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| Number | Title | Issue Date |
| 8070049 | Device and method for wave soldering The instant invention relates to a device for wave soldering workpieces, encompassing means for moving the workpiece, which is to be soldered, along a specific path across at least one solder wave generated above a solder reservoir, with a protective and/or active g... | 12/06/2011 |
| 7428979 | Process for soldering an electronic component on an electronic card, process for repairing the card and installation for using the process A process for soldering an electronic component onto a support which includes at least one heat drain for the component. The method uses a solder paste which incorporates a stripping flux activated at a first temperature, and a solder alloy melted at a second temper... | 09/30/2008 |
| 7413109 | Joining of advanced materials by superplastic deformation A method for utilizing superplastic deformation with or without a novel joint compound that leads to the joining of advanced ceramic materials, intermetallics, and cermets. A joint formed by this approach is as strong as or stronger than the materials joined. The me... | 08/19/2008 |
| 7412766 | Method of fabricating coil-embedded inductor A method of fabricating a coil-embedded inductor provides steps for obtaining uniform density of coil-embedded inductor. The cavity of a first die is filled with dust before being flipped, and then filled with dust a second time. The dust in the cavity is pressed on... | 08/19/2008 |
| 7380699 | Method and apparatus for vapour phase soldering The present invention concerns a method and an apparatus for performing soldering of items that are applied a soldering agent, where the soldering apparatus includes at least one soldering zone, where the soldering zone include means for generating vapor, the appara... | 06/03/2008 |
| 7377418 | Method of brazing aluminum products and furnace therefor When aluminium products are preheated in a preheating furnace up to about 500° C. before they are brazed with a flux in a heating furnace, a nitrogen atmosphere in the preheating furnace is made convectional by fans for improving heating efficiencies and also for h... | 05/27/2008 |
| 7358175 | Serial thermal processor arrangement A serial thermal processing arrangement for treating a wafer of semiconductor material, the steps including: loading the wafer into a chamber at an initial station and purging the chamber with nitrogen gas; introducing formic acid vapor and nitrogen and heating the ... | 04/15/2008 |
| 7348523 | Method of induction weld forming with shear displacement step A shear-assisted solid state welding method for joining of metal parts, involves a first step of heating opposing surfaces in a non-passivating environment to a temperature in the hot working temperature range of the metal. A second step involves bringing the opposi... | 03/25/2008 |
| 7347354 | Metallic solder thermal interface material layer and application of the same A method of bonding a thermal interface layer to a heat dissipating member and the resulting device are described. The method may involve plating a bonding surface of the heat dissipating member, and bonding a metallic solder onto the plating under vacuum or inert c... | 03/25/2008 |
| 7326305 | System and method for decapsulating an encapsulated object A system and method for the selective etching or removal of encapsulating material from an encapsulated object, such as a semiconductor, includes depositing an encapsulant-removal agent, such as a solvent or acid, onto the surface of the object. A flow of heated gas... | 02/05/2008 |
| 7306133 | System for fabricating an integrated circuit package on a printed circuit board A system is provided for reflow soldering a part that includes: replacing air around an unsoldered part with a first inert gas; removing the first inert gas to form a vacuum around the unsoldered part; vacuum reflow soldering the unsoldered part to form a reflow-sol... | 12/11/2007 |
| 7303109 | Stud bumping apparatus The invention provides an apparatus and a method for forming conductive bumps on a plurality of semiconductor devices with an oxidizable material. The apparatus comprises a bump forming device, a chamber system adapted to house the semiconductor devices and a gas su... | 12/04/2007 |
| 7288736 | Connection between two components A method of connecting two components includes providing an assembly including a first component and a second component, optically sensing a connection region between the first component and the second component to produce an image, defining a substantially elliptic... | 10/30/2007 |
