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A self defense weapon formed as a memo pad and which is easily held by a person's fingers, therefore making it possible to provide protection from a mugger and also to quickly and easily write a record or a message without failure of missing or forgetting significant information under a stressful situation.
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| Number | Title | Issue Date |
| 5176309 | Method of manufacturing circuit board According to this invention, there is provided a method of manufacturing a highly reliable circuit board in which a copper member is strongly, directly bonded to a substrate made of an aluminum nitride sintered body, thereby obtaining high peel strength. ... | 01/05/1993 |
| 5156325 | Vapor reflow type soldering method and apparatus therefor In case of suspending an apparatus upon the completion of soldering operation, from not smaller than 50% to less than 95% of a thermomedium in a reflow section is transferred to a filtering tank and the remaining thermomedium is made to pass through a wat... | 10/20/1992 |
| 5152453 | Laminar barrier inerting for leading and/or trailing shield in welding application The present invention relates to processes and apparatus for welding or joining metal parts which comprise moving a welding torch in a direction along a joint between said parts, causing a molten pool of metal with said welding torch along the joint and d... | 10/06/1992 |
| 5145100 | Soldering apparatus A soldering apparatus is disclosed which comprises a conveyor for moving print circuit boards along a predetermined path, an inert gas-filling chamber provided with a solder tank wherein the print circuit board is soldered in the inert gas atmosphere, pri... | 09/08/1992 |
| 5141147 | Reflow soldering method and the apparatus thereof A reflow soldering method and the apparatus thereof is described for soldering a base board having electronic elements located thereon by an inert gas circulated through heater means in a plurality of chambers while the base board is transported through a... | 08/25/1992 |
| 5139193 | Fluxless resoldering system and fluxless soldering process A fluxless reflow soldering processing and system having a reactive inert gas control arrangement coupled to a conventional reflow soldering head for enabling solder to wet metallic surfaces for joining purposes. The gas control arrangement includes a set... | 08/18/1992 |
| 5125556 | Inerted IR soldering system An infrared soldering machine has an inert gas atmosphere to prevent oxidation of the solder. Heaters positioned within the machine housing above a conveyor have through apertures and fans direct inert gas down through the heaters onto the conveyor. The f... | 06/30/1992 |
| 5121875 | Wave soldering in a protective atmosphere enclosure over a solder pot A short hood for enclosing and providing a protective atmosphere over not more than the solder pot of a machine for wave soldering printed circuit boards. Other operative areas of the machine are exposed to air. The entrance and exit openings to the hood ... | 06/16/1992 |
| 5121874 | Shield gas wave soldering A wave soldering apparatus and process occurs in an atomsphere which substantially excludes oxygen. By providing a gas blanket over the solder, reduction in dross occurs and improved soldering results avoiding the necessity of removing flux residues. Gas ... | 06/16/1992 |
| 5115964 | Method for bonding thin film electronic device A method of forming electrical connections between a flexible film carrier and an electronic device (e.g., semiconductor chip). The method comprises the steps of aligning the film carrier relative to the device having a plurality of solder mounds located ... | 05/26/1992 |
| 5100043 | Purge gas unit with bladders A purge gas unit establishes an enclosed zone for purge gas within tubes or pipes having portions which are to be joined by welding. The purge gas unit includes a first bladder to be positioned on one side of the welding location and a second bladder posi... | 03/31/1992 |
| 5090651 | Gas curtain additives and zoned tunnel for soldering A tunnel enclosure has a fluid barrier curtain at an entry and an exit and provides an apparatus for soldering an element. The fluid barrier curtains permit an additive, such as a soldering aid or the like to be included with the fluid at the curtain. Mor... | 02/25/1992 |
| 5090608 | Resilient lineup clamp A lineup clamp (10) is disclosed which is particularly suitable for clamping to smaller diameter pipe sections with their ends abutting for welding. Pipes less than twelve inches in diameter can be clamped by the clamp (10). The clamp includes a first res... | 02/25/1992 |
