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| Number | Title | Issue Date |
| 7380698 | Method of connecting module layers suitable for the production of microstructure modules and a microstructure module A method for joining microstructured component layers and a method for manufacturing microstructure component layers and the microstructure component layer is provided. At least one multifunctional barrier coating is applied to the joining surfaces of a base materia... | 06/03/2008 |
| 7340828 | Method for producing metal/ceramic bonding circuit board There is provided a method for producing a metal/ceramic bonding circuit board, which can form a fine pattern even if a circuit forming metal plate is thick and which can shorten the time required to carry out etching, when a molten metal is caused to contact to a c... | 03/11/2008 |
| 7276134 | Methods and systems for sealing liquid cooled stator bar end connections for a generator A method includes blasting the interior surfaces of the fitting to stator bar strand joint with CO2 pellets to remove loose copper oxide which otherwise would interfere with proper sealing between an epoxy and the copper surfaces of the joint. After clean... | 10/02/2007 |
| 7253512 | Organic dielectric electronic interconnect structures and method for making A method for making a multi-layer electronic structure. A layer of dielectric material having a top surface and a bottom surface is provided. A layer of electrically conducting material is provided on one of the top surface and the bottom surface of the dielectric l... | 08/07/2007 |
| 7208231 | Bonded metal components having uniform thermal conductivity characteristics and method of making same Cookware having improved uniform heat transfer over the entire cross section thereof, the cookware formed from a multi-layered composite metal having a layer of stainless steel roll bonded at or near the core of the composite. The stainless layer is roll bonded to l... | 04/24/2007 |
| 7201823 | High throughput plasma treatment system A method for the plasma treatment of parts. The method includes sending loading signals from an electronic control to a transfer mechanism and loading the parts from a position outside of the treatment chamber to a plurality of treatment positions within the treatme... | 04/10/2007 |
| 7175391 | Turbine blade A blade has an airfoil body having an internal cooling passageway network and a body tip pocket. At least one plate is secured within the body tip pocket and has inboard and outboard surfaces. A recess is in the outboard surface and an associated protrusion is on th... | 02/13/2007 |
| 7172431 | Electrical connector design and contact geometry and method of use thereof and methods of fabrication thereof A probe or an electrical connector comprises a substrate with a surface having a plurality of electrical contact locations. A shaped elongated electrical conductor has a first end coupled to one of the electrical contact locations and a second end thereof which proj... | 02/06/2007 |
| 7146990 | Process for repairing sulfidation damaged turbine components A process is provided for cleaning a surface of an internal cavity of a gas turbine component having sulfidation or sulfur bearing deposits comprising: inserting into the internal cavity a fluoride salt; and heating the fluoride salt and the component in an inert at... | 12/12/2006 |
| 7137194 | Apparatus and method for maintaining a dry atmosphere in a surface mount device placement machine The apparatus and method of the present invention relates use a dry atmosphere in the component storage portion of the surface mount device placement machine. The dry atmosphere provides the benefit of eliminating the baking process and other moisture management iss... | 11/21/2006 |
| 7103959 | Conduit for preventing oxidation of a electronic device An apparatus to prevent oxidation of an electronic device, such as a semiconductor substrate during a semiconductor packaging process, comprises a substantially-enclosed conduit having at least one movable support defining a path through which the electronic device ... | 09/12/2006 |
| 7093335 | Coated article and method for repairing a coated surface A method is provided for repairing a surface portion of an article including a metallic environmental resistant coating on a substrate. The coating includes a coating outer portion bonded with the substrate through a diffusion zone that includes at least one feature... | 08/22/2006 |
| 7079370 | Apparatus and method for removal of surface oxides via fluxless technique electron attachment and remote ion generation The present invention provides a method and apparatus for the dry fluxing of at least one component and/or solder surface via electron attachment. In one embodiment, there is provided a method for removing oxides from the surface of a component comprising: providing... | 07/18/2006 |
