Did You Know...
...that Robert Adler has the dubious distinction of being the Father of the Couch Potato? Back in 1955 Adler was employed by what was then Zenith Radio Corp., where he was charged to invent something that would allow viewers to turn down the TV volume without leaving their chairs. After a series of flops (such as a wired contraption that people tripped over), Adler hit on the idea of using sound waves. Thus the Remote Control was born...
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| Number | Title | Issue Date |
| 7318844 | Laser-irradiated metallized electroceramic The manufacturing method for an electroceramic component (1), for example a varistor (1), comprises a laser irradiation of a part (5; 6) of the surface of an electroceramic body (2) before a metallization (3; 4) is applied to the p... | 01/15/2008 |
| 7282425 | Structure and method of integrating compound and elemental semiconductors for high-performance CMOS A method for fabricating a semiconductor substrate includes epitaxially growing an elemental semiconductor layer on a compound semiconductor substrate. An insulating layer is deposited on top of the elemental semiconductor layer, so as to form a first substrate. The... | 10/16/2007 |
| 7249411 | Methods for mounting surface-mounted electrical components Methods for mounting electrical components on a substrate and securely retaining the components are described. The methods include altering solder paste compositions, interposed between component retentive pins and retentive through holes, during a reflow process. E... | 07/31/2007 |
| 7215021 | Electronic device The conductor wire surface for constituting a circuit formed by print or junction on a substrate formed from a composite member of ceramics, resin, and an inorganic member and from a resin member is coated with glass, resin, solder, or silver paste, thus the corrosi... | 05/08/2007 |
| 7199978 | Method and apparatus for connecting a micro-actuator to driver arm suspension A system and method for connecting an actuator to a suspension element is disclosed. The actuator is electrically coupled using a silver paste. The silver paste is further covered by a coating application to provide structural support. A step, attached to either the... | 04/03/2007 |
| 7175919 | Multilayered metal laminate and process for producing the same An adhesive-free multilayered metal laminate having a given thickness which is obtained by bonding a metal sheet having a thin metal film on a surface thereof to a metal foil without using an adhesive; and a process for continuously producing the laminate. The proce... | 02/13/2007 |
| 7163121 | High temperature isostatic pressure bonding of hollow beryllium pressure vessels using a bonding flange A bond joint and process of bonding metal parts to one another to form seamless, hollow metal articles, particularly made from beryllium. Tooling is assembled to the parts, prior to hot pressing, to cause pressure to be applied to flanges that extend peripherally fr... | 01/16/2007 |
| 7143928 | Flux and method for joining dissimiliar metals Disclosed herein is a method for joining dissimilar metals without a need for a separate welding process. The method comprises applying a flux on a metal to be joined, inserting the metal into a mold, and injecting a molten metal into the mold. Thus, the base metal ... | 12/05/2006 |
| 7114644 | Joining method by Au-Sn brazing material The present invention provides a method of joining members to be joined by use of an Au—Sn brazing material, in which joining is performed by adjusting the composition and thickness of the Au—Sn brazing material so that the Sn content of the joint after joining ... | 10/03/2006 |
| 7108168 | Honeycomb structure and method for applying adhesive and brazing material to the structure A method for gluing and brazing a honeycomb structure includes at least one partially structured foil with a pitch and a wave height. The method includes the steps of choosing a mean brazing material diameter of a powder brazing material, said diameter being 15% sma... | 09/19/2006 |
| 7084366 | Method for controlling brazing A method for making a braze joint across a discontinuity in a work piece using alternating current. A filler metal is pre-placed at a location sufficiently close to the discontinuity such that, when an alternating current is applied across a work piece to heat the w... | 08/01/2006 |
| 7077388 | Bubbler for substrate processing A vaporization chamber for a substrate processing system includes a main body, a cover member and a transition member. The main body is made of aluminum and defines a first inner surface, which defines, at least in part, a cavity. The cover member is also made of al... | 07/18/2006 |
