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| Number | Title | Issue Date |
| 8177116 | Method of bonding titanium to stainless steel A method of bonding a stainless steel part to a titanium part by heating a component assembly comprised of the titanium part, the stainless steel part, and a laminated titanium-nickel filler material placed between the two parts and heated at a temperature that is l... | 05/15/2012 |
| 8091765 | Method of bonding titanium to stainless steel A method of bonding a stainless steel part to a titanium part by heating a component assembly comprised of the titanium part, the stainless steel part, and a laminated titanium-nickel filler material placed between the two parts and heated at a temperature that is l... | 01/10/2012 |
| 7743965 | Process to deposit a protective coating on the inner wall of a tube, and notably a gun barrel produced according to this process A method for setting a protective coating on the inner wall of a tube includes providing a cylindrical sleeve, then setting on the outer surface of the sleeve a layer of a thermo fusible material, then machining the sleeve to provide it with an external diameter cor... | 06/29/2010 |
| 7353982 | Diffusion bonding for metallic membrane joining with metallic module This invention relates to a method of bonding a metallic membrane with metallic part involving pressing a smooth surface of the metallic membrane against the smooth surface of the metallic part, and heating the metallic membrane and metallic part to a temperature ab... | 04/08/2008 |
| 7331500 | Solder bumps formation using solder paste with shape retaining attribute Method of forming solder bumps of an integrated circuit package is described. A solder paste is formed from a material having a characteristic that the deposited instances thereof substantially retain their geometric shape upon exposure to electromagnetic radiation.... | 02/19/2008 |
| 7329381 | Method for fabricating a metallic article without any melting A metallic article made of metallic constituent elements is fabricated from a mixture of nonmetallic precursor compounds of the metallic constituent elements. The mixture of nonmetallic precursor compounds is chemically reduced to produce an initial metallic materia... | 02/12/2008 |
| 7261865 | Heatable honeycomb body with two different coatings An electrically heatable honeycomb body, in particular for cleaning exhaust gas originating in an internal combustion engine. The honeycomb body has at least two zones arranged in series in the flow direction with different coatings. The honeycomb body preferably ha... | 08/28/2007 |
| 7114644 | Joining method by Au-Sn brazing material The present invention provides a method of joining members to be joined by use of an Au—Sn brazing material, in which joining is performed by adjusting the composition and thickness of the Au—Sn brazing material so that the Sn content of the joint after joining ... | 10/03/2006 |
| 7108755 | Simplification of ball attach method using super-saturated fine crystal flux A method for preparing a metal surface (34) for a soldering operation is provided. In accordance with the method, the metal surface is treated with a solder flux (31) comprising a supersaturated solution of a carboxylic acid. ... | 09/19/2006 |
| 7079370 | Apparatus and method for removal of surface oxides via fluxless technique electron attachment and remote ion generation The present invention provides a method and apparatus for the dry fluxing of at least one component and/or solder surface via electron attachment. In one embodiment, there is provided a method for removing oxides from the surface of a component comprising: providing... | 07/18/2006 |
| 7048173 | Wave soldering method using lead-free solder, apparatus therefor, and wave-soldered assembly The present invention relates to a wave soldering method and a wave soldering apparatus using lead-free solder comprising a wave soldering step in which the lower side of a substrate with leads of component parts inserted in through-holes formed in the substrate fro... | 05/23/2006 |
| 6968990 | Fabrication and utilization of metallic powder prepared without melting A metallic alloy made of metallic constituent elements is fabricated and utilized by first furnishing a mixture of nonmetallic precursor compounds of the metallic constituent elements, and thereafter chemically reducing the mixture of nonmetallic precursor compounds... | 11/29/2005 |
| 6962283 | Welding method for fluorine-passivated member for welding, fluorine-passivated method after being weld, and welded parts priority data The present invention provides a welding method for materials to be welded which are subjected to fluoride passivation treatment, and a fluoride passivation retreatment method, wherein, when fluoride passivation retreatment was conducted after welding, there is no g... | 11/08/2005 |