| 7074101 | Method for manufacturing plasma display panel A method of manufacturing a plasma display panel, whose glass substrate is not tinged and luminance is high, is provided, even when silver material is used. A layer including silver compounds, which include sulfur generated on a surface of an electrode by reacting o... | 07/11/2006 |
| 7048173 | Wave soldering method using lead-free solder, apparatus therefor, and wave-soldered assembly The present invention relates to a wave soldering method and a wave soldering apparatus using lead-free solder comprising a wave soldering step in which the lower side of a substrate with leads of component parts inserted in through-holes formed in the substrate fro... | 05/23/2006 |
| 7025248 | Method for manufacturing a titanium sheet and a shaped component consisting of the titanium sheet The invention relates to a roll-bonded titanium sheet (6), a shaped component manufactured therefrom (10) and a method for manufacturing the titanium sheet (6) and the shaped component (10). In order to achieve a high-temperature-resistan... | 04/11/2006 |
| 6996889 | Electronic part mounting apparatus and method An electronic part mounting apparatus includes a chamber for cleaning a substrate and an electronic part by plasma, a mounting mechanism for mounting the electronic part on the electronic part, and a conveying robot for conveying the substrate and the electronic par... | 02/14/2006 |
| 6972071 | High-speed symmetrical plasma treatment system A plasma treatment system (10) and related methods for rapidly treating a workpiece (56) with ions from a plasma having an ion density that is reproducibly uniform and symmetrical. The processing chamber (12) of the plasma treatment system (1... | 12/06/2005 |
| 6957762 | Vacuum brazing method for aluminum-based material A vacuum brazing method is disclosed for joining aluminum stock materials to each other. The typical cladding material utilized includes aluminum and a melting point lowering agent such as silicon. In addition, the cladding material typically includes magnesium to p... | 10/25/2005 |
| 6953146 | Low-temperature flux for soldering nickel-titanium alloys and other metals A low-temperature flux is described which dissolves the refractory oxide layer from a shape memory alloy containing both nickel and titanium, such as Nitinol, and from other metals like stainless steel. The flux is particularly useful for preparing shape memory allo... | 10/11/2005 |
| 6926971 | Bonded metal components having uniform thermal conductivity characteristics and method of making same Cookware having improved uniform heat transfer over the entire cross section thereof, the cookware formed from a multi-layered composite metal having a layer of titanium roll bonded at or near the core of the composite. The titanium layer is roll bonded to layers of... | 08/09/2005 |
| 6926190 | Integrated circuit assemblies and assembly methods A method for assembling chips onto substrates includes applying a flux-free, no-flow underfill material. In an embodiment, the method includes removing oxide from interconnects without the use of a flux and applying a flux-free, no-flow underfill. In an embodiment, ... | 08/09/2005 |
| 6909237 | Production of stable, non-thermal atmospheric pressure rf capacitive plasmas using gases other than helium or neon The present invention enables the production of stable, steady state, non-thermal atmospheric pressure rf capacitive α-mode plasmas using gases other than helium and neon. In particular, the current invention generates and maintains stable, steady-state, non-therma... | 06/21/2005 |
| 6874675 | Method for manufacturing printed circuit board A method for manufacturing a printed circuit board includes: washing a land that corresponds to the exposed portion of a copper circuit of a printed circuit board with acidic electrolytic water having a pH of not more than 5 to remove an oxide; treating the land wit... | 04/05/2005 |
| 6805279 | Fluxless bumping process using ions A process including providing a semiconductor device including a bond pad, and an under bump metallurgy overlying the bond pad. Forming a solder structure over the under bump metallurgy, and wherein the solder structure includes an outer layer including tin oxide. P... | 10/19/2004 |
| 6732911 | Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing system There is provided a chamber open to the outside through openings through which a solder-adhered object is passed and the chamber having a heating/melting area, a carrying mechanism for carrying the solder-adhered object into the heating/melting area, a formic-acid s... | 05/11/2004 |