| 5076487 | Process for reflow soldering A method of joining components to a substrate by reflow soldering with non-rosin-based flux containing solder is disclosed comprising heating the solder in the presence of the components in a low oxidizing atmosphere.... | 12/31/1991 |
| 5071058 | Process for joining/coating using an atmosphere having a controlled oxidation capability This invention relates to a method of conducting a joining/coating operation which provides good wetting of metal-comprising substrate surfaces by metal-comprising filler/coating materials while reducing the rate of metal oxide formation. The joining/coat... | 12/10/1991 |
| 5069380 | Inerted IR soldering system An infrared soldering machine has an inert gas atmosphere to prevent oxidation of the solder. Heaters positioned within the machine housing above a conveyor has through apertures and fans direct inert gas down through the heaters onto the conveyor. The fo... | 12/03/1991 |
| 5065932 | Solder placement nozzle with inert cover gas and inert gas bleed A nozzle assembly is shown for depositing solder onto a series of conductive surfaces such as the mounting pads of a surface mount integrated circuit board. The nozzle assembly includes a nozzle head which has an interior bore for receiving an elongate he... | 11/19/1991 |
| 5031821 | Semiconductor integrated circuit device, method for producing or assembling same, and producing or assembling apparatus for use in the method The present invention is characterized in that, in a ball wedge bonding using a fine bonding wire precoated with a thin insulating layer, ultrasonic vibration is applied to a capillary to effect the delivery of the wire smoothly during movement of the cap... | 07/16/1991 |
| 5009360 | Metal-to-metal bonding method and resulting structure A method and resulting structure is disclosed in which a metal-to-metal bond is formed by heating the surfaces to be bonded in an oxidizing ambient atmosphere until the desired bond is achieved. Heating takes place at 700° C.-1200° C. and bonding may be... | 04/23/1991 |
| 4979664 | Method for manufacturing a soldered article Disclosed is a method for making a solder joint without flux, in the presence of an inert gas. A pair of articles having solder-coated surfaces are heated to melt the solder, pressure is applied to the joint region, and the articles are cooled. During the... | 12/25/1990 |
| 4974769 | Method of joining composite structures An method and apparatus for integrally joining at least two composite structures using a bonding material which will melt under heating, with a method comprising the steps of heat-melting the bonding material interposed between the composite structures di... | 12/04/1990 |
| 4969592 | Method for uniting workpieces of silicon-infiltrated silicon carbide with large dimensions in a materially bonded manner and apparatus for performing the method A method and apparatus for uniting workpieces of silicon-infiltrated silicon carbide with large dimensions includes surrounding each of two silicon-infiltrated silicon carbide workpieces with at least one tightly closing shell in the vicinity of a junctio... | 11/13/1990 |
| 4938834 | Apparatus for preventing the oxidation of lead frames during bonding An apparatus for preventing the oxidation of a lead frame in a bonding system. The apparatus has a first introducing device for introducing a first atmospheric gas toward a bonding portion of the lead frame and a second introducing device for introducing ... | 07/03/1990 |
| 4937006 | Method and apparatus for fluxless solder bonding Method and apparatus for fluxlessly solder bonding a solder mound to a solder wettable surface. A heated gas, preferably a reducing or non-reactive gas, is directed at a solid solder mound. Gas is heated to a temperature sufficient to melt solder mound. T... | 06/26/1990 |
| 4905887 | Process for soldering aluminum containing workpieces Processes and composition for soldering aluminum-containing workpieces wherein the solder contains components which lower the surface tension and the viscosity of the molten solder, and which lower the interfacial tension between the solder and the alumin... | 03/06/1990 |
| 4898318 | Copper radiator for motor cars excellent in corrosion resistance and method of manufacturing the same An improved copper radiator for motor cars comprising a plurality of tubes adapted for the flow of a heat-exchanging medium therethrough, fins bonded directly with solder to said tubes to form a copper core and wherein said core is bonded with solder to a... | 02/06/1990 |