| 7055732 | Semiconductor processing apparatus including plasma-resistant, welded aluminum structures We have discovered a method of producing a complex-shaped aluminum alloy article, where welding has been employed to form the article, where an anodized aluminum coating is produced over a surface of the article including the weld joint, and where the anodized alumi... | 06/06/2006 |
| 7040804 | Method for measuring diffusion coefficient in conductive melts, and apparatus for measuring the same Two conductive solid materials with their respective different compositions are joined in parallel with a gravity direction thereof, and then, heated and melted under static magnetic field orthogonal to the gravity direction to form two conductive melts with their r... | 05/09/2006 |
| 7021522 | Bonding methods for microchannel plates Mating faces of a microchannel plate (MCP) (50) and a multi-layer ceramic body (80) unit are deposited with a thin film having protuberances (84) using a suitable metal selected for optimum diffusion at a desired temperatures and pressure. The m... | 04/04/2006 |
| 7004374 | Process of making a shaped product A process of making a shaped product consisting of aluminium or an aluminium alloy comprising the steps of producing an intermediate object by extrusion or rolling and having at least one flat surface, coating the at least one flat surface with a brazing flux retain... | 02/28/2006 |
| 7001671 | Kinetic sprayed electrical contacts on conductive substrates The present invention is directed to electrical contacts that comprise spaced electrically conductive particles embedded and bonded into the surface of conductors in which the particles have been kinetically sprayed onto the conductors with sufficient energy to form... | 02/21/2006 |
| 6991856 | Methods of making and using freestanding reactive multilayer foils Reactive foils and their uses are provided as localized heat sources useful, for example, in ignition, joining and propulsion. An improved reactive foil is preferably a freestanding multilayered foil structure made up of alternating layers selected from materials th... | 01/31/2006 |
| 6959853 | Fluxless brazing method and method for manufacturing layered material systems for fluxless brazing A brazing product for fluxless brazing comprises an aluminum or aluminum alloy substrate; a layer of an aluminum eutectic-forming layer applied to the substrate, and a braze-promoting layer comprising one or more metals from the group comprising nickel, cobalt and i... | 11/01/2005 |
| 6955288 | Metallurgically bonded layered article having a curved surface A layered article having a curved surface made of a supporting metal metallurgically bonded to a supported metal. ... | 10/18/2005 |
| 6955286 | Use of silver-copper-palladium brazing alloys A compound arrangement comprising a first component of metal being brazed to a second component of metal. The first component has an external cylindrical surface touching an cylindrical internal surface of the second component. The second component clasps the first ... | 10/18/2005 |
| 6953146 | Low-temperature flux for soldering nickel-titanium alloys and other metals A low-temperature flux is described which dissolves the refractory oxide layer from a shape memory alloy containing both nickel and titanium, such as Nitinol, and from other metals like stainless steel. The flux is particularly useful for preparing shape memory allo... | 10/11/2005 |
| 6945448 | Method for attaching a porous metal layer to a metal substrate A method for attaching a porous metal layer to a dense metal substrate, wherein the method is particularly useful in forming orthopedic implants such as femoral knee components or acetabular cups. The method, in one embodiment thereof, comprises providing a structur... | 09/20/2005 |
| 6935555 | Method of brazing and article made therefrom A method of brazing stainless steel components to form a complex shape such as an impeller. The method includes the steps of providing the stainless steel components shaped and formed from a selected stainless steel alloy; providing a brazing alloy having a selected... | 08/30/2005 |
| 6929169 | Solder joint structure and method for soldering electronic components A method for soldering an electronic component is provided. A first solder land containing copper and a second solder land are formed on a surface of a circuit board. A first solder section composed of a Sn—Ag—Cu solder material is formed on each of the first an... | 08/16/2005 |
| 6886735 | Method of thermosonic wire bonding process for copper connection in a chip A method of thermosonic wire bonding process for copper connection in a chip comprises controllable time, controllable temperature, and controllable humidity in an artificial circumstance, which generates copper oxide film on a surface of copper chip. The thickness ... | 05/03/2005 |
| 6880746 | Fluorostannate-containing brazing or soldering fluxes and use thereof in brazing or soldering aluminum or aluminum alloys Fluxing agents comprising potassium fluorostannate and/or cesium fluorostannate which can be used for brazing or soldering components of aluminum or of an aluminum alloy, even by solderless brazing or soldering. Conventional fluxing agents or other fluorometallates,... | 04/19/2005 |