| 6948650 | Dross removal and solder reclamation improvements When dross is removed from a molten-solder reservoir, a substantial amount of molten solder is often removed with the dross. This molten solder can be separated from the dross and returned to reservoir via a conduit for reuse. Additionally, a skimmer for removing th... | 09/27/2005 |
| 6896977 | Method of brazing aluminum or aluminum alloy materials and aluminum alloy brazing sheet A method of brazing an aluminum or aluminum alloy material, containing brazing an aluminum alloy brazing sheet that has an aluminum or aluminum alloy core material and, being clad on one or both surfaces, a filler alloy layer comprised of an Al—Si-based alloy and ... | 05/24/2005 |
| 6886736 | Method of diffusion welding of different metals in air A method of diffusion welding of different metals is accomplished while applying pressure to the butt area and homogeneous heating the butt area to about 0.8 to about 0.9 the melting point of the metals to be welded. Additional heat pulses are then supplied to the b... | 05/03/2005 |
| 6840431 | Methods of bonding two aluminum-comprising masses to one another The invention encompasses a method of bonding a first mass to a second mass. A first mass of first material and a second mass of second material are provided and joined in physical contact with one another. The first and second masses are then diffusion bonded to on... | 01/11/2005 |
| 6818988 | Method of making a circuitized substrate and the resultant circuitized substrate A circuitized substrate and a method of making the circuitized substrate is provided. The circuitized substrate includes a substrate having a conductive pad thereon. A first layer of solder enhancing material is positioned on the conductive pad, the first layer of s... | 11/16/2004 |
| 6789723 | Welding process for Ti material and Cu material, and a backing plate for a sputtering target A welding process for welding a Cu material to a Ti material includes interposing a tertiary component between the Ti material and the Cu material. The tertiary component is of a type of metal that, with Cu, forms a compound which is liquified at a temperature below... | 09/14/2004 |
| 6698647 | Aluminum-comprising target/backing plate structures The invention includes an aluminum-comprising physical vapor deposition target bonded to an aluminum-comprising backing plate to a bond strength of greater than 10,000 pounds/in2. The invention also includes a method of bonding a first aluminum... | 03/02/2004 |
| 6695201 | Stress relieved lower shell for sealed compressors A lower shell for a sealed compressor includes a shape with a plurality of intricate bends. In particular, u-shaped sections are stamped into a plainer sheet of material to form the lower shell. This stamping process can cause brittleness in the lower she... | 02/24/2004 |
| 6679417 | Tailored solutionizing of aluminum sheets An efficient and effective process for manufacturing of hardened aluminum components is achieved by coordinating the material preparation steps with the forming steps. The resulting product is a hardened aluminum component with desirable strength characte... | 01/20/2004 |
| 6666370 | Solder-dross mixture separation method and apparatus The invention provides an apparatus that separates solder from solder dross, comprising first and second rolls and a fixture. The first roll has a substantially cylindrical surface and is rotatable about a first longitudinal axis. The second roll has a su... | 12/23/2003 |
| 6579431 | Diffusion bonding of high purity metals and metal alloys to aluminum backing plates using nickel or nickel alloy interlayers An improved method for joining mating surfaces of a metallic sputter target and a backing plate of aluminum, aluminum alloy or aluminum matrix composite material to form a sputter target/backing plate assembly comprises the steps of roughening the mating ... | 06/17/2003 |
| 6568582 | Application of friction stir welding to superplastically formed structural assemblies The superplastically formed structural assembly includes first and second structural members having facing surfaces. The first and second structural members can include a first outer structural member, a second outer structural member or at least one inte... | 05/27/2003 |
| 6521108 | Diffusion bonded sputter target assembly and method of making same Low temperature diffusion bonding methods and target/backing plate assemblies bonded by the methods are disclosed. In accordance with the methods, copper and/or cobalt targets are bonded to backing plate members via the use of an interlayer selected from ... | 02/18/2003 |
