stencil wiping device A cleaning apparatus for cleaning solder paste off the bottom side of a printed circuit board stencil includes a container of cleaning solution therein and a blade holder that is movable between a wiping position and the container of cleaning solution. A ...	12/10/2002
6227434	Reworking of a ball grid array module A method for reworking a Ball Grid Array electronic module by removing the solder balls from the substrate surface after one or more of the connections have been detected to be damaged. The module is immersed in a water soluble oil bath and heated to the ...	05/08/2001
6129256	Reflow furnace for an electronic assembly The invention provides a reflow furnace for an electronic assembly. The electronic assembly comprises a printed circuit board and a device on the printed circuit board. The printed circuit board has solder at a first area near the device and a metallic su...	10/10/2000
6126059	Captured-cell solder printing and reflow methods and apparatuses Disclosed are methods and apparatuses for forming solder bumps on integrated circuit chips (and other similar circuitized units) and apparatuses. A screening stencil is laid over the surface of the substrate and solder paste material is deposited into the...	10/03/2000
6112975	Method for attaching spherical and/or non-spherical contacts to a substrate The method is directed to attaching spherical and/or non-spherical contacts to a substrate having mounting pads arranged in a predetermined array. The method includes the steps of positioning the substrate over a fixture, and positioning a stencil over th...	09/05/2000
5156317	Apparatus for solder joining metal tapes with improved cover An apparatus for solder joining metal tapes to form laminated metal tapes comprises a channel means having a base, and sidewall means extending therefrom to a cover extending over the sidewall means. The sidewall means define converging channels having an...	10/20/1992
4606495	Uniform braze application process A method of forming thin, uniform braze joints is effected through the use of curtain coating. Braze powder is admixed with a liquid polymeric binder to form a slurry. The slurry is forced through the slots in a curtain coating head and deposited on at le...	08/19/1986

PatentStorm

Quotables

PatentStorm News

Class 228/22 - Including wiper