| 6875332 | Functional alloy plating using substitute bonding material for Pb and electronic component to be mounted to which the functional alloy plating is applied The present invention relates to a to-be-mounted electronic component to which functional alloy plating using a bonding material for mounting is applied with a substitute bonding material for solder (tin-lead alloy), and aims at providing alloy plating which has bee... | 04/05/2005 |
| 6874676 | Method and structure for welding an air-sensitive metal in air A method and structure for welding an air-sensitive metal, such as titanium, in an ambient environment containing air. The method (10) includes forming a weld (12) through a weld-through coating (14) applied to the weld face(s) (28) and h... | 04/05/2005 |
| 6843861 | Method for preventing the formation of secondary reaction zone in susceptible articles, and articles prepared by the method A coated nickel-base superalloy article, which is otherwise susceptible to the formation of a secondary reaction zone, is prepared by furnishing a nickel-base superalloy article substrate having thereon an initial aluminum-containing coating comprising an initial-co... | 01/18/2005 |
| 6840432 | Solder application technique A method of joining an end face of a first electric component to an end face of a second electric component includes applying a first metal layer to the end face of the first electric component to form a first metallized layer and applying a second metal layer to th... | 01/11/2005 |
| 6840430 | Board pieces, flexible wiring boards and processes for manufacturing flexible wiring boards A board piece 2 of the present invention comprises a non-thermoplastic resin film 11, a thermoplastic resin film 10 formed on the non-thermoplastic resin film 11 and a metal wiring 8 formed on the surface of the thermoplastic resin... | 01/11/2005 |
| 6814276 | Process for soldering and connecting structure A barrier metal layer is provided on at least one electrodes, wherein one electrode is formed on a substrate and another is connected to an electronic component, so as to coat a base material of the electrode. The base material is made of a material containing Cu. S... | 11/09/2004 |
| 6800150 | Manufacturing process for an element of a chemical device comprising a support part in metal and an anticorrosion metallic coating The aim of the present invention is a manufacturing process for assembly parts (101, 102, 111, 112) for the manufacture of elements of chemical devices (100), comprising the fixation of an anticorrosion metallic coating (31, 32) on an unprocesse... | 10/05/2004 |
| 6796482 | Phase separated system for fluxing A solder flux composition (19) is provided which comprises active ingredients and a carrier. The solder flux composition undergoes a phase separation during solder reflow to form at least a first phase (21) and a second phase (23), such that the... | 09/28/2004 |
| 6789723 | Welding process for Ti material and Cu material, and a backing plate for a sputtering target A welding process for welding a Cu material to a Ti material includes interposing a tertiary component between the Ti material and the Cu material. The tertiary component is of a type of metal that, with Cu, forms a compound which is liquified at a temperature below... | 09/14/2004 |
| 6786391 | Method of controlling solder deposition utilizing two fluxes and preform Method for controlling the deposition of solder on a base metal or substrate is disclosed. The method comprises applying an attaching flux and finishing flux to a substrate, placing a preform thereon and subjecting the same to reflow conditions. The finishing flux i... | 09/07/2004 |
| 6783867 | Member for semiconductor device using an aluminum nitride substrate material, and method of manufacturing the same A highly reliable member for a semiconductor device, in which a high melting point metallizing layer, which consists mainly of a high melting point metal such as W and/or Mo, and an intervening metal layer, which has a melting point of not greater than 1,000° C. an... | 08/31/2004 |
| 6760396 | Coated metal articles and method of making The method of protectively coating metallic uranium which comprises dipping the metallic uranium in a molten alloy comprising about 20-75% of copper and about 80-25% of tin, dipping the coated uranium promptly into molten tin, withdrawing it from the molten tin and ... | 07/06/2004 |
| 6749105 | Method and apparatus for securing a metallic substrate to a metallic housing A method for securing a metallic substrate (24) to a metallic housing (26). The method may include: firing a first solderable coating (64) to an edge (60) of the metallic substrate (24); firing a second solderable coating (64 | 06/15/2004 |