| 4898319 | Ambient air exclusion system for brazing ovens A brazing oven includes an arrangement employing a gas curtain or barrier to cover the port or opening of the oven whenever the door is opened. The curtain or barrier is formed by a region of flowing conditioned air directed across the opening. The flowin... | 02/06/1990 |
| 4855007 | Automatic die attach workholder A workholder having top and bottom frame portions defining a cavity through which a leadframe passes is described. Dew point, moisture, ports are placed in one of the top or bottom frame portions to allow continuous, real time monitoring of the moisture l... | 08/08/1989 |
| 4842185 | Method of brazing a heat exchanger using a reaction flux A method of producing a heat exchanger comprising abutting a tube made of an aluminum material and fins made of an aluminum material, applying to the resulting abutments a flux containing zinc halide, and thereafter conducting a reaction soldering in an i... | 06/27/1989 |
| 4838477 | Method of welding flanged pipe sections and apparatus therefor A method for joining together a pair of flanged metal pipe sections at their respective flanges. The sections have heat sensitive material juxtaposed to, in contact with or bonded to the interior thereof. The method includes the step of providing coolant ... | 06/13/1989 |
| 4836434 | Method and apparatus for airtightly packaging semiconductor package An airtight packaging apparatus for covering with a cap a multichip module having LSI chips mounted on a ceramic substrate and for sealing the cap and substrate by means of solder includes a receptacle for accommodating the multichip module, valves for su... | 06/06/1989 |
| 4832249 | Method and arrangement for reflow soldering and reflow unsoldering of circuit boards Method for reflow soldering respectively desoldering of circuit boards by using infrared radiation from radiator groups in a furnace. The circuit boards are introduced into the furnace on a timed belt or work piece carrier and maintained motionless during... | 05/23/1989 |
| 4830265 | Method for diffusion of metals and alloys using high energy source Diffusion bonding of aluminum alloy objects of different sizes and shapes are greatly improved when the surface of the object is exposed to a high energy source which causes a heat treatment or melting and rapid quenching or solidification at the surface.... | 05/16/1989 |
| 4821947 | Fluxless application of a metal-comprising coating This invention relates to an improved process for application of a metal-comprising coating to a metal-comprising surface without using a flux. The metal-comprising surface must be wettable by or become wettable upon contact with a bath of the metal-compr... | 04/18/1989 |
| 4807796 | Method of soldering aluminum-oxide ceramic components In a method of dust-free and vacuum-tight interconnecting of ceramic aluminum-oxide components in a protective gas atmosphere the components are interconnected by heating and the use of a solder. Soldering the components is effected in a protective gas co... | 02/28/1989 |
| 4779790 | Job oriented method and apparatus utilizing molten solder for procedures such as soldering and desoldering Apparatus for performing an operation with molten solder, such as soldering or desoldering a component mounted on a substrate such as a PCB including an enclosed reservoir, the reservoir including a contained space above the molten solder; a hollow nozzle... | 10/25/1988 |
| 4768700 | Diffusion bonding method A turbine blade spar wall surrounds a coolant plenum of the blade and is cast with an intermediate thickness exceeding its final or design thickness. The outer surface of the spar wall is machined to form a plurality of incomplete holes extending to botto... | 09/06/1988 |
| 4759486 | Controlled environment chamber for use in cladding a nonaluminum core with aluminum A method of cladding a nonaluminum core with at least one aluminum cladding strip by preheating both the core rod and the strip with the former being preheated to about 1000° F. to 1300° F. and the latter being heated to about 600° F. to 1000° F. Clea... | 07/26/1988 |
| 4757935 | Method and device for flushing the inside surface of a pipe in the vicinity of a welded seam Method for flushing the inside surface of a pipe in the vicinity of a welded seam, where a flushing gas is fed to the pipe with laminar flow, characterized by the feature that the laminar flow in the pipe is transformed into a turbulent flow in front of t... | 07/19/1988 |
| 4754911 | Method of manufacturing a large diameter internally clad tubular product A method of manufacturing an internally clad tubular product employing a tubular host such as steel, including the steps of plating the internal surface of the tubular host with a low melting point bonding metal alloy, inserting a tubular cladding member,... | 07/05/1988 |
