Quotables
"During my service in the United States Congress, I took the initiative in creating the Internet."
Al Gore ; The basis for the later misquote by US Republicans that Gore had "invented" the Internet. Gore was the leading political champion of the modern-day Internet.
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| Number | Title | Issue Date |
| 6923364 | Method for manufacturing air compressor assembly A method for manufacturing an air compressor assembly including, between a tank welding step and a final assembling step, a step of submerging a welded tank into a dip tank that contains cooling liquid treated with a corrosion inhibitor. In a preferred embodiment, i... | 08/02/2005 |
| 6913520 | All-in-one polishing process for a semiconductor wafer A semiconductor wafer has a top surface and an edge bevel surface, and a first material layer and a second material layer are respectively formed on the top surface and the edge bevel surface. A surface chemical mechanical polishing (surface CMP) process is performe... | 07/05/2005 |
| 6666369 | Semiconductor device manufacturing method, electronic parts mounting method and heating/melting process equipment There is provided a semiconductor device manufacturing method which comprising the steps of forming solder bumps on an underlying metal film of a semiconductor device, and placing the semiconductor device and the solder layer in a reduced pressure atmosph... | 12/23/2003 |
| 6575354 | Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for electronic parts having the film The present invention relates to a method for producing a tin-silver alloy plating film having an excellent wettability and improved in solderability and said method comprises a step of heat treating the surface of the tin-silver alloy plating film prefer... | 06/10/2003 |
| 6119927 | Method and apparatus for placing and attaching solder balls to substrates A method and apparatus for placing and attaching solder balls to a substrate having conductive pads in a predetermined pattern is disclosed. The substrate is placed on a carrier plate. An alignment plate having holes corresponding to the predetermined pat... | 09/19/2000 |
| 6050479 | Defluxing agent cleaning method and cleaning apparatus The defluxing agent for flux residue after soldering contains an acid (preferably an organic acid, and particularly an acid stronger than abietic acid; for example, acrylic acid, acetic acid, propionic acid, benzoic acid) and an organic solvent (for examp... | 04/18/2000 |
| 6042659 | Method of coating the seams of a welded tube An improved method of coating the welded seam of a metal tube comprising heating the weld area only of the metal tube to a first temperature which is less than the melting temperature of the protective metal coating, applying the protective metal coating ... | 03/28/2000 |
| 5988485 | Flux cleaning for flip chip technology using environmentally friendly solvents A method of assembling a substrate and die in a flip chip configuration uses a non-hazardous cleaning solvent to clean the flux residue. The non-hazardous cleaning solvent utilized is Ionox obtained from Kyzen Corporation. Optimized process parameters are... | 11/23/1999 |
| 5312027 | Precleaning of soldered circuit cards to prevent white residue Following soldering of electrical components on a circuit card in a soldering process that includes use of an aqueous-based flux, the circuit card, containing the soldered electrical components, is exposed to a dilute aqueous basic solution prior to a fin... | 05/17/1994 |
| 5035042 | Method for producing galvanized tubing An improved method of manufacturing galvanized steel tubing from steel strip having at least one galvanized surface, which surface becomes the exterior surface of the tubing is provided. In the method of the invention, after the steel strip is roll-formed... | 07/30/1991 |
| 4898318 | Copper radiator for motor cars excellent in corrosion resistance and method of manufacturing the same An improved copper radiator for motor cars comprising a plurality of tubes adapted for the flow of a heat-exchanging medium therethrough, fins bonded directly with solder to said tubes to form a copper core and wherein said core is bonded with solder to a... | 02/06/1990 |