| 7255931 | Aluminum/ceramic bonding substrate and method for producing same When an aluminum plate is bonded directly to a ceramic substrate by cooling and solidifying molten aluminum which is injected into a mold so as to contact the ceramic substrate arranged in the mold, an additive, such as a TiB alloy, Ca or Sr, for decreasing the grai... | 08/14/2007 |
| 7246736 | Supplying shielding gas A flexible articulate tubular device has a shank, a plurality of pivot rings, and a terminus with heat sensors and a fiber optic device. The flexible articulate tubular device is initially positioned, either manually or automatically, near a target weld path with th... | 07/24/2007 |
| 7241970 | Ternary gas mixture which can be used in the braze welding of galvanized parts A method of brazing galvanized metal parts such as those used for motor vehicle elements or container components. The parts are joined together to create a brazed joint by using at least one electric arc, a metal filler wire, and a gas shield. The gas shield contain... | 07/10/2007 |
| 7222774 | Electronic component mounting apparatus and electronic component mounting method In an electronic component mounting method in which electronic components are sucked/held by plural respective nozzles provided on a mounting head so as to be mounted on electronic component mounting portions of a board, such a mounting operation is sequentially car... | 05/29/2007 |
| 7220935 | Welding torch and shield A welding torch (10) for welding on a component has an electrode (12) within a nozzle (14) through which a flow of gas passes. A shield (20) defines an enclosure (22) around the nozzle (14). Means are provided for supplying ... | 05/22/2007 |
| 7199325 | Method for interconnecting tubulars by forge welding A method for interconnecting tubulars by forge welding involves arranging the tubular ends that are to be interconnected at a distance, up to a few millimeters from each other in a shield gas chamber, into which a reducing non-explosive flushing fluid mixture (e.g. ... | 04/03/2007 |
| 7182793 | System for reducing oxidation of electronic devices The invention provides a system for reducing oxidation of a semiconductor device when it is heated, for example during wire bonding. A holding device is provided for securing the semiconductor device to a platform. The holding device includes an opening for providin... | 02/27/2007 |
| 7181821 | Joining expandable tubulars A method of joining expandable tubulars includes joining the tubulars by forge welding and flushing a reducing flushing gas around the heated tubular ends during at least part of the forge welding operation such that oxides are removed from the forge welded tubular ... | 02/27/2007 |
| 7165314 | Method for manufacturing a magnetic head arm assembly (HAA) A system and method for an improved magnetic head arm assembly (HAA) is disclosed. The HAA includes three principal components, a head gimbal assembly (HGA), a flexible printed circuit (FPC) assembly, and an actuator coil assembly. The design allows for HAA rigidity... | 01/23/2007 |
| 7114644 | Joining method by Au-Sn brazing material The present invention provides a method of joining members to be joined by use of an Au—Sn brazing material, in which joining is performed by adjusting the composition and thickness of the Au—Sn brazing material so that the Sn content of the joint after joining ... | 10/03/2006 |
| 7112358 | Self-adhesive purge dam for retaining purge gas around a weld zone A self-adhesive purge dam for retaining purge gas around a weld zone includes a base configured to substantially obstruct an air passage leading to the weld zone and an adhesive skirt extending from the base and configured to engage portions of the air passage. An a... | 09/26/2006 |
| 7098396 | Method and apparatus for making a lid with an optically transmissive window A metal plate (126) has a plurality of openings (127) extending through it, and is cleaned using a wet hydrogen process (157). Glass windows (106) are then placed in the openings, and are each fused to the metal plate by heat (231)... | 08/29/2006 |
| 7091733 | Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method A reliability evaluation test apparatus of this invention includes a wafer storage section which stores a wafer in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor are totally in electrical contact with each ... | 08/15/2006 |
| 7077306 | Ceramic armor and method of making by encapsulation in a hot pressed three layer metal assembly A ceramic armor is disclosed in several embodiments. In a first embodiment, a metal base plate has a metal frame assembled on it having a central opening into which the ceramic material is placed. A cover plate is placed over the frame to enclose the ceramic materia... | 07/18/2006 |