| 6345756 | Defectively joined portion removal apparatus for use in a continuous hot rolling process The invention comprises a continuous hot rolling method in which a rear end portion of a preceding metal block and a fore end portion of a succeeding metal block are cut and the metal blocks are joined to each other by heating and pressing followed by a f... | 02/12/2002 |
| 6332567 | Piezoelectric element, manufacturing method thereof, and mounting apparatus of piezoelectric resonators An improved method of manufacturing a piezoelectric element and an improved piezoelectric element are provided. The improved method comprises the steps of causing a gas discharge in a predetermined discharge gas at approximately atmospheric pressure and g... | 12/25/2001 |
| 6328197 | Aerosol dispensing container and method for manufacturing same A container body is made from a composite sheet having a metal layer which has at least one side covered by a corrosion-resistant layer, such as a layer of thermoplastic. The sheet is moved under one or more high-pressure water jets which remove a strip o... | 12/11/2001 |
| 6253987 | Friction pull plug welding: top hat plug design Friction Pull Plug Welding is a solid state repair process for defects up to one inch in length, only requiring single sided tooling, or outside skin line (OSL), for preferred usage on flight hardware. The most prevalent defect associated with Friction Pu... | 07/03/2001 |
| 6248290 | Functionally gradient material and method for producing the same A functionally gradient material having desired characteristics without having any joining section is efficiently obtained by means of integration effected by a sintering treatment, the functionally gradient material comprising a metal part composition co... | 06/19/2001 |
| 6220500 | Welding method for fluorine-passivated member for welding, fluorine-passivation method after being weld, and welded parts A welding method for materials to be welded which are subjected to fluoride passivation treatment, and a fluoride passivation retreatment method, wherein, when fluoride passivation retreatment is conducted after welding, there is no generation of particle... | 04/24/2001 |
| 6199749 | Method for manufacturing a brazed metallic honeycomb body For the manufacture of a metallic honeycomb body which is wound, layered or looped from at least partially structured sheet metal layers, it is proposed to provide at least the structured sheet metal layers with a layer of rolling oil, to the extent that ... | 03/13/2001 |
| 6170734 | Method of joining silicon nitride to carbon steel This invention relates to a method of joining silicon nitride having on its surface a thin layer of active silicon metal to carbon steel, wherein the active silicon layer is formed through the thermal dissociation of silicon nitride(Si3 N4... | 01/09/2001 |
| 6161751 | Method of joining metal strip ends together using a consumable insert A method of joining the ends of metal strip material together by positioning a consumable insert of weld filler material between the full thickness of the strip ends and below the lower surface of the strip ends a predetermined depth to establish a predet... | 12/19/2000 |
| 6116493 | Flip-chip bonding parts, flip-chip bonding confirmation parts and a flip-chip bonding method So as to allow bonding precision to be confirmed on a bonding apparatus, both a confirmation substrate part and a confirmation chip part, which are flip-chip bonding confirmation parts used in the bonding of semiconductor devices that have daisy-chain typ... | 09/12/2000 |
| 6095404 | Method for assembling high temperature electronics A method for soldering electronic components capable of withstanding high temperature applications. A solder having a composition in the range between 83 and 87% lead, between 8.5 and 11.5% antimony, and the balance of tin provides superior results. The s... | 08/01/2000 |
| 6089445 | Method and device for dry fluxing of metallic surfaces before soldering or tinning The invention relates to a method for drying fluxing of a metallic surface before soldering or tinning using an alloy, according to which the surface to be fluxed is treated, at a pressure close to atmospheric pressure, with a gaseous treatment atmosphere... | 07/18/2000 |
| 6076727 | Heat exchanger and method of assembly for automotive vehicles A heat exchanger assembly includes at least one tube having an internal surface and an external surface, a composition cladding having at least lithium and magnesium applied to either one of the internal surface and external surface of the tube, and at le... | 06/20/2000 |
| 6073830 | Sputter target/backing plate assembly and method of making same This invention is directed to an improved bonded sputter target/backing plate assembly and a method of making these assemblies. The assembly includes a sputter target having side and bottom bonding surfaces bonded within a recess in an underlying backing ... | 06/13/2000 |