| 6722557 | Flux cleaning method and method of manufacturing semiconductor device An effective method for cleaning flux residues produced in process of fabricating semiconductor devices, and a method of fabricating the semiconductor devices including this cleaning method are provided. The flux cleaning method for cleaning the solder bump electrod... | 04/20/2004 |
| 6712262 | Water-soluble preflux, printed circuit board, and process for treating the surface of a metal in a printed circuit board The invention provides a water-soluble preflux that can solve problems with a soldering land array having a narrow spacing in that fused solder is likely to cause soldering bridges with defective soldering, a printed circuit board with its film formed thereon, and a... | 03/30/2004 |
| 6691912 | Methods of avoiding blowhole formation by conditioning through holes and glass A composition and method for cleaning and conditioning a non-conductive surface defined by a through hole in a printed circuit board (PCB) is disclosed. The through hole surface is contacted with the composition of the invention to provide a cleaned and c... | 02/17/2004 |
| 6666369 | Semiconductor device manufacturing method, electronic parts mounting method and heating/melting process equipment There is provided a semiconductor device manufacturing method which comprising the steps of forming solder bumps on an underlying metal film of a semiconductor device, and placing the semiconductor device and the solder layer in a reduced pressure atmosph... | 12/23/2003 |
| 6626351 | Method and apparatus for the manufacturing of structural members By utilizing a roll bonding process and appropriately forming steps, a load bearing structure is created which is capable of handling and appropriately transferring loads. One preferred method includes the combination of roll bonding and hydroforming to e... | 09/30/2003 |
| 6575354 | Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for electronic parts having the film The present invention relates to a method for producing a tin-silver alloy plating film having an excellent wettability and improved in solderability and said method comprises a step of heat treating the surface of the tin-silver alloy plating film prefer... | 06/10/2003 |
| 6572010 | Integrated solder bump deposition apparatus and method An integrated solder bump deposition method and apparatus that enables solder bumps to be lithographically formed on a substrate. The apparatus comprises a plurality of electrolyte cells, and etch/clean/passthrough station and a reflow chamber.... | 06/03/2003 |
| 6557747 | Highly gas tight chamber and method of manufacturing same A method of manufacturing a hermetically sealed chamber, including preparing two aluminum or aluminum alloy material members which face each other, forming a first extending convex portion on a surface to be metal-bonded of one of the two aluminum or alum... | 05/06/2003 |
| 6536649 | Method of preventing residue contamination of semiconductor devices during furnace processing Residue contaminates semiconductor devices during processing in a furnace. Residue contamination is prevented by removing the residue before it builds up to a point where it can contaminate semiconductor devices. Residue build-up is monitored using a resi... | 03/25/2003 |
| 6527164 | Removing flux residue from reflow furnace using active gaseous solvent A method of cleaning residue on surfaces in a reflow furnace includes introducing a solvent into the furnace chamber; reacting the solvent with the residue to form a product; and, removing the product from the furnace chamber. The solvent is gaseous, such... | 03/04/2003 |
| 6464129 | Method of diffusion bonding superalloy components A method of joining superalloy substrates together comprises diffusion bonding the superalloy substrates by depositing an activator directly on the surface of the joint to be bonded and thereafter subjecting the joint to heat and pressure. The heat and pr... | 10/15/2002 |
| 6440238 | Process for treating the surface of a component, made from a Ni based superalloy, to be coated A process for treating the surface of a component prior to coating. The component is made from a Ni based superalloy designed for high temperature service. Both the component and the coating include the elements Al and/or Cr. The process includes depletin... | 08/27/2002 |
| 6416589 | Carbon-enhanced fluoride ion cleaning A method and system for cleaning a metal article. The system is used to employ a method that comprises placing the article in a means defining a chamber; subjecting the article to a gaseous atmosphere in the means defining a chamber, where the gaseous atm... | 07/09/2002 |
| 6367687 | Method for preparing a plate rim for brazing A method is provided for treating cooperating, juxtaposed substantially uncoated alloy substrate surfaces in preparation for brazing, for example an inner wall of the radially outer open end of a turbine engine blading member with the rim of an end plate ... | 04/09/2002 |