| 7079370 | Apparatus and method for removal of surface oxides via fluxless technique electron attachment and remote ion generation The present invention provides a method and apparatus for the dry fluxing of at least one component and/or solder surface via electron attachment. In one embodiment, there is provided a method for removing oxides from the surface of a component comprising: providing... | 07/18/2006 |
| 7073703 | Aluminum/ceramic bonding substrate and method for producing same An aluminum plate 12 having a purity of 99.5% or more, preferably 99.9% or more, is caused to contact at least one side of a ceramic substrate 10 of aluminum nitride or alumina to be heated at a temperature of 620 to 650° C. in an inert gas to bond th... | 07/11/2006 |
| 7070833 | Method for chemical vapor deposition of silicon on to substrates for use in corrosive and vacuum environments A method of passivating the surface of a substrate to protect the surface against corrosion, the surface effects on a vacuum environment, or both. The substrate surface is placed in a treatment environment and is first dehydrated and then the environment is evacuate... | 07/04/2006 |
| 7060533 | Method for manufacturing diode subassemblies used in rectifier assemblies of engine driven generators A method of manufacturing a diode assembly used in rectifier assemblies of engine-driven generators is disclosed. The diode assemblies have diode cups, semiconductor diode dies and diode leads fitted therein. The diode subassemblies are reflow soldered, such that th... | 06/13/2006 |
| 7051424 | Method and apparatus for electrically and physically coupling a micro-actuator and slider to a hard drive arm suspension for component replacement after detachment from the suspension A system and method are disclosed for coupling a replacement micro-actuator to a drive arm suspension after a micro-actuator, such as a defective micro-actuator, has been detached from the suspension. ... | 05/30/2006 |
| 7048173 | Wave soldering method using lead-free solder, apparatus therefor, and wave-soldered assembly The present invention relates to a wave soldering method and a wave soldering apparatus using lead-free solder comprising a wave soldering step in which the lower side of a substrate with leads of component parts inserted in through-holes formed in the substrate fro... | 05/23/2006 |
| 7040526 | Electronic parts assembling and testing method, and electronic circuit baseboard manufactured by the method A method for assembling and testing an electronic circuit baseboard includes at least a step of soldering at least one electronic part to an electronic circuit baseboard using Pb excluded solder. One of erroneous wiring, erroneous mounting, malfunction, and defectiv... | 05/09/2006 |
| 7036711 | PROCESS FOR THE MANUFACTURE OF METAL-CERAMIC COMPOUND MATERIAL IN PARTICULAR METAL-CERAMIC SUBSTRATES AND METAL-CERAMIC COMPOUND MATERIAL ESPECIALLY METAL-CERAMIC SUBSTRATE MANUFACTURED ACCORDING TO THIS PROCESS In a process for the manufacture of metal-ceramic compound material, especially metal-ceramic substrates, bonding compounds in the form of a plate-shaped ceramic substrate and an oxidized metal foil are bonded together by means of heating to a processing temperature... | 05/02/2006 |
| 7036572 | Oil cooler structure of an automatic transmission The oil cooler structure of an automatic transmission includes an upper tube plate reinforcement and a lower tube plate reinforcement. Each tube plate reinforcement is arranged in a layer in an oil passage formed between a plane of an upper tube plate and a plane of... | 05/02/2006 |
| 7032803 | Jet nozzle structure for soldering apparatus A jet nozzle structure for a soldering apparatus for soldering a local area of a substrate on which electric components are placed improves the soldering performance. The soldering apparatus includes a tubular body formed on a soldering bath filled with molten solde... | 04/25/2006 |
| 7026569 | Welding machine The inventive system and method allows the control of shielding gas in an electric welding apparatus having automatic wire feed by controlling the flow rate of the shielding gas as a function of the wire feeding speed and/or the welding current obtained. A control c... | 04/11/2006 |
| 7021521 | Bump connection and method and apparatus for forming said connection A bump connection is formed by stacking at least two metallic balls of different kinds of metals on a conductor of an electronic component such as a semiconductor device. The bump connection is obtained by forming the metallic balls using metallic wires. An apparatu... | 04/04/2006 |
| 6994919 | Brazing product and method of manufacturing a brazing product The invention relates to a brazing sheet product including a core sheet, on at least one side of the core sheet a clad layer of an aluminum alloy including silicon in an amount in the range of 4 to 14% by weight, and further including on at least one outersurface of... | 02/07/2006 |
